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51. 发明专利

JPH0479084B2 失效
公开(公告)号：JPH0479084B2
公开(公告)日：1992-12-15
申请号：JP6653681
申请日：1981-05-01
申请人： FURUKAWA ELECTRIC CO LTD
发明人： SHIOTANI SHIGEHARU , SHIRAHATA ISAO , NAKAMURA NOBUYUKI
IPC分类号： B05D7/20 , H01B3/42 , H01B13/16

52. 发明专利

JPH0425647B2 失效
公开(公告)号：JPH0425647B2
公开(公告)日：1992-05-01
申请号：JP7637984
申请日：1984-04-16
申请人： FURUKAWA ELECTRIC CO LTD
发明人： NAKAMURA NOBUYUKI , SHIRAHATA ISAO , SHIOTANI SHIGEHARU
IPC分类号： B05D7/20 , B05D3/02 , H01B13/16

53. 发明专利

JPH01266791A HYBRID INTEGRATED CIRCUIT BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JPH01266791A
公开(公告)日：1989-10-24
申请号：JP9459288
申请日：1988-04-19
申请人： FURUKAWA ELECTRIC CO LTD
发明人： SHIRAHATA ISAO , JINBO MUNEMASA , AKIMOTO MITSURU
IPC分类号： H05K3/20 , H05K3/24
摘要： PURPOSE:To form a thick circuit efficiently and with a high accuracy by a method wherein copper plating is applied to the required part of the aluminum surface of a metal plate with the aluminum surface and a circuit member is formed by removing the unnecessary part of the metal plate by machining and the circuit member is bonded to a base metal plate with an electrical insulating layer in between. CONSTITUTION:Copper plating is applied to the required part of the aluminum 1 surface of a metal plate 2b which has a surface layer made of aluminum 1 or totally made of aluminum 1 and a copper surface 2a for soldering and an aluminum surface 1 for bonding are formed. Then a circuit member 2 is formed by removing the unnecessary part of the metal plate 2b by machining such as punching or cutting. The obtained circuit member 2 is bonded to a base metal plate with an electrical insulating layer 3 in between. With this constitution, a circuit with a rectangular cross section with a required width can be obtained efficiently.

54. 发明专利

JPH01266728A HYBRID INTEGRATED CIRCUIT BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH01266728A
公开(公告)日：1989-10-24
申请号：JP9459188
申请日：1988-04-19
申请人： FURUKAWA ELECTRIC CO LTD
发明人： JINBO MUNEMASA , AKIMOTO MITSURU , SHIRAHATA ISAO
IPC分类号： H01L21/60 , H05K1/05 , H05K3/24 , H05K3/40
摘要： PURPOSE:To enable aluminum bonding on a semiconductor chip and introduction of a large current by joining a bonding pad of an aluminum piece or of a metal piece having an aluminum layer on a surface thereof with a surface of a copper sheet circuit member adapted to stick to a metal layer through on insulation layer at a predetermined location on said surface. CONSTITUTION:A desired shape copper sheet circuit member 2 is allowed to stick to a metal sheet 4 via an electrical insulating layer 3, and a bonding pad 1 comprising an aluminum piece or a metal piece including an aluminum layer on a surface thereof is joined with a surface of the copper sheet circuit member 2 at a given location on the same surface. The copper sheet circuit member 2, which is formed by machining, can provide a circuit of given width rectangular cross section even when it is formed into a thick copper circuit. It can further be formed in a simplified manner because it is allowed to stick to the metal sheet 4 via the electrical insulating layer 3 by means of a press and the like. Thus, a metal sheet-based hybrid integrated circuit board can be yielded, which is provided with the thick single layer copper circuit 2 capable of allowing a large circuit to flow therethrough and the aluminum bonding pad 1.

55. 发明专利

JPS6254215B2 失效
公开(公告)号：JPS6254215B2
公开(公告)日：1987-11-13
申请号：JP2258180
申请日：1980-02-25
申请人： FURUKAWA ELECTRIC CO LTD
发明人： NAKAMURA NOBUYUKI , SHIRAHATA ISAO , SHIOTANI SHIGEHARU , KITAMURA AKIRA
IPC分类号： H01B13/14 , C09D5/25 , C09D167/00 , H01B3/42 , H01B7/02 , H01B13/16 , H01B17/62

56. 发明专利

JPS6231024B2 失效
公开(公告)号：JPS6231024B2
公开(公告)日：1987-07-06
申请号：JP3256978
申请日：1978-03-22
申请人： FURUKAWA ELECTRIC CO LTD
发明人： YAMAZAKI KATSUYUKI , SHIRAHATA ISAO , SHIOTANI SHIGEHARU
IPC分类号： C08L67/00 , C08G63/00 , C08G63/685 , C08G73/00 , C08G73/10 , C08G73/16 , C08L67/02 , C08L67/08 , C08L77/00 , C08L79/08 , C09D5/03 , C09D167/00

57. 发明专利

JPS6228186B2 失效
公开(公告)号：JPS6228186B2
公开(公告)日：1987-06-18
申请号：JP5585477
申请日：1977-05-14
申请人： FURUKAWA ELECTRIC CO LTD
发明人： SHIOTANI SHIGEHARU , SHIRAHATA ISAO , KITAMURA AKIRA , NAKAMURA NOBUYUKI
IPC分类号： C08G63/00 , C08G63/12 , C08G63/68 , C08G63/685 , C09D5/25 , C09D167/00

58. 发明专利

JPS6043604B2 JPS6043604B2 - 失效
公开(公告)号：JPS6043604B2
公开(公告)日：1985-09-28
申请号：JP11439176
申请日：1976-09-25
申请人： Furukawa Electric Co Ltd
发明人： SHIRAHATA ISAO , YAMAZAKI KATSUYUKI , SANO BUNICHI
IPC分类号： H01B7/02 , H01B3/30 , H01B3/42

59. 发明专利

JPS606978B2 失效
公开(公告)号：JPS606978B2
公开(公告)日：1985-02-21
申请号：JP8066375
申请日：1975-06-30
申请人： FURUKAWA ELECTRIC CO LTD
发明人： OOKUBO NORYOSHI , SHIRAHATA ISAO , KITAMURA AKIRA
IPC分类号： C08G63/00 , C08G63/64 , C08G63/68 , C08G63/685 , C08G73/00 , C08G73/16 , C09D5/25 , C09D167/00 , C09D179/04

60. 发明专利

JPS5948069B2 JPS5948069B2 - 失效
公开(公告)号：JPS5948069B2
公开(公告)日：1984-11-24
申请号：JP2415579
申请日：1979-03-02
申请人： Furukawa Electric Co Ltd
发明人： KITAMURA AKIRA , SHIRAHATA ISAO , NAKAI MASANORI
IPC分类号： C08L67/00 , C08L67/02 , C09D167/00 , C09D175/06

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