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    • 55. 发明专利
    • DIAPHRAGM FOR LOUDSPEAKER AND LOUDSPEAKER USING IT
    • JP2002142287A
    • 2002-05-17
    • JP2000333022
    • 2000-10-31
    • SEIKO EPSON CORP
    • SAITO KAZUYUKI
    • H04R7/12H04R7/18H04R13/02
    • PROBLEM TO BE SOLVED: To provide a diaphragm for loudspeaker that can smoothly pass air when a low-band sound pressure occurs and has a small size and a thin thickness, and to provide a loudspeaker using the diaphragm. SOLUTION: The loudspeaker 1 provided with the diaphragm 10 for loudspeaker integrally formed with the loudspeaker 1 is provided with a voice coil 12 in a case 13. The cone section 101 of the diaphragm 10 is formed in a projecting state on the side of a pole piece 15 and the edge section 102 of the diaphragm 10 is formed in a projecting state on the side opposite to the pole piece 15. When the low-band sound pressure occurs, the air existing in the space 104 between the cone section 101 and pole piece 15 is discharged from a vent 111 after passing through a sufficiently wide space 105 and flowing along the flowing route shown by the arrow 121. Therefore, the load resistance applied to the cone section 101 due to the compression of an air layer disappears. The loudspeaker 1 has such a frequency characteristic that loudspeaker 1 can obtain a high-band sound pressure in a low frequency region (of 300 Hz or its vicinity).
    • 57. 发明专利
    • STRUCTURE OF MOLD USING SYNTHETIC RESIN MATERIAL
    • JP2000296536A
    • 2000-10-24
    • JP10719399
    • 1999-04-14
    • SEIKO EPSON CORP
    • SAITO KAZUYUKIAKAHA FUMIAKI
    • B29C33/38B29C45/26
    • PROBLEM TO BE SOLVED: To upgrade heat radiation and to shorten a cycle time of molding by providing a high thermal conductivity radiator of a material having a higher thermal conductivity than that of a synthetic resin material at an inside of a mold adjacent to a cavity of the mold made of the resin material. SOLUTION: A high thermal conductivity radiator 6 charged in a radiating member container 3 is charged with a low melting point alloy such as a solder or the like of a molten state, then solidified, formed, and adjacently disposed at its lower surface to a cavity 2. The heated and molten molding material is supplied to the cavity 2, and the molding material is charged to be copied with an inner surface of the cavity 2 and a lower surface of the radiator 6. During charging and after the charging is completed, a heat in the material is radiated through the resin material for forming the cavity 2, and mainly radiated through the radiator 6 and a core plate 4, and a temperature of the mold is quickly transferred to a suitable temperature to next molding. Thus, the heat in the molding material is conducted, radiated through the radiator 6 to shorten a molding cycle.