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    • 41. 发明专利
    • Rewritable optical element material
    • 可靠的光学元件
    • JP2004347642A
    • 2004-12-09
    • JP2003141353
    • 2003-05-20
    • Nitto Denko Corp日東電工株式会社
    • HORIIKE MIKAHINO ATSUSHIURAIRI MASAKATSUKATAYAMA SHIGERU
    • G02B1/04G11B7/24G11B7/244
    • PROBLEM TO BE SOLVED: To provide a rewritable optical element material capable of exhibiting the optical element function with excellent stability even when a plastic base material is used. SOLUTION: The rewritable optical element material is constituted with the plastic base material including a material which absorbs irradiation energy of laser having a pulse width of 10 -12 sec or less and is capable of forming a changeable structure part which exhibits the optical element function at least partially on the plastic base material. The changeable structure part is formed so that, when being irradiated with the laser of a pulse width of 10 -12 sec or less, the structure of the plastic base material is changed and, when being heated or being irradiated with ultra-violet ray, the structure of the plastic base material is returned to the structure before being changed and the structural change is erased. The changeable structure part can be formed at least partially and three-dimensionally on the plastic base material. COPYRIGHT: (C)2005,JPO&NCIPI
    • 要解决的问题:即使使用塑料基材,提供能够显示光学元件功能的可重写光学元件材料,具有优异的稳定性。 解决方案:可重写光学元件材料由塑料基材构成,该塑料基材包括吸收脉冲宽度为10 -12 /秒或更小的激光的照射能量的材料,并且能够形成 可变结构部分,其表现出至少部分地在塑料基材上的光学元件的功能。 可变结构部分形成为当用脉冲宽度为10 -12 sec或更小的激光照射时,改变塑料基材的结构,并且当被加热或被 用紫外线照射,塑料基材的结构在改变之前返回到结构,结构变化被消除。 可变形结构部分可以至少部分地和三维地形成在塑料基材上。 版权所有(C)2005,JPO&NCIPI
    • 47. 发明专利
    • Method for manufacturing mold for forming structure having minute hole part and method for manufacturing the structure using the mold
    • 用于制造用于形成具有分钟孔的结构的模具的方法和使用模具制造结构的方法
    • JP2003334817A
    • 2003-11-25
    • JP2002147375
    • 2002-05-22
    • Nitto Denko Corp日東電工株式会社
    • URAIRI MASAKATSUKATAYAMA SHIGERUHORIIKE MIKAHIRAO KAZUYUKI
    • B29C33/38
    • PROBLEM TO BE SOLVED: To provide a method for manufacturing a mold for forming a structure having minute hole parts by making a plastic structure in which an uneven structure is accurately formed on a plastic surface as the original mold of the mold without causing environmental issues such as environmental pollution and recycling.
      SOLUTION: The method includes a process A for forming the original mold of the mold by forming a plurality of hole parts of 0.3-30 μm in diameter in the plastic at intervals of the diameter or above by making the inside of the plastic be irradiated with ultra-short pulse laser beams of 10
      -12 sec or below in pulse duration, a process B for coating the surface of the original mold of the mold formed in the process A with a mold material, and a process C for separating a mold material-coated layer formed in the process B as the mold from the original mold of the mold.
      COPYRIGHT: (C)2004,JPO
    • 要解决的问题:提供一种用于制造具有微小孔部分的结构的模具的方法,该模具通过制造在塑料表面上精确地形成不均匀结构的塑料结构作为模具的原始模具而不引起 环境问题,如环境污染和回收利用。 解决方案:该方法包括用于通过在塑料中以直径或以上的间隔在塑料中形成直径为0.3-30μm的多个孔部分来形成模具的原始模具的方法A,通过制造塑料的内部 在脉冲持续时间内用10 -12 sec以下的超短脉冲激光束照射过程B,用于用模具材料涂覆在工艺A中形成的模具的原始模具的表面 以及用于将作为模具的工艺B中形成的模具材料涂层与模具的原始模具分离的工艺C。 版权所有(C)2004,JPO
    • 48. 发明专利
    • Method for selectively etching inorganic material, inorganic material selectively etched therewith and optical element
    • 无选择地蚀刻无机材料的方法,选择性地选择无光材料和光学元件
    • JP2003329821A
    • 2003-11-19
    • JP2002140956
    • 2002-05-16
    • Nitto Denko Corp日東電工株式会社
    • URAIRI MASAKATSUKATAYAMA SHIGERUNAKAMURA TOSHITAKAHORIIKE MIKAHIRAO KAZUYUKI
    • G02B5/18
    • PROBLEM TO BE SOLVED: To provide a method for selectively etching an inorganic material which is subjected to micro fabrication based on lowering of a fabrication threshold value of the inorganic material and efficient selective etching of only a specified part of the inorganic material. SOLUTION: The method for selectively etching the inorganic material is characterized by being equipped with following steps (A)-(C). In the step (A) a film of the second component to lower the fabrication threshold value of the inorganic material is formed on the inorganic material. In the step (B) a varied structure part is formed in the inorganic material by irradiation of condensed laser light thereto from the film of the second component side. In the step (C) the film of the second component is removed and the varied structure part of the inorganic material is selectively dissolved with an etchant. Glass is a suitable material for the inorganic material. A metal oxide containing indium as the main component of metal atoms is a suitable material for the second component. The second component optionally contains a polysilane type polymer. COPYRIGHT: (C)2004,JPO
    • 要解决的问题:提供一种基于降低无机材料的制造阈值并且仅对特定部分无机材料进行有效选择性蚀刻来选择性地蚀刻受到微制造的无机材料的方法。 解决方案:选择性蚀刻无机材料的方法的特征在于配备以下步骤(A) - (C)。 在步骤(A)中,在无机材料上形成用于降低无机材料的制造阈值的第二成分的膜。 在步骤(B)中,通过从第二部件侧的膜照射聚光的激光,在无机材料中形成各种结构部分。 在步骤(C)中,除去第二组分的膜,并用蚀刻剂选择性地溶解无机材料的各种结构部分。 玻璃是无机材料的合适材料。 含有铟作为金属原子的主要成分的金属氧化物是第二成分的合适的材料。 第二组分任选地含有聚硅烷型聚合物。 版权所有(C)2004,JPO