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51. 发明专利

JP2003282307A Polymer ptc composition and polymer ptc device using the same 审中-公开
标题翻译：聚合物PTC组合物和使用其的聚合物PTC装置
公开(公告)号：JP2003282307A
公开(公告)日：2003-10-03
申请号：JP2002082681
申请日：2002-03-25
申请人： Nec Tokin Corp , Necトーキン株式会社
发明人： KATAOKA MITSUMUNE , SEKI DAISUKE
IPC分类号： C08J5/18 , C08K3/14 , C08L9/00 , C08L101/00 , H01C7/02
摘要： PROBLEM TO BE SOLVED: To provide a polymer PTC device which is restrained from increasing its resistance after it carries out a switching operation repeatedly to improve its reliability, wherein the polymer PTC device is composed of a sheet-like molded body formed of a polymer PTC composition, comprising a crystalline polymer and conductive powder mixed and dispersed into the crystalline polymer and electrodes which are each provided on the surfaces of the molded body.
SOLUTION: Butadiene rubber and ethane dithiol are added to the polymer PTC composition so as to restrain the polycrystalline polymer serving a matrix of the polymer PTC composition from deteriorating by oxidation, and to improve the shape retention properties of the polymer PTC device by crosslinking butadiene rubber.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：提供一种聚合物PTC装置，其在重复进行开关操作以抑制其阻力增加以提高其可靠性之后，其中聚合物PTC装置由片状成型体聚合物PTC组合物，其包含结晶聚合物和混合并分散在结晶聚合物中的导电粉末和分别设置在成型体表面上的电极。解决方案：将丁二烯橡胶和乙烷二硫醇加入到聚合物PTC组合物中，以便限制用于聚合物PTC组合物的基质的多晶聚合物通过氧化而劣化，并且通过以下方式改善聚合物PTC装置的形状保持性：交联丁二烯橡胶。版权所有（C）2004，JPO

52. 发明专利

JP2003086403A POLYMERIC PTC ELEMENT 审中-公开
公开(公告)号：JP2003086403A
公开(公告)日：2003-03-20
申请号：JP2001272138
申请日：2001-09-07
申请人： NEC TOKIN CORP
发明人： SAKAMOTO SHINICHI , SAWADA KATSUMI
IPC分类号： C08K3/14 , C08L101/00 , H01C7/02
摘要： PROBLEM TO BE SOLVED: To provide a polymeric PTC element, that is manufactured by a coating method, is stabilized in characteristics, and can be mass-produced efficiently using the coating method. SOLUTION: This polymeric PTC element (10) is provided with a resin composition 2 containing conductive powder 3, and a crystalline resin 4 and is used for an overcurrent protective element which prevents an overcurrent flowing into a battery, the circuit of electronic equipment, etc., when abnormalities occur. The resin component 2 contains at least one kind of PVdF (polyvinylidene fluoride) resin.

53. 发明专利

JP2002069375A COMPOSITION FOR FILM FORMATION AND MATERIAL FOR FORMING INSULATING FILM 失效
公开(公告)号：JP2002069375A
公开(公告)日：2002-03-08
申请号：JP2000257537
申请日：2000-08-28
申请人： JSR CORP
发明人： NISHIKAWA MICHINORI , YAMADA KINJI
IPC分类号： C08K3/14 , C08L83/04 , C09D5/25 , C09D183/02 , C09D183/04 , C09D183/14 , H01B3/46 , H01L21/312
摘要： PROBLEM TO BE SOLVED: To obtain a composition for film formation that exhibits a low relative dielectric constant as a layer insulation material in semiconductor elements and has excellent mechanical strengths and resistance to chemical mechanical polishing(CMP) and obtain a material for forming insulating film. SOLUTION: The objective composition for film formation comprises (A) a condensate that is obtained by hydrolyzing and condensing at least one selected from the group consisting of the compounds of the following general formulas (1), (2) and (3), (B) silicon carbide and (C) organic solvent: RaSi(OR1)4-a...(1) Si(OR2)4...(2) R3b(R4O)3-bSi-(R7)d-Si(OR5)3-cR6c...(3) (wherein R is H atom, F atom or a monovalent organic group; R1 to R6 are each a monovalent organic group; R7 is an oxygen atom, a phenylene group or -(CH2)n-; a is an integer of 1-2; b and c are each a number of 0-2; d is 0 or 1 and n is an integer of 1-6).

54. 发明专利

JP2001342356A PLASTIC MOLDED PRODUCT AND PRODUCT USING THE SAME 失效
公开(公告)号：JP2001342356A
公开(公告)日：2001-12-14
申请号：JP2000164185
申请日：2000-06-01
申请人： TOPPAN PRINTING CO LTD
发明人： OBA YASUSHI , GOCHO SATOSHI
IPC分类号： B43K3/00 , C08J5/00 , C08K3/10 , C08K3/14 , C08K3/16 , C08K3/22 , C08K3/28 , C08K3/30 , C08L67/04 , C08L101/00 , C08L101/16
摘要： PROBLEM TO BE SOLVED: To provide a plastic molded product having an improved decorative effect which reversibly exerts distinctively different colors corresponding to a simple light source, and a product using the same. SOLUTION: The plastic molded product contains a lanthanide rare earth compound.

55. 发明专利

JP2000143808A HEAT CONDUCTIVE, ELECTRICAL INSULATING SILICONE GEL COMPOSITION 失效
公开(公告)号：JP2000143808A
公开(公告)日：2000-05-26
申请号：JP32662898
申请日：1998-11-17
申请人： FUJI POLYMER IND
发明人： FUNAHASHI HAJIME
IPC分类号： C08K3/14 , C08G77/04 , C08K3/22 , C08K3/28 , C08K3/34 , C08K3/38 , C08K9/00 , C08L83/04
摘要： PROBLEM TO BE SOLVED: To provide a heat conductive, electrical insulating silicone gel composition having a high heat conductivity, by adding a filler, treated with a nitride or carbide, to a silicone gel to cure the silicone gel. SOLUTION: The titled composition is a compound having a composition comprising, against 100 pts.wt. silicone gel, from 5 to 500 pts.wt. component A: a nitride or carbide which is surface-coated to prevent inhibition of the curing reaction of the silicone gel, from 0 to 120 pts.wt. component B: a basic metal oxide having a specific surface area of 1.0 m2/g or smaller and an average particle size of from 10 to 100 μm, from 0 to 500 pts.wt. component C: a reinforcing agent and from 0 to 20 pts.wt. component D: a crosslinking agent, wherein the heat conductivity of a molded part after curing is 1.0 W/m.K or larger, the volume resistivity is 109 Ω.cm or larger and the hardness (ASKER C) of the molded part is from 10 to 95 degrees.

56. 发明专利

JP2687375B2 失效
公开(公告)号：JP2687375B2
公开(公告)日：1997-12-08
申请号：JP29158587
申请日：1987-11-17
IPC分类号： C08K3/14 , C08G59/00 , C08K3/10 , C08K3/22 , C08L63/00 , C08L101/00 , H01B3/00

58. 发明专利

JPH08257918A GRINDING WHEEL MANUFACTURED OF FILLER,ADDITIVE AND HEAT RESISTANT MOLDING MATERIAL CONTAINING CARBON FORMATION BINDING AGENT 失效
公开(公告)号：JPH08257918A
公开(公告)日：1996-10-08
申请号：JP32329895
申请日：1995-12-12
申请人： BAKELITE AG
发明人： ARUNO GARUTOTSUIIRA , KAARUUHAINTSU SHIYUBUIIGAA , PEETAA AADORUFUSU , YOOZEFU ZUUREN
IPC分类号： B24D3/02 , B24D3/28 , B24D3/34 , C04B35/00 , C04B35/01 , C04B35/632 , C04B35/66 , C08J5/14 , C08K3/14 , C08K3/40 , C08K7/04 , C08K7/14 , C08L61/04 , C08L61/10 , C09K3/14 , F16D69/02 , F27D1/00
摘要： PROBLEM TO BE SOLVED: To provide a grinding wheel manufactured out of a heat resistant molding material containing a carbon forming bonding agent, free of solvents and economical in spite of having quantitatively high value. SOLUTION: In the case of a grinding wheel manufactured out of heat resistant molding material containing customary filler, additive and a carbon forming bonding agent containing 1-20 wt.% of a hardner to the weight of novolac, the filler is selected from a group comprising corundum carbide and silicon carbide, or the additive is selected from a group comprising cryolite, iron pyrite, boron fluoride, zinc sulfide and antimony anhydride. Bending strength of 93 N/mm is therefore obtained.

60. 发明专利

JPH0253458B2 失效
公开(公告)号：JPH0253458B2
公开(公告)日：1990-11-16
申请号：JP27241586
申请日：1986-11-15
申请人： KURASAWA OPTICAL IND
发明人： KURASAWA MORIO
IPC分类号： G02B1/04 , C08J3/20 , C08K3/08 , C08K3/14 , C08K3/22 , C08K3/28 , C08L33/04 , C08L33/12

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