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51. 发明专利

JP2014174459A Reflector and manufacturing method thereof 审中-公开
标题翻译：反射器及其制造方法
公开(公告)号：JP2014174459A
公开(公告)日：2014-09-22
申请号：JP2013049183
申请日：2013-03-12
申请人： Stanley Electric Co Ltd , スタンレー電気株式会社
发明人： SHINNO CHIKASHI , YOSHIDA MAKOTO , DOI KOHEI
IPC分类号： G02B5/08 , C23C16/26 , G02B1/10 , H05H1/48
摘要： PROBLEM TO BE SOLVED: To provide a reflector which achieves both high sulfur resistance and high salt water resistance while using a silver alloy film as a reflective coat.SOLUTION: A reflective coat 2 made of a silver alloy, a thin metal layer 3 as an adhesion layer, and a protective coat 6 are superimposed on a base material 1 in this order. The protective coat 6 has a layered structure formed of a silicon oxide film 4 and a diamond like carbon (DLC) film 5. Salt water resistance is improved because the silicon oxide film 4 covers the reflective coat 2 with high adhesion due to the adhesion layer 3 so as to suppress the infiltration of salt water. A DLC film 5 improves sulfur resistance due to an action of repelling sulfur. Thus, a reflector with high durability can be provided.
摘要翻译：要解决的问题：提供一种在使用银合金膜作为反射涂层的同时实现高耐硫性和高耐盐水性的反射器。解决方案：由银合金制成的反射涂层2，薄金属层3作为粘合层和保护层6依次重叠在基材1上。保护涂层6具有由氧化硅膜4和类金刚石碳（DLC）膜5形成的层状结构。由于氧化硅膜4由于粘合层而具有高粘附性而覆盖反射涂层2，所以提高了耐盐水性 3以抑制盐水的渗透。 DLC膜5由于排斥硫的作用而提高耐硫性。因此，可以提供耐久性高的反射器。

52. 发明专利

JP2014173178A Production method of metal coating member, and vehicular lamp including metal coating member 有权
标题翻译：金属涂层构件的制造方法和包括金属涂层构件的车辆灯
公开(公告)号：JP2014173178A
公开(公告)日：2014-09-22
申请号：JP2013049470
申请日：2013-03-12
申请人： Stanley Electric Co Ltd , スタンレー電気株式会社
发明人： SUZUKI YOSHIO , DOI KOHEI
IPC分类号： C23C14/02 , C23C14/06 , C23C14/12 , C23C14/14 , C23C14/56 , F21S8/10 , F21V7/00 , F21Y101/00 , G02B5/08
摘要： PROBLEM TO BE SOLVED: To provide a production method of a reflector including a reflection film excellent in adhesion, which has high production efficiency, and a production apparatus therefor, and to provide a production method of a lighting system using the same.SOLUTION: A plasma treatment using nitroethane gas is performed onto a resin substrate 21 having a three-dimensional shape, and then an aluminum film 22 is formed as a reflection film. A protection film 23 is formed on the surface of the aluminum film 22. A sample to which the plasma treatment using nitroethane gas is applied can provide a reflection film excellent in adhesion without providing a ground layer.
摘要翻译：要解决的问题：提供一种反射器的制造方法，该反射器包括具有优异的生产效率高的粘附性的反射膜及其制造装置，并提供使用该反射膜的照明系统的制造方法。在具有三维形状的树脂基板21上进行使用硝基乙烷气体的等离子体处理，然后形成铝膜22作为反射膜。在铝膜22的表面上形成保护膜23.使用硝基乙烷气体进行等离子体处理的样品可提供粘附性优异的反射膜，而不需要提供接地层。

53. 发明专利

JP2014170776A Semiconductor light-emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：JP2014170776A
公开(公告)日：2014-09-18
申请号：JP2013040488
申请日：2013-03-01
申请人： Stanley Electric Co Ltd , スタンレー電気株式会社
发明人： KAZAMA TAKUYA
IPC分类号： H01L33/02
CPC分类号： H01L25/167 , H01L25/0753 , H01L2224/13 , H01L2924/12032 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device having a Schottky diode element as a protection diode connected in antiparallel to the semiconductor light-emitting element, in which a reverse breakdown voltage of the Schottky diode element is larger than a forward drop voltage of the semiconductor light-emitting element.SOLUTION: In a semiconductor light-emitting device, a high-resistivity p-type silicon layer 2 and an insulating layer 3 are formed on a low-resistivity ptype silicon supporting substrate 1. An n-type GaN layer 4-1, an active layer 5-1, and a p-type GaN layer 6-1 as an LED element D1, and an n-type GaN layer 4-2, an active layer 5-2, and a p-type GaN layer 6-2 as an LED element D2 are bonded to the insulating layer 3 by a bonding layer 7. The LED elements D1 and D2 are connected in series between power supply terminals T1 and T2. The power supply terminal T1 and the p-type silicon layer 2 form a Schottky diode element SBD. The power supply terminal T2 is electrically connected to the n-type GaN layer 5-2 of the LED element D2 via a wiring layer 10-2. The power supply terminal T2 ohmically contacts with the p-type silicon layer 2.
摘要翻译：要解决的问题：提供一种具有肖特基二极管元件作为与半导体发光元件反向并联连接的保护二极管元件的半导体发光器件，其中肖特基二极管元件的反向击穿电压大于正向压降半导体发光元件的电压。解决方案：在半导体发光器件中，在低电阻率p型硅支撑衬底1上形成高电阻率p型硅层2和绝缘层3。 GaN层4-1，有源层5-1和作为LED元件D1的p型GaN层6-1，以及n型GaN层4-2，有源层5-2和作为LED元件D2的p型GaN层6-2通过接合层7接合到绝缘层3. LED元件D1和D2串联连接在电源端子T1和T2之间。电源端子T1和p型硅层2形成肖特基二极管元件SBD。电源端子T2经由布线层10-2与LED元件D2的n型GaN层5-2电连接。电源端子T2与p型硅层2欧姆接触。

54. 发明专利

JP2014166699A Injection molding die 审中-公开
标题翻译：注射成型模具
公开(公告)号：JP2014166699A
公开(公告)日：2014-09-11
申请号：JP2013038921
申请日：2013-02-28
申请人： Stanley Electric Co Ltd , スタンレー電気株式会社
发明人： EJIRI JUN , ARIKI YUJI , CHINGYO YOHEI , IMAMURA TOMOYUKI
IPC分类号： B29C45/36 , B29C45/37
摘要： PROBLEM TO BE SOLVED: To provide an injection molding die capable of preventing the rolling and deformation of a product upon release, thus preventing deteriorating in merchantability.SOLUTION: In the injection molding die where a molten raw material is filled into a cavity S formed by a cavity die 1 on a fixed side and a core die 2 on a movable side, and, when the filled molten raw material is cooled and solidified, the core die 2 is pulled out to discharge a product, recessed parts 3 (or projecting parts) along the pulling out direction of the core die 2 are formed at the cavity face 2a facing the cavity S in the core die 2. Further, the recessed parts 3 (or projecting parts) are formed at a plurality of the parts in the cavity face 2a of the core die 2.
摘要翻译：要解决的问题：提供一种能够防止在释放时产品的滚动和变形的注射成型模具，从而防止适销性劣化。解决方案：在熔融原料填充到由S形成的空腔S中的注塑模具中固定侧的模腔1和可动侧的芯模2，当填充的熔融原料冷却固化时，将芯模2拉出以对产品进行排出，将凹部3（或凸部）沿着芯模2的拉出方向形成在与芯模2中的空腔S相对的空腔面2a上。此外，凹部3（或突出部）形成在空腔的多个部位芯模2的表面2a。

55. 发明专利

JP2014165419A MANUFACTURING METHOD OF P-TYPE ZnO-BASED SEMICONDUCTOR LAYER, MANUFACTURING METHOD OF ZnO-BASED SEMICONDUCTOR DEVICE AND N-TYPE ZnO-BASED SEMICONDUCTOR LAMINATION STRUCTURE 有权
标题翻译：基于ZnO的半导体层的制造方法，ZnO基半导体器件的制造方法和基于ZnO的半导体层状结构的N型
公开(公告)号：JP2014165419A
公开(公告)日：2014-09-08
申请号：JP2013036824
申请日：2013-02-27
申请人： Stanley Electric Co Ltd , スタンレー電気株式会社
发明人： SAITO SENJU , KATO HIROYUKI , SANO MICHIHIRO
IPC分类号： H01L21/363 , C23C14/08 , C23C14/58 , C30B23/08 , C30B29/16 , C30B29/22 , H01L33/28
摘要： PROBLEM TO BE SOLVED: To provide a novel manufacturing method of a p-type ZnO-based semiconductor layer.SOLUTION: IB group elements of (i)Zn, (ii)O, (iii)Mg as needed and (iv)CU or/and Ag is supplied to form an IB group element doped MgZnO (0≤x≤0.6) single crystal film (step (a)). On the MgZnO (0≤x≤0.6) single crystal film, one or more IIIB elements selected from among a group consisting of B, Ga, Al and In are supplied (step (b)). The step (a) and the step (b) are alternately repeated to form a lamination structure (step (c)). The lamination structure is annealed to form a p-type MgZnO (0≤x≤0.6) layer in which the IB group elements and the III group elements are doped together (step (d)).
摘要翻译：要解决的问题：提供一种新型的p型ZnO基半导体层的制造方法。解决方案：根据需要，（i）Zn，（ii）O，（iii）Mg的IB族元素和（iv）CU或 /和Ag被提供以形成掺杂MgZnO（0≤x≤0.6）单晶膜的IB族元素（步骤（a））。在MgZnO（0≤x≤0.6）单晶膜上，供给选自由B，Ga，Al和In组成的组中的一种以上的IIIB元素（步骤（b））。交替地重复步骤（a）和步骤（b）以形成层压结构（步骤（c））。层压结构退火以形成其中IB族元素和III族元素掺杂在一起的p型MgZnO（0≤x≤0.6）层（步骤（d））。

56. 发明专利

JP2014165418A Semiconductor light-emitting element manufacturing method 审中-公开
标题翻译：半导体发光元件制造方法
公开(公告)号：JP2014165418A
公开(公告)日：2014-09-08
申请号：JP2013036823
申请日：2013-02-27
申请人： Stanley Electric Co Ltd , スタンレー電気株式会社
发明人： HAYASHI TAKAKO
IPC分类号： H01L33/32
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element manufacturing method which inhibits formation of a damaged region on a surface of an optical semiconductor layer in a laser lift-off process.SOLUTION: A semiconductor light-emitting element manufacturing method comprises: a) a process of preparing a sandwich structure in which a growth substrate 1 on which a plurality of light-emitting laminates 5 each composed of a semiconductor laminate structure including a luminescent layer and a support substrate 10 are opposite to each other across the plurality of light-emitting laminates 5; and b) a process of removing the growth substrate 1 from the sandwich structure by irradiating the plurality of the light-emitting laminates 5 with laser beams from the growth substrate side to decompose an interface of the plurality of light-emitting laminates 5, which contacts the growth substrate 1, and separate the plurality of light-emitting laminates 5 and the growth substrate 1, in which selected regions among regions where the plurality of light-emitting laminates 5 grow are irradiated with the laser beams sequentially in a manner such that separation regions where the plurality of light-emitting laminates 5 and the growth substrate 1 are separated are uniformly distributed in the growth substrate plane.
摘要翻译：要解决的问题：提供一种在激光剥离工艺中抑制在光半导体层的表面上形成受损区域的半导体发光元件制造方法。解决方案：一种半导体发光元件的制造方法，包括： a）制备夹层结构的方法，其中在其上分布有多个发光层压板5的生长衬底1，每个由包括发光层和支撑衬底10的半导体层叠结构构成的发光层压体5跨越多个发光层压板5; 以及b）通过用来自生长衬底侧的激光束照射多个发光层压板5来分解生长衬底1的界面的方法，从生物衬底1去除生长衬底1的过程，以分解多个发光层压体5的界面，生长衬底1，并且分离多个发光层压体5和生长衬底1，其中多个发光层压板5生长的区域中的选定区域以激光束依次照射，使得分离多个发光层叠体5和生长基板1分离的区域均匀分布在生长基板平面内。

57. 发明专利

JP2014164975A Vehicle lighting appliance 审中-公开
标题翻译：车用照明器具
公开(公告)号：JP2014164975A
公开(公告)日：2014-09-08
申请号：JP2013034099
申请日：2013-02-25
申请人： Stanley Electric Co Ltd , スタンレー電気株式会社
发明人： EJIRI JUN , ARIKI YUJI , CHINGYO YOHEI , IMAMURA TOMOYUKI
IPC分类号： F21S8/10 , F21Y101/00
摘要： PROBLEM TO BE SOLVED: To illuminate a side of a side face of a light guide body while illuminating a front part of a front face of the light guide body even if diffusion reflection parts are formed at a rear face and the side face of the light guide body.SOLUTION: One end face of a light-incident side light guide part 13a of a light guide body 13 opposes a light source 11, the other end of the light-incident side light guide part is connected to one end part of a front illumination light guide part 13b, one end part of a side illumination light guide part 13c is connected to the other end of the front illumination light guide part 13b, the side illumination light guide part 13c is extended sideways from the other end of the front illumination light guide part 13b, and bent rearward, a diffusion reflection part 13h is formed at a rear face of the front illumination light guide part 13b, a diffusion refection part 13j is formed at a side face of the side illumination light guide part 13c, and a reflection face is formed in a region which opposes the side illumination light guide part 13c of a body 14.
摘要翻译：要解决的问题：即使在光的后表面和光的侧面形成扩散反射部分的同时照亮导光体的侧面的一侧，同时照射导光体的正面的前部导光体。光导体13的光入射侧导光部13a的一端面与光源11相对，光入射侧导光部的另一端与一端部前照明导光部13b，侧面照明光导部13c的一端部与前照明导光部13b的另一端连接，侧面照明光导部13c从前方的另一端侧向延伸照明光导部13b，向后方弯曲，在前照明导光部13b的背面形成有扩散反射部13h，在侧面照明光导部13c的侧面形成扩散反射部13j 并且在与主体14的侧面照明光导部13c相对的区域中形成反射面。

58. 发明专利

JP2014160581A Surface lighting light-emitting device 有权
标题翻译：表面照明发光装置
公开(公告)号：JP2014160581A
公开(公告)日：2014-09-04
申请号：JP2013030658
申请日：2013-02-20
申请人： Stanley Electric Co Ltd , スタンレー電気株式会社
发明人： URAE HIROSHI
IPC分类号： F21S2/00 , F21V7/00 , F21V7/09 , F21Y101/02
摘要： PROBLEM TO BE SOLVED: To provide a surface lighting light-emitting device which can materialize even surface light emission by making light intensity distribution even over the whole region.SOLUTION: An LED 2 is arranged on a bottom surface 1a in a light guide box 1 provided with the bottom surface 1a, a lateral surface 1b vertically arranged around the bottom surface and an above surface 1c opposite to the bottom surface 1a, a light guide element 3 is arranged on the above side of the LED 2, and the light guide element 3 is configured so as to form holes 4a to 4e which successively are made smaller toward the above side on an optical axis X of a plurality of light shielding plates 4(4-1 to 4-5) stacked on the vertical direction at predetermined spaces. Therein, the light shielding plates 4(4-1 to 4-5) are configured by flat plate, conical plate, polyhedron or combination of them. Further, a top cap 5 which shields light emitted toward just above from the LED 2 is arranged on the above side of the light shielding plates 4-5 of the uppermost position.
摘要翻译：要解决的问题：提供一种即使在整个区域上均匀发光也能实现均匀的表面发光的表面照明发光装置。解决方案：LED 2设置在导光箱1的底面1a上设置有底面1a，在底面上垂直设置的侧面1b和与底面1a相反的上表面1c，在LED 2的上侧设置有导光体3，导光体 3被构造成形成在垂直方向上以预定间隔堆叠的多个遮光板4（4-1至4-5）的光轴X上朝向上侧逐渐变小的孔4a至4e 。其中，遮光板4（4-1〜4-5）由平板，圆锥板，多面体或它们的组合构成。此外，在位于最上位置的遮光板4-5的上侧设置有将从LED2向正上方发射的光遮蔽的顶盖5。

59. 发明专利

JP2014156172A Optical axis adjusting device for head light for vehicle, and head light system for vehicle 审中-公开
标题翻译：用于车辆的头灯的光轴调整装置和用于车辆的头灯系统
公开(公告)号：JP2014156172A
公开(公告)日：2014-08-28
申请号：JP2013027503
申请日：2013-02-15
申请人： Stanley Electric Co Ltd , スタンレー電気株式会社
发明人： IWASAKI KAZUHISA
IPC分类号： B60Q1/115
摘要： PROBLEM TO BE SOLVED: To provide an optical axis control technique for a head light for vehicle that can improve precision of optical axis adjustment in detecting a vehicle body tilt angle using a pressure sensor etc.SOLUTION: There is provided a device for controlling the optical axis of a head light unit 18 for vehicle, the device comprising: a seating detection part; a seating state determination part 22; a memory 26; a control angle setting part 23 which finds a first vehicle body tilt angle using seating positions, the number of persons on seats, and first data and sets a control angle of the optical axis of the head light unit 18 when the vehicle is substantially at a stop, and also finds a second vehicle body tilt angle using a vehicle speed of the vehicle, seating positions, the number of persons on seats, and second data and sets a control angle of the optical axis of the head light unit 18 when the vehicle is traveling and the vehicle speed is substantially constant; and adjuster units 15, 16 which adjust the optical axis of the head light unit on the basis of the control angles.
摘要翻译：要解决的问题：提供一种用于车辆头灯的光轴控制技术，其可以使用压力传感器等来检测车身倾斜角度来提高光轴调整的精度。解决方案：提供了一种用于控制光学用于车辆的头灯单元18的轴线，该装置包括：就座检测部; 座位状态判定部22; 存储器26; 控制角度设定部23，其利用座位位置求出第一车体倾斜角度，座椅上的人数和第一数据，并且当车辆基本处于位置时设定头灯单元18的光轴的控制角度停止，并且还使用车辆的车速，乘坐位置，座位数量和第二数据来找到第二车体倾斜角度，并且当车辆灯头单元18的车辆位置时，设置头灯单元18的光轴的控制角度车速大致恒定; 以及基于控制角度调节头灯单元的光轴的调节单元15,16。

60. 发明专利

JP2014154644A Led package and light-emitting device including the same 审中-公开
标题翻译： LED包装和发光装置，包括它们
公开(公告)号：JP2014154644A
公开(公告)日：2014-08-25
申请号：JP2013021714
申请日：2013-02-06
申请人： Stanley Electric Co Ltd , スタンレー電気株式会社
发明人： MURAO REI , ABE SATORU
IPC分类号： H01L33/48
摘要： PROBLEM TO BE SOLVED: To provide an LED package which can suppress temperature rise of an LED by enhancing heat dissipation, while enhancing color mixture of light.SOLUTION: In an LED package 1 formed by mounting a plurality of LEDs of different luminous colors on a substrate 2, a white LED 3W is arranged in a region R2 on the outside of a region R1 on the substrate 2 where a plurality of red LED 3R, green LED 3G and blue LED 3B (chromatic color LEDs) of different colors are mounted. In addition, the red LED 3R, green LED 3G and blue LED 3B (chromatic color LEDs) are sealed by a potting layer 10 of a diffusing material containing resin. Furthermore, the white LED 3W is constituted of a blue LED and a potting layer 11 mixed with phosphor for sealing the same.
摘要翻译：要解决的问题：提供一种LED封装，其可以通过增强散热来抑制LED的温度升高，同时增强光的混合。解决方案：在通过将多个不同发光颜色的LED安装在基板2中，在基板2上的区域R1的外侧的区域R2中配置有白色LED 3W，其中安装有多个不同颜色的红色LED 3R，绿色LED 3G和蓝色LED 3B（彩色LED 3B）。此外，红色LED 3R，绿色LED 3G和蓝色LED 3B（彩色LED）由包含树脂的扩散材料的灌封层10密封。此外，白色LED 3W由蓝色LED和与其密封的荧光体混合的灌封层11构成。

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