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    • 51. 发明专利
    • Mask for vapor deposition, manufacturing method of mask for vapor deposition, electronic element, and manufacturing method of electronic element
    • 蒸发沉积掩模,蒸发沉积掩模的制造方法,电子元件和电子元件的制造方法
    • JP2013021165A
    • 2013-01-31
    • JP2011153872
    • 2011-07-12
    • Sony Corpソニー株式会社
    • HIRAI CHOICHI
    • H01L21/285C23C14/04H01L21/336H01L29/786H01L51/05
    • C23C14/042C23C14/044H01L51/0011
    • PROBLEM TO BE SOLVED: To provide a mask for vapor deposition which enables a vapor-deposited film to be formed with a high definition pattern.SOLUTION: A mask for vapor deposition includes: a substrate having one or multiple first openings; and a polymer film provided on the first main surface side of the substrate and having one or multiple second openings so as to face each first opening. During the vapor deposition, vapor deposition materials pass through the first opening and the second opening and thereby forming a vapor deposited film with a predetermined pattern corresponding to the second opening. The combined use of the substrate and the polymer film realizes finer and more accurate opening shape in the second opening while maintaining mechanical strength compared to the case where the mask is formed by a metal film.
    • 要解决的问题:提供一种能够以高清晰度图案形成气相沉积膜的气相沉积掩模。 解决方案:用于气相沉积的掩模包括:具有一个或多个第一开口的基底; 以及设置在所述基板的所述第一主表面侧上并且具有面对每个第一开口的一个或多个第二开口的聚合物膜。 在气相沉积期间,气相沉积材料通过第一开口和第二开口,从而形成具有对应于第二开口的预定图案的气相沉积膜。 与通过金属膜形成掩模的情况相比,基板和聚合物膜的组合使用在第二开口中实现更精细和更精确的开口形状,同时保持机械强度。 版权所有(C)2013,JPO&INPIT
    • 56. 发明专利
    • Method for manufacturing semiconductor device
    • 制造半导体器件的方法
    • JP2011077470A
    • 2011-04-14
    • JP2009230234
    • 2009-10-02
    • Sony Corpソニー株式会社
    • NOMOTO AKIHIROONO HIDEKI
    • H01L51/40H01L21/336H01L29/786H01L51/05H01L51/30
    • H01L51/0015H01L51/0011H01L51/0545H01L51/0558
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device which forms patterns on organic semiconductor layers with the state of the surfaces and the quality of the fims kept uniformed.
      SOLUTION: This method includes: a first step for forming an organic semiconductor film 9 on a substrate 1; a second step for forming a protective pattern 11 on the organic semiconductor film 9; and a third step for dissolving the organic semiconductor film 9 by an organic solvent using the protective pattern 11 as a mask or for sublimating the organic semiconductor film 9, which forms patterns on the organic semiconductor film 9 without changing the quality of the patterned surface of the film 9.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种制造半导体器件的方法,该半导体器件在有机半导体层上形成图案状态,并且具有均匀的表面和质量。 解决方案:该方法包括:用于在衬底1上形成有机半导体膜9的第一步骤; 用于在有机半导体膜9上形成保护图案11的第二步骤; 以及第三步骤,使用保护图案11作为掩模,通过有机溶剂溶解有机半导体膜9,或者升华有机半导体膜9,从而在有机半导体膜9上形成图案,而不改变图案化表面的质量 电影9.版权所有(C)2011,JPO&INPIT