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51. 发明专利

JPH11260302A PATTERN INSPECTING APPARATUS 失效
公开(公告)号：JPH11260302A
公开(公告)日：1999-09-24
申请号：JP5771998
申请日：1998-03-10
申请人： HITACHI LTD
发明人： YAJIMA YUSUKE , SHINADA HIROYUKI , NOZOE MARI , MURAKOSHI HISAYA , TAKATO ATSUKO , MAKINO HIROSHI , UMEMURA KAORU , HASEGAWA MASAKI , SHIMASE AKIRA , KUNI TOMOHIRO , SHISHIDO CHIE , TAKAGI YUJI
IPC分类号： H01J37/20 , G01N23/225 , H01J37/22 , H01J37/28 , H01L21/027 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To speed up SEM type pattern inspection in a semiconductor integrated circuit device producing field by arranging a plurality of scanning electron microscope(SEM) units at equal intervals in the feeding direction and specifying a stage feeding width for feeding carried out during a continuous movement. SOLUTION: This device is provided with N=4 sets of SEM units 1 at intervals (d) in the feeding direction, and electron beams 6 are radiated onto a sample 7 fixed in a stage 8. A stage control device 10 moves the stage 8 at a fixed speed from a starting point of the continuous movement direction to a terminal point and then returns it to the starting point again, while simultaneously moving it in the feeding direction by just a fixed quantity (s). In this process, the stage control device 10 is provided with a function for controlling the fixed quantity (s) so as to satisfy the equation: (s)=N(N-1)d/(Nk-1) and allocates inspection areas, based on the respective SEM units 1 in order at intervals of s/N on the sample 7. In the equation, (k) is a natural number. As a result, inspection can be accomplished N-times faster as than the case in which a set of SEM units 1 are used.

52. 发明专利

JPH09297011A METHOD AND APPARATUS FOR DETECTION OF SHAPE OF OBJECT SURFACE 失效
公开(公告)号：JPH09297011A
公开(公告)日：1997-11-18
申请号：JP11373496
申请日：1996-05-08
申请人： HITACHI LTD
发明人： TAKAGI YUJI , ISOBE MITSUNOBU
IPC分类号： G01B11/24 , G01B11/26 , G06T1/00 , G06T7/00 , H01L21/66 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To detect the proper angle of inclination of even an object, to be detected, in which a mirror face and a diffusion face exist so as to be mixed by a method wherein the influence of diffusion components of images by illumination means other than two arbitrary illumination means is removed from mirror face components of images by the two arbitrary illumination means. SOLUTION: While a reflected-light image from the surface of an object 3 to be inspected changes over four stages of illumination means 4A to 4D at high speed in synchronization with an image frame, the respective illumination means 4A to 4D are turned on individually. Thereby, images which are fetched by a TV camera 5 and which are obtained by the illumination means 4A to 4D are written into image memories 7a to 7d separately. Then, out of the four obtained images, diffusion components of the images by the illumination means other than the two arbitrary illumination means are removed from mirror-face components of the images by the two arbitrary illumination means, and the angle of inclination of the surface of the object to be inspected is computed. Thereby, even in an object in which a mirror face and a diffusion face exist so as to be mixed in such a way that, e.g. a copper foil face is exposed in the soldered part of a printed-circuit board after a soldering operation, its angle of inclination can be detected.

53. 发明专利

JPH04355311A DEVICE FOR DETECTING LIFT OF LEAD OF SURFACE-MOUNT IC 失效
公开(公告)号：JPH04355311A
公开(公告)日：1992-12-09
申请号：JP13097391
申请日：1991-06-03
申请人： HITACHI LTD
发明人： TAKAGI YUJI , HONDA TOSHIFUMI
IPC分类号： G01B11/24 , G01N21/88 , G01N21/956 , H05K3/34
摘要： PURPOSE:To enable a lift of lead after soldering to be detected highly reliably by using a lighting device which causes positive reflection to be produced when a soldering surface is flat for an image pick-up device and an lighting device which causes positive reflection to be produced when a soldering surface is at a certain inclination angle and then by picking up a soldering portion at a tip of a lead of a surface-mount IC. CONSTITUTION:A CPU 8 selects or switches an upper-stage lighting 12 and a lower- stage lighting 13 through an external equipment control unit 9 for using lightings with different angles, allows an image or reflection lights 17 and 18 which are reflected from a surface of a solder fillet 15 to be picked up by a TV camera 1 and to be input to and recorded at a memory 10 through an image input/output unit 7. An image according to lighting is read out of the memory 10 and the fillet 15 is segment into an inclined surface portion and a flat portion. Then, the CPU 8 performs a second-order approximation of a boundary between the inclined surface portion and the flat portion by an expression. It examines whether the second-order coefficient of the obtained second-order curve is equal to or less than a certain value or not and then determines that the product is a confirming article without any failure such as non-connection and lift of lead in the case of YES in the above.

54. 发明专利

JPH04355310A J LEAD PARTS SOLDERING INSPECTION DEVICE WITH SOLDER JOINT DETECTION FUNCTION 失效
公开(公告)号：JPH04355310A
公开(公告)日：1992-12-09
申请号：JP13097291
申请日：1991-06-03
申请人： HITACHI LTD
发明人： TAKAGI YUJI , HONDA TOSHIFUMI
IPC分类号： G01B11/24 , G01B11/245 , G01N21/88 , G01N21/956 , H05K3/34
摘要： PURPOSE:To enable a soldering state of a substrate where a surface-mount parts of J lead are mounted especially for an electronic parts mounting substrate inspection device. CONSTITUTION:An object 8 to be inspected is irradiated by lighting 5 which is installed at an upper portion of a substrate to be inspected and this image is pick up by a camera 1. A joint between a package of J lead parts and a lead is detected on the picked-up image, a soldering inspection region on the image is determined from a lead length which is registered at it previously, and a highly reliable soldering inspection is performed by performing soldering fillet analysis. Solder inspection of J lead parts can be made by suppressing influence due to secondary reflection without being affected by warpage of the substrate, thus enabling a highly reliable solder shape inspection to be made, soldering inspection to be automated, and man-power saving and reliability of soldering process to be improved.

55. 发明专利

JPH04301549A INSPECTING APPARATUS FOR SOLDERED STATE 失效
公开(公告)号：JPH04301549A
公开(公告)日：1992-10-26
申请号：JP6584391
申请日：1991-03-29
申请人： HITACHI ELECTRONICS , HITACHI LTD
发明人： HAYASHI SEIICHI , TAKEYASU KIYOO , TAKAGI YUJI
IPC分类号： G01B11/24 , G01N21/88 , G01N21/956 , G06T1/00 , G06T7/00 , H04N7/18 , H05K3/34
摘要： PURPOSE:To more quantitatively determine what conditions a shape of a soldered state is in. CONSTITUTION:An inspecting apparatus for soldered state comprises lighting devices 11 to 17 which are placed above a mounted substrate 1 which has been subjected to soldering for sequentially applying light with angles differed toward a soldered part 22, an image pickup device 2 which captures reflected light by the light application by the lighting devices 11 to 17 from a surface of the soldered part 2, image processors 3,4 which organize necessary extraction image distribution data as shape data from an output of the image pickup camera and a recognizing and determinating device 5 which classifies the shape data from the image processors 3,4, extracts characteristics in various combinations and determines the soldered state.

56. 发明专利

JPS6256814A CALIBRATION SYSTEM FOR THREE-DIMENSIONAL POSITION MEASURING CAMERA 失效
公开(公告)号：JPS6256814A
公开(公告)日：1987-03-12
申请号：JP19600585
申请日：1985-09-06
申请人： HITACHI LTD
发明人： TAKAGI YUJI , HATA SEIJI
IPC分类号： G01B11/00 , G01C11/00
摘要： PURPOSE:To measure a three-dimensional position with high accuracy irrelevantly to the distortion of a lens system by using a regular pattern and determining the correspondence relation between the position of an optional point in an object space determined by a TV camera and the position on its picked-up image. CONSTITUTION:A calibration plate PLT on which the regular pattern is drawn is placed on a Z0 axis so that it can shift in position, and its pattern edge is detected to project an X0Y0 coordinate system on an image coordinate system. Consequently, the spatial coordinate values of one point on the pattern corresponding to one point A on the image are calculated. Then the pattern is picked up by the TV camera every time the calibration plate PLT is placed at a different position on the Z0 axis, and then the object spatial coordinate values of each calibration plate position corresponding to specific picture elements are calculated. This three-dimensional position measuring method is employed to obtain a sight line equation.

57. 发明专利

JPS61200406A ARTICLE DETECTOR 失效
公开(公告)号：JPS61200406A
公开(公告)日：1986-09-05
申请号：JP4112385
申请日：1985-03-04
申请人： HITACHI LTD
发明人： OKADA TAKUSHI , HATA SEIJI , TAKAGI YUJI
IPC分类号： G01B11/24 , G01B11/00
摘要： PURPOSE:To detect existence, position and posture of an article, by encoding, such as labeling, etc. undulations of a linear pattern projected according to the nature of the undulations and performing their syntax analyses. CONSTITUTION:A linear pattern from a projector 6 is applied obliquely on to an article 10, it is viewed by an ITV camera 1 from the above. An image picked up in a monitor of the ITV camera 1,respective to the co-ordinates (I, J) of the image, generate a pattern of the higher I when the article is located the nearer to the camera 1. Further, as the view is taken right above the article, when the side surface of the article is oriented vertically or through such an angle as that nearest to the right angle, a skip of the pattern is caused at the border of the article and the back ground. By judging as skipping when an amount of this skipping exceeds the certain constant TH, distinction between the article the back ground becomes available.

58. 发明专利

JP2006352173A METHOD OF ANALYZING DEFECT DATA AND DEVICE THEREOF 审中-公开
公开(公告)号：JP2006352173A
公开(公告)日：2006-12-28
申请号：JP2006270261
申请日：2006-10-02
申请人： HITACHI LTD , HITACHI HIGH TECH CORP
发明人： SHIBUYA HISAE , TAKAGI YUJI
IPC分类号： H01L21/66
摘要： PROBLEM TO BE SOLVED: To analyze defect distribution status based on the defect data detected by an inspection device in the manufacturing process of a semiconductor device to facilitate the identification of the cause of failure caused by the device or process. SOLUTION: It is a defect data analysis method to analyze the defect distribution status based on defect position coordinates detected by an inspection device to classify into any one of the distribution characteristics categories among iterations defect, high density defect, line distribution defect, ring/massive distribution defect, and random defect. COPYRIGHT: (C)2007,JPO&INPIT

59. 发明专利

JP2003240731A METHOD AND APPARATUS FOR INSPECTING DEFCTS 审中-公开
公开(公告)号：JP2003240731A
公开(公告)日：2003-08-27
申请号：JP2002358839
申请日：2002-12-11
申请人： HITACHI LTD
发明人： HOSOYA NAOKI , TAKAGI YUJI , SHIBUYA HISAE , OBARA KENJI
IPC分类号： G01N21/956 , G06T1/00 , G06T7/00 , G06T7/40 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To efficiently obtain appropriate information on generated clusters by reviewing less defects when the defects are clustered and generated on a wafer. SOLUTION: In a wafer-inspecting and a sampling system, wafer defects are detected and are stored in a data store as defect data. Information for indicating defective clusters on a wafer is also provided. The defects are sampled based on a statistical method, and a set of sampling defects are obtained. Additional data which facilitate an understanding of process errors are obtained by the succeeding detailed inspection and analysis of the details of the sampling defects. COPYRIGHT: (C)2003,JPO

60. 发明专利

JP2003107022A EQUIPMENT AND METHOD FOR INSPECTING DEFECT 审中-公开
公开(公告)号：JP2003107022A
公开(公告)日：2003-04-09
申请号：JP2001302108
申请日：2001-09-28
申请人： HITACHI LTD
发明人： OKUDA HIROTO , TAKAGI YUJI , HONDA TOSHIFUMI
IPC分类号： G01N23/225 , G06T1/00 , H01L21/66
摘要： PROBLEM TO BE SOLVED: To specify the cause of a defect and to grasp the generating conditions of defect readily and surely by quickening analysis of composition at a defective part based on an X-ray spectrum. SOLUTION: In electron beam type automatic defect inspection equipment comprising an X-ray detector, the X-ray spectrum and image of a dust generated on a wafer for process QC are registered as reference data and defects occurring on the process wafer are sorted with reference to the reference data. Furthermore, the X-ray spectrum and the detected image are combined in order to (1) optimize the operational conditions at the time of detecting X-rays, e.g. select an object of X-ray detection based on the results of sorting of automatically collected defective images, and (2) sort the defects based on the features of both the composition and the appearance.

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