专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明专利

JP2008124245A Method and device for manufacturing metallized film 审中-公开
标题翻译：用于制造金属膜的方法和装置
公开(公告)号：JP2008124245A
公开(公告)日：2008-05-29
申请号：JP2006306355
申请日：2006-11-13
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： OKUNO SHIGEO
IPC分类号： H01G13/00 , H01G4/015 , H01G4/18
摘要： PROBLEM TO BE SOLVED: To restrain blur of a metal evaporation pattern.
SOLUTION: The manufacturing device of a metallized film has a metal evaporation process for forming an evaporated metal in a dielectric film and an oil mask process provided before the metal evaporation process. The oil mask process has an oil tank 14 storing oil inside a cylinder whose both ends are closed, a heater for heating the oil tank 14 and a pattern roll having a pattern wherein a mask part is formed convex in a surface. The oil tank 14 is disposed so that its cylinder axis is horizontal and has an opening part 14a on its curved surface. The opening part 14a is a slit of different widths corresponding to a mask part of the pattern roll.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：抑制金属蒸发图案的模糊。解决方案：金属化膜的制造装置具有用于在电介质膜中形成蒸发的金属的金属蒸发工艺和在金属蒸发过程之前提供的油封掩模工艺。油封处理装置具有油箱14，该油箱14将两端封闭的油缸内部储存油，加热油箱14的加热器和具有掩模部形成为凸面的图案的图案辊。油箱14被设置为使得其油缸轴线是水平的并且在其曲面上具有开口部分14a。开口部14a是与图案辊的掩模部对应的不同宽度的狭缝。版权所有（C）2008，JPO＆INPIT

52. 发明专利

JP4011797B2 Method and apparatus for manufacturing a stepped-deposited film 有权
公开(公告)号：JP4011797B2
公开(公告)日：2007-11-21
申请号：JP21743199
申请日：1999-07-30
申请人：松下電器産業株式会社
发明人：敏宏佐々木 , 茂男奥野 , 繁雄岡部
IPC分类号： H01G4/015 , H01G4/18

53. 发明专利

JP2007297712A Metallization through thin seed layer deposited using plasma 审中-公开
标题翻译：通过使用等离子体沉积的薄层组织进行金属化
公开(公告)号：JP2007297712A
公开(公告)日：2007-11-15
申请号：JP2007118362
申请日：2007-04-27
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： OLBRICH PETER , HOFFMANN GERD , KLEMM GUENTER
IPC分类号： C23C14/14 , H01G4/015 , H01G4/18
CPC分类号： C23C14/562 , C23C14/025 , C23C14/20 , H01G4/005 , H01G4/015 , H01G4/33
摘要： PROBLEM TO BE SOLVED: To provide a process and a device for producing a metallized web (3), particularly a metallized plastic web for a foil capacitor.
SOLUTION: A metal layer (17) is deposited by a vapor or gas phase. Prior to the deposition of the metal layer, a metal seed layer whose thickness is in a range of a few atoms is deposited by a plasma-activated vapor or gas phase. A plastic foil has a seed layer which is a few atoms thick and is placed between the metal layer and the plastic foil.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：解决的问题：提供用于生产金属化网（3）的方法和装置，特别是用于箔电容器的金属化塑料网。解决方案：通过蒸汽或气相沉积金属层（17）。在沉积金属层之前，通过等离子体活化的蒸汽或气相沉积厚度在几个原子范围内的金属种子层。塑料箔具有几个原子厚的种子层，并且放置在金属层和塑料箔之间。版权所有（C）2008，JPO＆INPIT

54. 发明专利

JP2007290380A Metallized biaxially oriented polypropylene film and capacitor comprised of the same 有权
标题翻译：金属化双面聚丙烯薄膜和电容器
公开(公告)号：JP2007290380A
公开(公告)日：2007-11-08
申请号：JP2007080996
申请日：2007-03-27
申请人： Toray Ind Inc , 東レ株式会社
发明人： OE TORU , MORIGUCHI ISAMU , ITO TATSUYA
IPC分类号： B32B15/085 , H01G4/015 , H01G4/18
CPC分类号： H01G4/015 , H01G4/18 , H01G4/32
摘要： PROBLEM TO BE SOLVED: To provide a metallized biaxially oriented polypropylene film and a capacitor composed of the same, the former of which has a large capacitance per volume, demonstrates outstanding high voltage resistance and security performances even under an elevated temperature atmosphere such as 80°C or more. SOLUTION: The metallized biaxially oriented polypropylene film is provided with a metallized layer on at least one surface of the biaxially oriented polypropylene film, wherein the biaxially oriented polypropylene film, made of a polypropylene resin consisting mainly of propylene, is characterized by having a base layer of satin finish irregularity on at least one of its film surface, and showing a 0.5-1.5 μm ten-point average roughness (Rz) and 90-135% surface gloss of the surface. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供金属化的双轴取向聚丙烯膜和由其组成的电容器，其前者具有大的体积电容，即使在高温气氛下也表现出优异的耐高压性和安全性能为80℃以上。解决方案：金属化双轴取向聚丙烯薄膜在双轴取向聚丙烯薄膜的至少一个表面上设置有金属化层，其中由主要由丙烯组成的聚丙烯树脂制成的双轴取向聚丙烯薄膜的特征在于具有在其至少一个膜表面上具有缎面整理不均匀的基层，并且表面的表面光泽度为0.5-1.5μm十点平均粗糙度（Rz）和90-135％。版权所有（C）2008，JPO＆INPIT

55. 发明专利

JP2007250833A Dc metallized film capacitor 有权
标题翻译：直流金属化膜电容器
公开(公告)号：JP2007250833A
公开(公告)日：2007-09-27
申请号：JP2006072342
申请日：2006-03-16
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： TOMITA MAKOTO , SAITO TOSHIHARU
IPC分类号： H01G4/015 , H01G4/18
摘要： PROBLEM TO BE SOLVED: To provide a DC metallized film capacitor with reduced reduction in capacity for solving the problem that a metal deposited electrode is insulated as an electrode on a positive pole side is anode-oxidized by moisture-resistant current test, resulting in reduction in capacity.
SOLUTION: A DC metallized film capacitor has a capacitor element around which a metallized film having metal deposition electrodes formed on a dielectric film is wound so that a pair of the metal deposition electrodes face each other via the dielectric film, and a pair of lead-out electrodes formed on both end surfaces of the capacitor element. The thickness of the metal deposition electrode formed on the metallized film on the side of the positive pole is made thicker than the metal deposition electrode formed on the metallized film on the side of a negative pole. Thus, even if anode oxidation takes place on the electrode on the positive pole side to have part of the metal deposition film insulated; most part of the metal deposition electrode remains, and therefore reduction in capacity can be extremely small.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了解决金属沉积电极在正极侧的电极绝缘的问题，为了提供减小容量的DC金属化薄膜电容器，通过耐湿电流试验进行阳极氧化，导致容量减少。解决方案：DC金属化膜电容器具有电容器元件，在该电容器元件周围缠绕形成在电介质膜上的金属沉积电极的金属化膜，使得一对金属沉积电极经由电介质膜彼此面对，并且一对形成在电容器元件的两个端面上的引出电极。形成在正极侧的金属化膜上的金属沉积电极的厚度比形成在负极侧的金属化膜上的金属沉积电极厚。因此，即使阳极氧化发生在正极侧的电极上，以使金属沉积膜的一部分绝缘; 金属沉积电极的大部分残留，因此容量的降低可以非常小。版权所有（C）2007，JPO＆INPIT

56. 发明专利

JP2007186783A System for vacuum deposition of coating on web material 审中-公开
标题翻译：用于真空沉积网状涂料的系统
公开(公告)号：JP2007186783A
公开(公告)日：2007-07-26
申请号：JP2006316856
申请日：2006-11-24
申请人： Galileo Vacuum Systems Sra , ガリレオバキュームシステムズソチエタペルアチオーニ
发明人： PAGANI ANGELO
IPC分类号： C23C14/56 , C23C14/04 , H01G4/015 , H01G4/18 , H01G13/00
CPC分类号： C23C14/562 , C23C14/042
摘要： PROBLEM TO BE SOLVED: To provide a metallization system capable of forming a metal-free area according to a pattern or under any circumstances on a continuous substrate by a simple and reliable means which is suitable for establishing the metal-free area with a high accuracy.
SOLUTION: The system for vacuum deposition of a coating on a web material N comprises: a feed path of the web material; a process roller 19 for guiding the web material; associated with the process roller, at least one evaporation source of a material for forming the coating; and an applicator unit 51 for applying a masking agent to the web material according to a pre-established pattern. The applicator unit comprises a printing cylinder 53, which cooperates with a distributor cylinder 55 of the masking agent, and a source 57 of masking agent. The applicator unit 51 is equipped with adjusting means 73 at its side. The adjusting means 73 are located separately from each other to adjust the position of the applicator unit 51 with respect to the process roller 19.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种金属化系统，其能够通过简单可靠的方式根据图案或在任何情况下在连续基板上形成无金属区域，其适合于建立无金属区域高精度。解决方案：用于在卷材材料N上真空沉积涂层的系统包括：幅材材料的进料路径; 用于引导网状材料的加工辊19; 与处理辊相关联，用于形成涂层的材料的至少一个蒸发源; 以及用于根据预先建立的图案将掩蔽剂施加到网状材料的施用单元51。涂抹器单元包括与掩蔽剂的分配器筒55配合的印刷滚筒53和掩蔽剂的源57。施用单元51在其侧面配备有调节装置73。调节装置73彼此分开设置，以调节涂布器单元51相对于处理辊19的位置。版权所有：（C）2007，JPO＆INPIT

57. 发明专利

JP2006286988A Metallization film capacitor 审中-公开
标题翻译：金属化膜电容器
公开(公告)号：JP2006286988A
公开(公告)日：2006-10-19
申请号：JP2005105389
申请日：2005-03-31
申请人： Nippon Chemicon Corp , 日本ケミコン株式会社
发明人： TAKAHASHI HARUYUKI , IGARASHI YUKIO , YAMADA YOSHINORI
IPC分类号： H01G4/18 , H01G4/015 , H01G4/32
摘要： PROBLEM TO BE SOLVED: To enhance self recovery function and security function at the time of dielectric breakdown of a film capacitor.
SOLUTION: As a metallization film having a metal deposition electrode on one surface, provided with a margin portion at one end on one side in width direction and further having a heavy edge portion, first slits (region dividing slits) not deposited with metal are formed from the margin portion to the heavy edge portion in the width direction of the film, and second slits (fuse function slits) shorter than the first slits (region dividing slits) are provided continuously to the margin portion. Two sheets of metallization film are placed in layers and wound such that the heavy edge portion and the fuse function slit of adjacent metallization films oppose each other thus producing a metallization film capacitor.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提高薄膜电容器的介质击穿时的自恢复功能和安全功能。解决方案：作为在一个表面上具有金属沉积电极的金属化膜，在宽度方向的一侧上的一端设置有边缘部分，并且还具有重的边缘部分，未沉积有第一狭缝（区域划分狭缝）在膜的宽度方向上从边缘部分到重边缘部分形成金属，并且连续地向边缘部分提供比第一狭缝（区域划分狭缝）短的第二狭缝（保险丝功能狭缝）。将两片金属化膜层叠并卷绕，使得相邻金属化膜的重边缘部分和熔丝功能狭缝彼此相对，从而产生金属化薄膜电容器。版权所有（C）2007，JPO＆INPIT

58. 发明专利

JP2005515627A Film, and a method of manufacturing the same as an insulator in the capacitor 审中-公开
公开(公告)号：JP2005515627A
公开(公告)日：2005-05-26
申请号：JP2003560941
申请日：2003-01-09
申请人：バイエル・マテリアルサイエンス・アクチェンゲゼルシャフトBayer MaterialScience AG
发明人：クラウス・マイヤー , ハンス−レオ・ヴェーバー , ペーター・ビーア
IPC分类号： H01G4/18 , C08G64/00 , C08J5/18 , H01G4/015 , H01G4/06 , H01G4/14
CPC分类号： H01G4/015
摘要：本発明は、自動封止特性を有するコンデンサにおける絶縁体として使用するためのフィルム、および前記フィルムを製造するための方法に関する。

59. 发明专利

JP2004119913A Film capacitor and its manufacturing method 有权
公开(公告)号：JP2004119913A
公开(公告)日：2004-04-15
申请号：JP2002284648
申请日：2002-09-30
申请人： Nichicon Corp , ニチコン株式会社
发明人： KUBO YASUHIRO , ADACHI TOMOYA , MORI TAKASHI
IPC分类号： H01G4/18 , H01G4/015
摘要： PROBLEM TO BE SOLVED: To improve a current resistance characteristic of a film capacitor of an exterior cladding-less surface packaging type and solder heat resistance property, and reduce the cost.
SOLUTION: A first external electrode comprising first and second metalicon layers is provided on both end surfaces of a capacitor element where a pair of metallized films are overlapped and wound, and a later winding plastic film is overlapped and wound, and a plate-shaped second external electrode having an inverted U-shaped opening, C-shaped opening or 4 rectangular or drum-shaped opening is joined with the first external electrode. A ratio of an area of an opening of a plate shaped terminal of the second external electrode and an area of a metalicon surface side is 0.05 to 0.35. The first metalicon layer comprises any of an alloy consisting of Al of 40 to 56 % and Si of 4% or more and Zn of 40 % or more, an alloy consists of Zn of 90 % or more and remaining Al, an alloy consisting of Cu of 60 to 70 % and remaining Zn or single Zn, and a second metalicon layer consists of Sn of 80 % or more and remaining Zn and Cu.
COPYRIGHT: (C)2004,JPO

60. 发明专利

JP2004095605A Metallized film capacitor and its manufacturing method, and inverter apparatus using the same 有权
公开(公告)号：JP2004095605A
公开(公告)日：2004-03-25
申请号：JP2002250889
申请日：2002-08-29
申请人： Matsushita Electric Ind Co Ltd , 松下電器産業株式会社
发明人： SAITO TOSHIHARU , TAKEOKA HIROKI , SHIODA KOHEI
IPC分类号： H01G4/18 , H01G4/015
CPC分类号： H01G4/32 , H01G4/015 , H01G4/145 , H01G4/18 , Y02T10/7022
摘要： PROBLEM TO BE SOLVED: To provide a metallized film capacitor which generates less heat and has a high self-protection capability in use for high voltage and high ripple current. SOLUTION: A single-sided metallized polypropylene film 8 has a pattern consisting of divided electrodes 3 and 4 which are formed of evaporated metal and have either a nearly rhombic shape or triangular shape surrounded by non-evaporated slits 2, and fuse sections 5 which are located in at least one position on each side of each divided electrode to connect the divided electrodes. A single-sided metallized polypropylene film 9 has evaporated metal nearly on the whole surface of one face. The films 8 and 9 are stacked and wound, and sputtered metal electrodes 10 are formed on both end faces of the wound body to form the metallized film capacitor. The fuse sections are formed near the vertices of each rhombus to realize the metallized film capacitor having a small increase in temperature and a high-performance inverter apparatus. COPYRIGHT: (C)2004,JPO

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式