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    • 43. 发明专利
    • FORMATION OF INTERCONNECTION
    • JPH0823153A
    • 1996-01-23
    • JP15385994
    • 1994-07-05
    • SHARP KK
    • ISHII YORISHIGEMATOBA KOJIHIRATA SUSUMUINUI TETSUYAABE SHINGOOTA KENJI
    • B41J2/16B81C1/00H05K3/10H05K3/22
    • PURPOSE:To reduce the occupying area of interconnection on the surface of a substrate and reduce interconnection resistance by forming a recessed groove on the surface of the substrate, forming a first interconnection layer in the groove and providing a second interconnection layer along the surface of the substrate so as to connect the first interconnection layer with an electronic component element. CONSTITUTION:Insulating SiO2 films are formed on both front and rear planes of a substrate 1, and a base layer 3 for plating films are provided on the SiO2 film. On the base layer 3, a buckling body 4, an interconnection layer 5 and a flattening layer 6 are formed by aligning them almost on the same flat plane. The interconnection layer 5 is formed of a first interconnection layer 5a in a recessed groove 9 formed on the surface of the substrate 1 and a second interconnection layer 5b formed along the surface of the substrate 1, and a spacer layer 7 and a nozzle plate 8 are successively formed on the top plane of the flattening layer 6. Thus, the occupying area of the interconnection on the surface of the substrate 1 is reduced, and the interconnection resistance is reduced.
    • 46. 发明专利
    • IMAGE SENSOR
    • JP2001069309A
    • 2001-03-16
    • JP23863599
    • 1999-08-25
    • SHARP KK
    • ABE SHINGO
    • H04N1/028G02B6/04
    • PROBLEM TO BE SOLVED: To obtain an image sensor capable of being made high in performance, low in cost and improved in reliability by maintaining the linearity of the array of a waveguide outgoing end in the thickness direction of a light transmission substrate. SOLUTION: In this image sensor 21 of an optical waveguide contracting optical type, a first thermal expansion suppressing member 26 is stuck to one side surface of the thickness direction D2 of the rear end part 32 of a light transmission member 24 having plural waveguide 23. The linear expansion coefficient of the member 26 in an array direction D1 is smaller than that of the member 24 in the direction D1. The bending rigidity of the member 26 in the direction D2 is in such a degree than can maintain linearity with respect to the thickness direction D2 of the array of a waveguide outgoing end 28. The plane degree of an adhering surface 35 with the member 24 of the member 26 is >=0 μ and >=5 μ. Thus, the thermal extension of the part 32 of the member 24 is suppressed and the linearity of the array of the end 28 in the direction D2 is sufficiently maintained.