会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 41. 发明专利
    • PATTERN FORMATION
    • JPH0385722A
    • 1991-04-10
    • JP22160089
    • 1989-08-30
    • TOSHIBA CORP
    • GOKOCHI TORUTADA TSUKASA
    • G03F7/20H01L21/027H01L21/3213
    • PURPOSE:To form a thick fine pattern having a good cross sectional shape by forming a latent image by selectively irradiating ionizing radiation or shortwave length ultraviolet ray to a resist film on a substrate and by carrying out development after ultraviolet ray is irradiated all over the resist film. CONSTITUTION:A resist film 2 is formed on a substrate 1. An exposure mask 5 having a mask pattern 4 on a transparent substrate 3 is arranged above the resist film 2. Ionizing radiation or a shortwave length ultraviolet ray is irradiated selectively through a transmitting part of the mask 5. At this time, ionizing radiation, etc., is irradiated, thereby discoloring the upper layer part of the resist film 2 and forming a latent image 6 having high transmission factor to ultraviolet ray. Then, ultraviolet ray is irradiated all over the resist film 2. At this time, a latent image 6' of high contrast which reaches the bottom of the resist film 2 is formed because of the existance of the formed latent image 6 of high transmission factor. The resist film 2 after entire irradiation is developed to form a resist pattern by dissolving selectively the part of the latent image 6' of the resist film 2.
    • 46. 发明专利
    • FORMATION OF PATTERN
    • JPS63116151A
    • 1988-05-20
    • JP26191986
    • 1986-11-05
    • TOSHIBA CORP
    • GOKOCHI TORUWATANABE HARUAKITADA TSUKASA
    • G03F7/32G03F7/039G03F7/30
    • PURPOSE:To decrease swelling and film thinning in a developing stage by making development with a prescribed developing soln. by using a resist consisting of a homopolymer of a specific monomer or copolymer of said monomer and other radiation decomposition type monomer. CONSTITUTION:The homopolymer of the vinyl monomer expressed by the formula or the copolymer of said monomer and the other radiation decomposition type vinyl monomer (e.g.: trifluoroethyl alpha-chloroacrylate) is used as the positive type resist for radiations. In the formula, R1 denotes methyl, Cl; R2 denotes a (halogenated) alkyl of 1-10C, monovalent hydrocarbon group contg. a normal ratio of Si. After the film consisting of the above-mentioned resist material is exposed by electron rays or the like,the film is developed by using the developing soln. contg. 0.1wt% basic compd. (e.g.: tetramethyl ammonium hydroxide). The swelling and film thinning in the developing stage are then decreased and a high-resolution pattern is formed.