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51. 发明专利

JP2002002870A CARRIER TAPE 失效
公开(公告)号：JP2002002870A
公开(公告)日：2002-01-09
申请号：JP2000193895
申请日：2000-06-28
申请人： DENKI KAGAKU KOGYO KK
发明人： ISHII MASATOMO , SHIMIZU MIKIO
IPC分类号： B65D73/02 , B65D85/86
摘要： PROBLEM TO BE SOLVED: To provide a packaging material for electronic components, in which the components can hardly be adhered to a cover tape when it is peeled off. SOLUTION: The packaging material for electronic components comprises an embossed tape made of a thermoplastic resin, whose surface resistivity is at least 1014 Ω/(square), and a cover tape whose heat-sealed surface side is subjected to antistatic treatment and whose surface resistivity is 107 Ω/(square)-1013 Ω/(square). An electronic component packaging is formed by packaging the electronic components with this packaging material. In this case, the embossed tape made of the thermoplastic resin is not subjected to antistatic treatment. On the other hand, it is preferable that the heat-sealed surface side of the cover tape is subjected to antistatic treatment.

52. 发明专利

JP2001334611A CONDUCTIVE COMPOSITE PLASTIC SHEET AND CONTAINER 失效
公开(公告)号：JP2001334611A
公开(公告)日：2001-12-04
申请号：JP2001082536
申请日：2001-03-22
申请人： DENKI KAGAKU KOGYO KK
发明人： MIYAGAWA KENJI , SHIMIZU MIKIO , NABETA KENJI
IPC分类号： B65D1/00 , B32B27/18 , B65D1/09 , B65D65/40 , B65D85/86 , C08K3/04 , H01B1/24
摘要： PROBLEM TO BE SOLVED: To provide a conductive composite plastic sheet markedly reducing the contamination of an IC or the like caused by the separation of carbon black or the like due to the abrasion at the time of contact with the IC or the like and a conductive plastic container formed by molding this sheet. SOLUTION: In the conductive composite plastic sheet wherein a conductive resin composition is laminated to both surfaces of a sheet base material comprising a thermoplastic resin, the conductive resin composition is prepared by adding 5-50 pts.wt. of (B) carbon black to 100 pts.wt. of (A) a thermoplastic resin and 1-30 pts.wt. of (C) an olefinic resin is added to 100 pts.wt. of the sum total of (A) the thermoplastic resin and (B) carbon black and the surface intrinsic resistance value of the sheet on which the conductive resin composition is laminated is 102-1010 Ω. The conductive plastic container obtained by molding the conductive composite plastic sheet is also disclosed.

53. 发明专利

JPH1113733A JOINT METHOD OF COVER TAPE FOR PACKAGING PARTS 失效
公开(公告)号：JPH1113733A
公开(公告)日：1999-01-22
申请号：JP17455797
申请日：1997-06-30
申请人： DENKI KAGAKU KOGYO KK
发明人： SHIMIZU MIKIO
IPC分类号： F16B47/00
摘要： PROBLEM TO BE SOLVED: To prevent a cover tape left unused from generating at changing the roll of the cover tape by cutting off the last end part of an old roll and the cover tape on the head part of a new roll so as to have the opposed same acute angles, and then joining together both with no gap by the use of a pressure sensitive adhesive tape. SOLUTION: In a package sealed with a cover tape, when electronic parts and the like are received in the pocket of an emboss carrier tape, at exchanging rolls, the last end part 1 of the cover tape used just before and the extreme end part 2 of the cover tape to be newly used and having the same width are cut off so as to have the opposite same acute angles 3. Next, using a pressure sensitive adhesive tape 4, both cutting end parts are joined together with no gap. In this case, the width of the pressure sensitive adhesive tape 4 is set into the width not protruding to both side end seal parts 5 against the width of the cover tape. By setting the cutting angle to be acute angle in this way, the joint part of both side end seal parts 5 are peeled off in order, and hence the peeling strength is improved.

54. 发明专利

JPH09174769A CONDUCTIVE COMPOSITE PLASTIC SHEET FOR PACKAGING ELECTRONIC COMPONENT AND VESSEL 失效
公开(公告)号：JPH09174769A
公开(公告)日：1997-07-08
申请号：JP33354995
申请日：1995-12-21
申请人： DENKI KAGAKU KOGYO KK
发明人： MIYAGAWA KENJI , SHIMIZU MIKIO , NABETA KENJI
IPC分类号： B32B7/02 , B32B27/00 , B32B27/18 , B32B27/20 , B32B27/30
摘要： PROBLEM TO BE SOLVED: To obtain a plastic sheet for packaging an electronic component and a vessel. SOLUTION: This conductive composite plastic sheet for packaging an electronic component comprises a base material layer made of a thermoplastic resin, and surface layers of a conductive resin composition laminated on both side surfaces of the base material layer, wherein its surface specific resistance value is 10 to 10 Ω and the surface glossiness is 30% or less. The vessel is obtaid by thermally molding it.

55. 发明专利

JPH08118494A HEAT RESISTANT PLASTIC COMPOSITION AND SHEET 失效
公开(公告)号：JPH08118494A
公开(公告)日：1996-05-14
申请号：JP25251194
申请日：1994-10-18
申请人： DENKI KAGAKU KOGYO KK
发明人： NABETA KENJI , SHIMIZU MIKIO
IPC分类号： B29D7/01 , B29C47/00 , B29K25/00 , B29K71/00 , C08L9/06 , C08L21/00 , C08L25/04 , C08L71/00 , C08L71/12
摘要： PURPOSE: To obtain a sheet having heat resistance and excellent tensile elastic modulus and folding endurance by forming extrusion molded sheet by heat resistant plastic composition containing polyphenylene ether resin, polystyrene resin and elastomer component at specific ratio, and specifying the thickness and the physical properties of the sheet. CONSTITUTION: An extrusion molded sheet is formed by heat resistant plastic composition which contains (a) pts.wt. of polyphenylene ether resin, (b) pts.wt. of polystyrene resin and (c) pts.wt. of elastomer component, wherein (a), (b), (c) satisfy a+b=100, a:b=(20 to 90):(10 to 80), (a+b):c=100:(5 to 20). The thickness of the sheet is 0.1 to 1.5mm. The physical properties of the sheet have 100-200kg/m of the numeric value of longitudinal tensile elastic modulus in accordance with JIS K 6732, and 1000 times or more of folding endurance in accordance with JIS P 8115. Thus, the sheet having excellent heat resistance, tensile elastic modulus and folding endurance is obtained.

56. 发明专利

JPH02151436A FLUORORESIN TYPE FILM LAMINATE 失效
公开(公告)号：JPH02151436A
公开(公告)日：1990-06-11
申请号：JP30601688
申请日：1988-12-05
申请人： DENKI KAGAKU KOGYO KK
发明人： MORIYA YOSHIHISA , SHIMIZU MIKIO , INOUE MASAMI
IPC分类号： B32B27/08 , B32B27/18 , B32B27/30 , C08J5/18 , C08L27/16 , C08L33/10 , C09D127/16 , C09D133/06
摘要： PURPOSE:To enhance fastness such as weatherability, contamination resistance or chemical resistance and practical strength by using a film consisting of a vinylidene fluoride resin and a methacrylic ester resin as a surface layer and using a film composed of the aforementioned resins containing an ultraviolet absorber as an intermediate layer and using a thermoplastic resin as a rear layer. CONSTITUTION:A film A based on 95-50 pts.wt. of a vinylidene fluoride resin and 5-50 pts.wt. of a methacrylic ester resin is used as a surface layer and a film B based on 5-50 pts.wt. of the vinylidene fluoride resin and 95-50 pts.wt. of the methacrylic ester resin is used as an intermediate layer and a thermoplastic resin is used as a rear layer to constitute a laminate. The film B contains 0.1-15 pts.wt. of an ultraviolet absorber per 100 pts.wt. of the total amount of the resins. This fluoroplastic type film laminate is excellent in contamination resistance and chemical resistance and has excellent long-term weatherability and, further, the intermediate layer is not lowered in the adhesiveness with a base material over a long period of time.

57. 发明专利

JPH0230528A FLUORORESIN MULTILAYER FILM 失效
公开(公告)号：JPH0230528A
公开(公告)日：1990-01-31
申请号：JP17919388
申请日：1988-07-20
申请人： DENKI KAGAKU KOGYO KK
发明人： MORIYA YOSHIHISA , SHIMIZU MIKIO , SATO KENICHI
IPC分类号： B32B27/30 , B32B27/00
摘要： PURPOSE:To enhance fastness, such as weatherability, resistances to stain, chemicals, and adhesion to various types of substrates by using a film of a resin composition mainly composed of a vinylidene fluoride resin and a methacrylate ester resin. CONSTITUTION:The title layer is formed by laminating a surface layer film of a resin composition mainly composed of 100-50 pts.wt. of vinylidene fluoride resin and 0-50 pts.wt. of methacrylate ester resin, an intermediate layer film of a resin composition mainly composed of 50-0 pts.wt. of vinylidene fluoride resin and 50-100 pts.wt. of methacrylate ester resin, and an adhesive layer in this order. As the adhesive for use, a thermoplastic adhesive or a rubber adhesive is used. It is preferable that an ultraviolet absorber is added to the layers including the adhesive layer, and particularly the addition to the surface layer or the intermediate layer is desired. The addition of the ultraviolet absorber by the amount of 0.1-15 pts.wt. per 100 pts.wt. of the resin composition can prevent the deteriorations of the adhesive itself as well as a substrate to be coated and protected.

58. 发明专利

JP2005272016A Sheet for embossing carrier tape 审中-公开
标题翻译：用于承载胶带的表格
公开(公告)号：JP2005272016A
公开(公告)日：2005-10-06
申请号：JP2005146729
申请日：2005-05-19
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： MIYAGAWA KENJI , SHIMIZU MIKIO
IPC分类号： B65D73/02 , B65D65/02 , B65D65/40 , B65D85/86
摘要： PROBLEM TO BE SOLVED: To provide an embossing carrier tape and a sheet for the embossing carrier tape suitable for high-speed mounting.
SOLUTION: The sheet for the embossing carrier tape excellent in high-speed mountability can be obtained by making the tearing strength of the sheet by the JIS-K-7128-3 105 N/mm or more.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供适于高速安装的压花载带的压花载带和片材。解决方案：通过使JIS-K-7128-3为105N / mm以上的片材的撕裂强度，可以获得高速安装性优异的压花载带的片材。版权所有（C）2006，JPO＆NCIPI

59. 发明专利

JP2005257674A Peeling charge measurement device 有权
标题翻译：剥离充电测量装置
公开(公告)号：JP2005257674A
公开(公告)日：2005-09-22
申请号：JP2005006986
申请日：2005-01-14
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： TAKEI ATSUSHI , TOKUNAGA HISAJI , SHIMIZU MIKIO
IPC分类号： G01R29/24 , G01N27/60
摘要： PROBLEM TO BE SOLVED: To provide a measurement device and method for measuring a charge quantity generated when peeling a protective film from a bonded object.
SOLUTION: This measuring device has a metal sheet for laying the bonded object and the protective film, and a coulomb meter connected thereto by a conductive wire to measure the charge quantity, and the metal sheet measures in order the charge quantity generated when peeling the protective film from the bonded object on an insulation body. In this measuring method, the charge quantity generated when peeling the protective film is measured by the coulomb meter by laying the bonded object and the protective film bonded to the metal sheet, using the measuring device.
COPYRIGHT: (C)2005,JPO&NCIPI

60. 发明专利

JP2005226039A Polyester resin composition and mounting film 有权
标题翻译：聚酯树脂组合物和安装膜
公开(公告)号：JP2005226039A
公开(公告)日：2005-08-25
申请号：JP2004038531
申请日：2004-02-16
申请人： Denki Kagaku Kogyo Kk , 電気化学工業株式会社
发明人： FUJIMURA TETSUO , KOMOTA FUKUMU , SHIMIZU MIKIO
IPC分类号： C08L67/02
摘要： PROBLEM TO BE SOLVED: To provide a mounting film made of polyester resin that has a same level of bending resistance as that of amorphous polyester and causes decreased dimensional change due to shrinkage, when it is applied to coat printing ink.
SOLUTION: This polyester resin composition is prepared by adding 65 to 95 pts.mass of polyethylene terephthalate resin and polybutylene terephthalate resin in total with 35 to 5 pts.mass of an amorphous copolyester composed of terephthalic acid, as the dicarboxylic acid component, and 20 to 40 mol.% of 1,4-cyclohexanedimethanol and 80 to 60 mol.% of ethylene glycol as the diol components at the mass ratio. This mounting film comprises the resin composition.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种由聚酯树脂制成的安装膜，其具有与非晶聚酯相同的耐弯曲性，并且当用于涂布印刷油墨时，由于收缩而导致尺寸变化减小。解决方案：该聚酯树脂组合物通过加入65〜95重量份的聚对苯二甲酸乙二醇酯树脂和聚对苯二甲酸丁二醇酯树脂，共计35〜5重量份的由对苯二甲酸组成的无定形共聚酯作为二羧酸成分，20〜40摩尔％的1,4-环己烷二甲醇和80〜60摩尔％的乙二醇作为二醇成分。该安装膜包含树脂组合物。版权所有（C）2005，JPO＆NCIPI

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