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    • 51. 发明专利
    • PRINTER, INFORMATION PROCESSOR OR THEIR COMBINATION DEVICE
    • JPH04244879A
    • 1992-09-01
    • JP1055491
    • 1991-01-31
    • HITACHI LTD
    • SUGANUMA YUJIMATSUOKA SHIGERUKIGOSHI HIDECHIKASAITO KOICHI
    • B41J13/00B41J29/00G06F1/16
    • PURPOSE:To improve an operation property in the case of printing by a method wherein a printing part is installed to a rear part of a printer body to make a printer with automatic paper feeder, and the combination device is so constructed as to be capable of disposing an information processor body on a printing paper housing part. CONSTITUTION:When an information processor body is set by forming integrally an inclination pin 36 on a printer upper case 25 of a printer with automatic paper feeder 9, the inclination pin 36 is engaged with a positioning hole 37 provided to a body under case 7 and a guide hole 39 of a body shutter 38, and the body is rotated by centering a fastening part 40 as an axis to open a body opening and closing window 41. Then, transfer of an optical signal between signal converters 42 becomes capable of being performed. At the same time an inclinable pin 43 provided to a printer upper case 25 is pushed by an empty weight of the information processor body, and a shutter 44 is rotated by centering a fastening part 46 as an axis to open a printer opening and closing window 47. Therefore, transfer of the optical signal between a printer control substrate 48 and the signal converter 42 becomes capable of being performed. Thereby, a printing signal is sent to the printer with automatic paper feeder 9 from the information processor body and printing becomes capable of being performed.
    • 57. 发明专利
    • CARRIER
    • JPS6298619A
    • 1987-05-08
    • JP23735685
    • 1985-10-25
    • HITACHI LTD
    • SAITO KOICHIOHASHI YUTAKA
    • H01L21/673H01L21/22H01L21/67H01L21/68
    • PURPOSE:To enable semiconductor wafers to be inserted into a carrier efficiently by a method wherein the surface of bottoms comprising a part of the carrier is provided with engagement parts with wide opened slits so that the semiconductor wafers may be vertically inserted into the slits to be obliquely surface-held by the oblique sides of engagement parts after they are inserted thereinto. CONSTITUTION:One side of engagement parts 5 is formed into vertical surface and the other side is formed into oblique surface making an angle of theta2 with the vertical surface as shown in the figure while the depth of engagement parts 5 is made gradually shallower from left side to right side due to the specified bottom height h1 of the engagement parts 5. The degree of shallowness is decided in consideration of oblique angle of the bottoms 3 as well as the numbers of semiconductor wafers 2 to be contained. Besides, the other height h2 of bottoms 3 may be around 5mm. In such a constitution, the opening width of engagement parts 5 can be increased so that the semiconductor wafers 2 may be easily inserted from above into the engagement parts 5 as shown by the imaginary lines.
    • 60. 发明专利
    • Method and apparatus for testing pressure resistance of bellows at piercing part of piping
    • 用于测试管道压力部分的贝氏体耐压性的方法和装置
    • JPS6138437A
    • 1986-02-24
    • JP15994184
    • 1984-07-30
    • Hitachi Eng Co LtdHitachi Ltd
    • FURUKAWA HIDEYASUOYAMADA OSAMUSAITO KOICHITERAKADO NORIYUKI
    • F16L5/02F16L27/10F16L27/12G01M3/26
    • G01M3/26
    • PURPOSE:To simplify a structure while enhancing workability, by forming a hermetically closed space to the outside of bellows so as to surround the same and pressurizing or evacuating said space to perform a pressure resistance/ leakage test. CONSTITUTION:The connection part of the disc shaped protective ring 9 provided to the outside of bellows and a cylindrical protective cover 10 is welded to impart air-tightness and a gasket 6 is inserted in the gap part and clamped and sealed by a clamp plate 17 and a clamp bolt 19 to form a hermietically closed space to the outside of the bellows 6 while a test plug 18 is provided to the protective cover 10 to pressurize or evacuate said hermetically closed space. By this mechanism, because a worker is released from entering an atomic reactor receiving vessel under a highly radioactive condition and a guard pipe becomes unnecessary, work becomes easy and the structure of a test apparatus can be simplified.
    • 目的:为了简化结构,同时提高可加工性,通过在波纹管的外侧形成一个气密封闭的空间,以便围绕它,并对所述空间进行加压或抽空以进行耐压/泄漏试验。 构成:将设置在波纹管外侧的圆盘形保护环9和圆筒形保护盖10的连接部分焊接起来以赋予气密性,并且将垫片6插入间隙部分中,并由夹板17夹紧和密封 以及夹紧螺栓19,当将试验塞18设置在保护盖10上以对所述密封空间加压或抽空时,形成到波纹管6外部的非闭合空间。 通过这种机制,由于工人在高度放射性条件下被释放而不能进入原子反应堆接收容器,并且不需要保护管,所以工作变得容易,并且可以简化测试装置的结构。