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    • 43. 发明专利
    • Infrared sensor
    • 红外传感器
    • JP2012211791A
    • 2012-11-01
    • JP2011076768
    • 2011-03-30
    • Mitsubishi Materials Corp三菱マテリアル株式会社
    • NAKAMURA KENZOISHIKAWA MOTOTAKAUOZUMI SATOSHI
    • G01J1/02G01J5/02H01L35/32
    • G01J5/02G01J5/0096G01J5/0205G01J5/023G01J5/04G01J5/046G01J5/0875G01J5/20
    • PROBLEM TO BE SOLVED: To provide an infrared sensor that is light in weight and is capable of obtaining a stable installation state, detecting temperature of even a portion away from a circuit board with high accuracy and being easily installed.SOLUTION: An infrared sensor comprises: an insulating film 2; a first heat sensitive element 3A and a second heat sensitive element 3B that are provided apart from each other on one surface of the insulating film 2; a first conductive wiring film 4A connected to the first heat sensitive element 3A and a second conductive wiring film 4B connected to the second heat sensitive element 3B that are formed on the one surface of the insulating film 2; an infrared reflecting film 6 that faces the second heat sensitive element 3B and is provided on other surface of the insulating film 2; a plurality of terminal electrodes 7A and 7B that are formed on one end portion of the insulating film 2 and capable of being fitted into an external connector; an end portion reinforcing plate 11 that is bonded to one end portion of the one surface of the insulating film 2; and a mounting hole 2b formed on other end portion of the insulating film 2.
    • 要解决的问题:为了提供重量轻并且能够获得稳定的安装状态的红外传感器,高精度地检测远离电路板的部分的温度并容易地安装。 解决方案:红外传感器包括:绝缘膜2; 在绝缘膜2的一个表面上彼此分开设置的第一热敏元件3A和第二热敏元件3B; 连接到第一热敏元件3A的第一导电布线膜4A和与形成在绝缘膜2的一个表面上的第二热敏元件3B连接的第二导电布线膜4B; 面对第二感温元件3B并设置在绝缘膜2的另一表面上的红外线反射膜6; 多个端子电极7A和7B,其形成在绝缘膜2的一个端部上,并且能够装配到外部连接器中; 端部加强板11,其与绝缘膜2的一个表面的一个端部接合; 以及形成在绝缘膜2的另一端部上的安装孔2b。版权所有(C)2013,JPO&INPIT
    • 44. 发明专利
    • Terahertz wave detection device, terahertz wavelength filter, imaging device, and measuring device
    • TERAHERTZ波形检测装置,TERAHERTZ波长滤波器,成像装置和测量装置
    • JP2012202689A
    • 2012-10-22
    • JP2011064406
    • 2011-03-23
    • Seiko Epson Corpセイコーエプソン株式会社
    • TOMIOKA HIROTO
    • G01N21/3581
    • G01J5/085G01J3/0243G01J3/42G01J5/046G01J5/0831G01J5/0862H01P1/2005
    • PROBLEM TO BE SOLVED: To provide a terahertz wave detection device, a terahertz wavelength filter, an imaging device, and a measuring device, allowing further downsizing compared to conventional ones.SOLUTION: A terahertz wave detection device 1 comprises a wavelength filter 2 which allows a terahertz wave with a predetermined wavelength to transmit through and a detector 3 which converts the terahertz wave with the predetermined wavelength transmitting through the wavelength filter 2 into heat for detection. The wavelength filter 2 comprises a metal film 5 having a plurality of pores 51 for communicating an incidence surface on which the terahertz wave is incident with an emission surface from which the terahertz wave having the predetermined wavelength emits, and a dielectric part 6 which is charged into the pores 51 and formed of a dielectric substance. The pores 51 are arranged at a predetermined pitch along the direction perpendicular to the normal of the incidence surface 52.
    • 要解决的问题:为了提供太赫兹波检测装置,太赫兹波长滤波器,成像装置和测量装置,与常规技术相比允许进一步的小型化。 解决方案:太赫波检测装置1包括允许具有预定波长的太赫兹波传输的波长滤波器2以及将通过波长滤波器2传输的预定波长的太赫兹波转换成热的检测器3 检测。 波长滤波器2包括金属膜5,该金属膜5具有多个孔51,用于使太赫波入射的入射表面与具有预定波长的太赫兹波的发射面发射;以及电介质部6,其被充电 进入孔51并由介电物质形成。 孔51沿着与入射面52的法线垂直的方向以预定的间距排列。(C)2013,JPO和INPIT
    • 46. 发明专利
    • Infrared sensor package and electronic device having the same
    • 红外传感器封装和具有该传感器的电子器件
    • JP2012122747A
    • 2012-06-28
    • JP2010271412
    • 2010-12-06
    • Nec Corp日本電気株式会社
    • YAMAZAKI TAKAOKATO KOJISASAKI NARIHITO
    • G01J1/02
    • G01J5/061G01J5/046H01L2224/48091H01L2924/3025H01L2924/00014H01L2924/00
    • PROBLEM TO BE SOLVED: To provide a power-saving type infrared sensor package capable of stably maintaining an infrared detection section at a constant temperature and an electronic device that has the infrared sensor package.SOLUTION: An infrared sensor package 10 according to the present invention comprises: a housing member 50 that has an upper surface portion 52 to which a transmission member 53 for transmitting infrared rays is disposed, a planar lower surface portion 51, and a vacuum-sealed interior space; a plate-like heater member 30 that is disposed in the interior space of the housing member 50 and generates heat; an infrared detection element 20 that is fixed on the heater member 30 and detects infrared rays transmitted through the transmission member 53; and a heat-insulating member 40 that has low heat conductivity and a cross-sectional area smaller than the cross-sectional area of the heater member 30 and supports the heater member 30 with being fixed on the lower surface portion 51.
    • 要解决的问题:提供一种能够稳定地保持恒定温度的红外线检测部和具有红外线传感器封装的电子装置的省电型红外线传感器封装。 解决方案:根据本发明的红外传感器封装10包括:壳体构件50,其具有设置有用于透射红外线的透射构件53的上表面部分52,平面下表面部分51和 真空密封的内部空间; 设置在壳体构件50的内部空间中并产生热量的板状加热器构件30; 红外线检测元件20,固定在加热器构件30上,并检测透过透射构件53的红外线; 以及绝热构件40,其导热性低,截面积小于加热构件30的截面面积,并且固定在下表面部分51上并支撑加热器构件30.

      版权所有 (C)2012,JPO&INPIT