专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

51. 发明专利

JP2010153729A Printed circuit board and method for manufacturing the same, and method of connecting the same 有权
标题翻译：印刷电路板及其制造方法及其连接方法
公开(公告)号：JP2010153729A
公开(公告)日：2010-07-08
申请号：JP2008332676
申请日：2008-12-26
申请人： Fujikura Ltd , 株式会社フジクラ
发明人： ITO SHOJI , KITADA TOMOHITO , OMINATO TADANORI
IPC分类号： H05K1/14 , H05K3/28
CPC分类号： H05K3/4015 , B29C65/48 , B29C65/4815 , B29C65/483 , B29C65/5057 , B29C66/1122 , B29C66/43 , B29C66/472 , B29C66/474 , B29C66/8322 , B29K2027/18 , B29K2063/00 , B29K2077/10 , B29K2079/08 , B29K2101/12 , B29K2105/0079 , B29K2305/10 , B29K2305/14 , B29K2995/0005 , B29L2009/003 , B29L2031/3425 , H01L2224/2929 , H01L2224/293 , H01L2224/83851 , H05K3/281 , H05K3/305 , H05K3/361 , H05K2201/0221 , H05K2201/10234 , H05K2201/10977 , H05K2203/041 , H05K2203/1189 , Y10T156/10
摘要： PROBLEM TO BE SOLVED: To provide a printed circuit board that prevents respective conductive circuits from getting crossed and connects the respective conductive circuits each other effectively, to provide a method of manufacturing the same, and to provide a method of connecting the same. SOLUTION: The printed circuit board 10 includes an insulation substrate 11, a conductor circuit 12 formed on one surface 11a of the insulation substrate 11, a cover layer 13 formed so as to cover the insulation substrate 11 and the conductor circuit 12, and a conductive particle 14 buried in the cover layer 13, wherein the conductive particle 14 comes into contact with the conductor circuit 12 and is buried in the cover layer 13 so as to project from the cover layer 13. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够有效地防止各导电电路越过并连接各导电电路的印刷电路板，以提供其制造方法，并提供一种连接该导电电路的方法。解决方案：印刷电路板10包括绝缘基板11，形成在绝缘基板11的一个表面11a上的导体电路12，形成为覆盖绝缘基板11和导体电路12的覆盖层13，以及埋在覆盖层13中的导电粒子14，其中导电粒子14与导体电路12接触并被掩埋在覆盖层13中以从覆盖层13突出。版权所有：（C ）2010，JPO＆INPIT

52. 发明专利

JP4351939B2 Multilayer wiring substrate and a method of manufacturing the same 有权
公开(公告)号：JP4351939B2
公开(公告)日：2009-10-28
申请号：JP2004088236
申请日：2004-03-25
申请人：ソニーケミカル&インフォメーションデバイス株式会社
发明人：正直渡辺
IPC分类号： H05K1/14 , H05K3/46 , H05K3/36
CPC分类号： H05K3/462 , H05K3/4623 , H05K2201/09536 , H05K2201/096 , H05K2201/10234 , H05K2203/1189

53. 发明专利

JP2009533886A Bulk metallic glass solder, foamed bulk metallic glass solder, foaming solder bonding pad of the chip package, a method of assembling the system, including, and it 有权
公开(公告)号：JP2009533886A
公开(公告)日：2009-09-17
申请号：JP2009506819
申请日：2007-06-12
申请人：インテル・コーポレーション
发明人：スー、デウーン , ミン、ヨンキ
IPC分类号： H01L21/60 , H01L23/12
CPC分类号： H01L24/10 , C22C45/10 , H01L23/49816 , H01L24/13 , H01L24/81 , H01L2224/05567 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/8121 , H01L2224/81815 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/351 , H05K1/09 , H05K1/111 , H05K3/3436 , H05K2201/0116 , H05K2201/10234 , Y02P70/613 , H01L2924/00 , H01L2224/05599
摘要：【課題】バルク金属ガラスハンダ、発泡バルク金属ガラスハンダ、チップパッケージ内の発泡ハンダボンディングパッド、そのアセンブル方法、およびそれを含むシステムを提供する。
【解決手段】発泡バルク金属ガラス電気接続部が集積回路パッケージの基板に形成される。発泡バルク金属ガラス電気接続部は率が低く、衝撃荷重および動的荷重による亀裂に対する耐性を持つ。発泡バルク金属ガラス電気接続部は、集積回路デバイスと外部構造との間で通信を行うためのハンダバンプとして使用され得る。発泡バルク金属ガラス電気接続部を形成するプロセスは、バルク金属ガラスと発泡剤とを混合することを含む。
【選択図】図１

54. 发明专利

JP2009129951A Method of forming conductive bumps 有权
标题翻译：形成导电气体的方法
公开(公告)号：JP2009129951A
公开(公告)日：2009-06-11
申请号：JP2007300149
申请日：2007-11-20
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： SAKAGUCHI HIDEAKI , HIGASHI MITSUTOSHI
IPC分类号： H01L21/60 , H05K3/34
CPC分类号： H05K3/3478 , H01L21/4853 , H01L21/6835 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/05001 , H01L2224/05009 , H01L2224/05567 , H01L2224/0557 , H01L2224/11002 , H01L2224/11003 , H01L2224/111 , H01L2224/11334 , H01L2224/11822 , H01L2224/11901 , H01L2224/13022 , H01L2224/13099 , H01L2224/131 , H01L2224/16 , H01L2224/81193 , H01L2224/81801 , H01L2924/0001 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H05K2201/10234 , H05K2203/041 , H05K2203/043 , H05K2203/1476 , H01L2224/05599 , H01L2224/05099
摘要： PROBLEM TO BE SOLVED: To provide a method of forming a conductive bump that forms a conductive bump with an enough height on a connection pad within an opening in a protection insulating layer in high reliability even if a pitch of a connection pad of a wiring board is narrowed. SOLUTION: A method of forming a conductive bump includes the steps of; preparing a substrate 1 including a connection pad C1 and a protection insulating layer 18 with the opening 18a provided thereon, on a surface layer side; arranging a first conductive ball 30, at least an outer surface portion of which is made of solder, on the connection pad C1 in the opening 18a of the protection insulating layer 18; filling a solder layer 32 in the opening 18a by applying a reflow heating to the first conductive ball 30; arranging a second conductive ball 50 on the solder layer 32; and obtaining a conductive bump B which protrudes from an upper surface of the protection insulating layer 18, by joining the solder layer 32 and the second conductive ball 50 by a reflow heating. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种形成导电凸块的方法，该导电凸块在保护绝缘层的开口内的连接焊盘上形成具有足够高度的导电凸块，其高可靠性即使是连接焊盘的间距，接线板变窄。解决方案：形成导电凸块的方法包括以下步骤：在表面层侧准备包括连接焊盘C1和保护绝缘层18的基板1，其中设置有开口18a; 在保护绝缘层18的开口18a中的连接焊盘C1上布置至少其外表面部分由焊料制成的第一导电球30; 通过向第一导电球30施加回流加热来在开口18a中填充焊料层32; 在焊料层32上布置第二导电球50; 并且通过回流加热来接合焊料层32和第二导电球50，获得从保护绝缘层18的上表面突出的导电凸块B. 版权所有（C）2009，JPO＆INPIT

55. 发明专利

JPWO2006025139A1 回路基板とその製造方法及びこれを用いた電子部品审中-公开
公开(公告)号：JPWO2006025139A1
公开(公告)日：2008-05-08
申请号：JP2006531290
申请日：2005-06-01
申请人：松下電器産業株式会社
发明人：光行木村 , 光行木村
IPC分类号： H05K1/11 , H01L23/02 , H05K3/40
CPC分类号： H03H9/1021 , H01L2924/16152 , H03H3/02 , H05K3/4046 , H05K3/42 , H05K2201/10234 , H05K2203/049
摘要：薄型化が可能な上、製造コストの低減が可能な回路基板とその製造方法、及びこれを用いた気密性の向上が可能な電子部品を提供する。絶縁基板(10)と、絶縁基板(10)の厚さ方向に形成された、絶縁基板(10)の第1主面(10a)と絶縁基板(10)の第2主面(10b)とを接続するためのスルーホール(11)と、スルーホール(11)の内壁と第1及び第2主面(10a,10b)におけるスルーホール(11)の開口部周囲とに形成された導電膜(12)と、スルーホール(11)に充填され、かつ導電膜(12)と接合する金属部材(14)とを含む回路基板(1)とする。

56. 发明专利

JPWO2005091313A1 電子部品有权
公开(公告)号：JPWO2005091313A1
公开(公告)日：2008-02-07
申请号：JP2006511132
申请日：2005-01-21
申请人：箕輪興亜株式会社
发明人： ▲高▼山　利治 , 利治 ▲高▼山 , 隆介鈴木 , 隆介鈴木 , 健文中森 , 健文中森
IPC分类号： H05K1/18 , H01C1/14 , H01C1/144 , H01C13/02 , H01L21/60 , H01L23/498 , H05K1/11 , H05K3/34
CPC分类号： H01C1/16 , H01C1/144 , H01C13/02 , H01G4/40 , H01L23/49816 , H01L24/11 , H01L24/12 , H01L24/16 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01044 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/351 , H05K1/111 , H05K3/3436 , H05K2201/094 , H05K2201/10045 , H05K2201/10234 , Y02P70/613 , H01L2924/00
摘要：基板(1)の一方の面に複数の回路素子及び導電性突起(9)からなる当該回路素子の外部端子を有する電子部品において、実装後に外力に耐え得る構造とする。そこで単体の回路素子は、対となる電極(2)と、当該電極(2)に接触する抵抗体(3)又は誘電体を構成要素とし、当該電極(2)の一部をランド(4)として露出させつつ前記回路素子がオーバーコート(7)により被覆され、前記導電性突起(9)は固着部材を含み、当該固着部材により前記ランド(4)に固着され、前記ランド(4)のうち少なくとも3つのランド(4b)が他のランド(4a)よりも面積が大きく、前記面積の大きいランド(4b)にのみ導電性突起(9)が固着された場合に当該導電性突起(9)と平地とが接触した状態で電子部品が自立可能であり、全ての導電性突起(9)が実質的に同一寸法の導電性ボール(10)とランド(4)全面との固着で形成されることとする。

57. 发明专利

JP2007305774A Substrate with built-in electronic component and its manufacturing method 有权
标题翻译：带有内置电子元件的基板及其制造方法
公开(公告)号：JP2007305774A
公开(公告)日：2007-11-22
申请号：JP2006132497
申请日：2006-05-11
申请人： Shinko Electric Ind Co Ltd , 新光電気工業株式会社
发明人： OI ATSUSHI
IPC分类号： H05K3/46 , H01L23/12 , H01L25/00
CPC分类号： H05K3/4046 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/16 , H01L24/24 , H01L24/82 , H01L25/16 , H01L2224/16225 , H01L2224/24226 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/12042 , H01L2924/15331 , H01L2924/19041 , H01L2924/19105 , H05K1/185 , H05K3/4644 , H05K2201/0221 , H05K2201/096 , H05K2201/10234 , H01L2224/29099 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a substrate with a built-in electronic component which has a structure capable of establishing interlayer connection by easily burying a conductive body into via hole formed at an insulating layer of a thick film into which the electronic component is buried. SOLUTION: Electronic components 41, 42 and 43 are mounted to a body 5 to be mounted which has a first wiring layer 12, while the electronic components 41, 42 and 43 are buried into an insulating layer 25, and a conductive ball 30 is arranged so as to penetrate the insulating layer 25 and connected to the first wiring layer 12 electrically. A second wiring layer 14 connected electrically to the conductive ball 30 is formed on the insulating layer 25, whereby the interlayer connection of the first wiring layer 12 and the second wiring layer 14 is established through the conductive ball 30. COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：为了提供具有内置电子部件的基板，其具有能够通过容易地将导电体埋入形成在厚膜的绝缘层上的通孔中来建立层间连接的结构，其中电子组件被埋。解决方案：电子部件41,42和43安装到安装的主体5上，该主体5具有第一布线层12，而电子部件41,42和43被埋入绝缘层25中，并且导电球 30被布置成穿过绝缘层25并且电连接到第一布线层12。在绝缘层25上形成与导电球30电连接的第二布线层14，由此通过导电球30建立第一布线层12和第二布线层14的层间连接。版权所有： C）2008，JPO＆INPIT

58. 发明专利

JP3880966B2 Anti-friction-type flat flexible cable 有权
公开(公告)号：JP3880966B2
公开(公告)日：2007-02-14
申请号：JP2004016063
申请日：2004-01-23
申请人：トランスパシフィック・プラズマ,リミテッド・ライアビリティ・カンパニー
发明人：建國管 , 益元蔡 , 錫裕陳
IPC分类号： H01B7/08 , G03B27/50 , H02G11/00 , H04N1/04 , H05K1/00
CPC分类号： H05K1/028 , H02G11/006 , H05K2201/10234 , H05K2201/1028 , H05K2203/159
摘要： An anti-abrasive flat flexible cable applied to a flatbed scanner is provided to avoid abrasion occurring between the flat flexible cable and a platform of the flatbed scanner. The anti-abrasive flat flexible connected between a circuit board and a carriage of the flatbed scanner bends differentially with the forward or backward movement of the carriage under the platform. It includes a flexible main body connected to the circuit board and the carriage respectively for transmitting electric signals between the circuit board and the carriage; and a weighting object arranged on a portion of the flexible main body, which is possibly to be bent during the movement of the carriage, for pulling the main flexible body away from the platform so as to avoid abrasion.

59. 发明专利

JP2007026654A Bonding structure for head gimbal assembly and flexible print circuit 审中-公开
标题翻译：头部组件和柔性打印电路的结合结构
公开(公告)号：JP2007026654A
公开(公告)日：2007-02-01
申请号：JP2006243821
申请日：2006-09-08
申请人： Shinka Jitsugyo Kk , 新科實業有限公司SAE Magnetics(H.K.)Ltd.
发明人： SHIRAISHI MASASHI , YAGI ICHIRO
IPC分类号： G11B5/60 , G11B21/02 , G11B21/21 , H05K1/14 , H05K3/32 , H05K3/36
CPC分类号： H05K3/361 , G11B5/4846 , H05K1/056 , H05K3/243 , H05K3/323 , H05K3/4007 , H05K3/4015 , H05K2201/0367 , H05K2201/10234
摘要： PROBLEM TO BE SOLVED: To solve the problem of an open circuit in the case that parts in HGA provided with a slider and an FPC are connected to each other using anisotropic conductive adhesive. SOLUTION: This is bonding structure of at least one bonding pad and an FPC on a suspension of an HGA used in a hard disk apparatus, the FPC is provided with a base film, a conductive layer positioned under the base film, and a overcoat layer positioned under the conductive layer, while a bottom plane is not superposed on an upper plane of at least one bonding pad at the time of connection, the conductive layer of the FPC is connected and fixed directly to at least one bonding pad by anisotropic conductive adhesive such as ACF. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了解决在使用各向异性导电粘合剂将具有滑块和FPC的HGA中的部件彼此连接的情况下的开路问题。解决方案：这是在硬盘装置中使用的HGA的悬架上的至少一个焊盘和FPC的接合结构，FPC设置有基膜，位于基膜下的导电层，以及位于导电层下方的覆层，而在连接时底面不叠置在至少一个接合焊盘的上平面上的情况下，FPC的导电层被直接连接固定在至少一个焊盘上各向异性导电粘合剂如ACF。版权所有（C）2007，JPO＆INPIT

60. 发明专利

JP2005277112A Multilayer wiring board and its manufacturing method 有权
标题翻译：多层接线板及其制造方法
公开(公告)号：JP2005277112A
公开(公告)日：2005-10-06
申请号：JP2004088236
申请日：2004-03-25
申请人： Sony Chem Corp , ソニーケミカル株式会社
发明人： WATANABE MASANAO
IPC分类号： H05K1/14 , H05K3/36 , H05K3/46
CPC分类号： H05K3/462 , H05K3/4623 , H05K2201/09536 , H05K2201/096 , H05K2201/10234 , H05K2203/1189
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board which can be manufactured effectively in a small number of processes, in a short time, and can realize reduction in a cost without using an expensive material or the like, and to provide its manufacturing method.
SOLUTION: First and second both-sided wiring boards 10a, 10b provided with connection terminal layers 5a, 5b of a wiring pattern in the edge of through-holes 4a, 4b are prepared. The first and second both-sided wiring boards 10a, 10b are disposed so that the through-holes 4a, 4b face each other. An insulating adhesive is disposed between the first and second both-sided wiring boards 10a, 10b. The connection terminal layers 5a, 5b of the first and second both-sided wiring boards 10a, 10b are electrically connected by compressive bonding with conductive particle 11 held by the edge part of each of the through-holes 4a, 4b.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种能够在短时间内以少量工艺有效地制造的多层布线板，并且可以在不使用昂贵的材料等的情况下实现成本的降低，并且提供其制造方法。解决方案：准备在通孔4a，4b的边缘设置有布线图形的连接端子层5a，5b的第一和第二双面布线板10a，10b。第一和第二双面布线板10a，10b设置成使得通孔4a，4b彼此面对。绝缘粘合剂设置在第一和第二双面布线板10a，10b之间。第一和第二双面布线板10a，10b的连接端子层5a，5b通过与由每个通孔4a，4b的边缘部分保持的导电粒子11进行压接而电连接。版权所有（C）2006，JPO＆NCIPI

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式