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    • 55. 发明专利
    • Method for cutting resin films
    • 切割树脂膜的方法
    • JP2014069295A
    • 2014-04-21
    • JP2012218772
    • 2012-09-28
    • Dainippon Printing Co Ltd大日本印刷株式会社
    • TAKAHASHI TOSHIYUKI
    • B26D3/00B26D1/08
    • PROBLEM TO BE SOLVED: To provide a method for cutting resin films, in which generation of cracks, chips, and the like can be remarkably reduced.SOLUTION: A method for cutting a resin film in which the resin film is cut with a cutting blade is provided, the method comprising a cutting step for conducting the cutting of the resin film in a state in which an auxiliary film is placed on a position where the cutting is planned to be conducted, the position being on the surface of the cutting blade side of the resin film. An elongation rate, in compliance with JIS K 7127(1999), of the auxiliary film is higher than that of the resin film.
    • 要解决的问题:提供一种切割树脂膜的方法,其中可以显着降低裂纹,碎屑等的产生。解决方案:一种用切割刀片切割树脂膜的树脂膜的切割方法 所述方法包括:切割步骤,用于在将辅助膜放置在所述切割被计划进行的位置的状态下进行所述树脂膜的切割,所述切割步骤在所述切割刀片侧的表面上 的树脂膜。 根据JIS K 7127(1999),辅助膜的伸长率高于树脂膜的伸长率。