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    • 41. 发明专利
    • ELECTRON BEAM EXPOSING APPARATUS
    • JPS5998523A
    • 1984-06-06
    • JP20783282
    • 1982-11-27
    • NIPPON TELEGRAPH & TELEPHONE
    • SHIBAYAMA AKINORI
    • H01L21/027G03F7/20H01J37/304
    • PURPOSE:To detect the change of relative positional relation with time within a short period of time and control the electron beam radiation position by disposing a conductive material piece providing a mark between the electron beam reflecting cylinder and an exposing sample setting surface of stage. CONSTITUTION:An electron beam is deflected to an orbit 18' and is located to 8-3 by a deflector 16 depending on the signal sent from a deflection control circuit 2 and moreover the reference mark 8 is focused by a focusing coil 17. The mark itself 8-1 of mark 8 is scanned by electron beam with the deflector 6 as indicated by a locus 8-4X or 8-4Y. The reflected electrons are captured by the reflected electron detector 7 and are sent to a signal processing circuit 3. The deflected data 13 and reflected electron signal inputted are compared each other. Corresponding mark position deflecting data is transferred to a computer 1, held therein and DELTAX, DELTAY are transferred to the deflection control circuit 2 and held therein. Change with time of electron beam position for the electron beam reflecting cylinder is compensated by renewing DELTAX and DELTAY.
    • 49. 发明专利
    • METHOD FOR CORRECTING DISTORTION OF ELECTRON BEAM EXPOSURE DEVICE AND CIRCUIT THEREOF
    • JPS55102231A
    • 1980-08-05
    • JP850479
    • 1979-01-27
    • NIPPON TELEGRAPH & TELEPHONE
    • SHIBAYAMA AKINORISHIMAZU NOBUO
    • H01L21/027H01J37/304
    • PURPOSE:To provide pictures to the sample that moves continuously by adding both the quantity of movement of the sample location from the measurement of distortion to the correction of picturing data and the quantity of compensation of deflection location to the picturing data which is obtained by correcting the distortion of the shape of sample. CONSTITUTION:First, the marks at four corners of the area (1, 1) are detected, previously held correction values 12, 13 are subtracted from the measured values 10, 11 of the sample location to compensate the measured values. On the other hand, the area (1, 1) is divided into the form of a matrix, the quantity of distortion correction corresponding to the central coordinates of each element area is stored 5, read by the signal 3, 4, addition and subtraction are applied to it to compensate the location 1, 2 given by the distortion of the shape of sample. The data, which are obtained by applying the addition and subtraction to the corrected outputs 18-21, are compensated 31, 32 by previously stored deflection location errors that are read by the signals 26, 27. By repeating the operation, the picture can precisely be provided to the desired position of the sample that moves continuously. Also the correction factors can be computed by the circuits 5, 28, the location error of a sample that moves at the speed of about 20mm/sec is 0.02mum per 1mu sec of the operation time.
    • 50. 发明专利
    • MEASURING UNIT OF ELECTRON BEAM DENSITY DISTRIBUTION AND ITS MEASURING METHOD
    • JPS5587071A
    • 1980-07-01
    • JP15918478
    • 1978-12-26
    • NIPPON TELEGRAPH & TELEPHONE
    • SHIBAYAMA AKINORIKOYABU KUNIO
    • G01T1/29
    • PURPOSE:To measure the two dimensional density distribution with high accuracy and resolution, by deflecting and impinging measured electron beam on the sharp angle of single crystal piece two-dimensionally. CONSTITUTION:When the deflector 10 is controlled with the digital coordinate signal from the operation unit 13 providing the memory corresponding to the coordinates (i, j) of the virtual matrix 24, the electron beam 1 is deflected two-dimensionally with the DA converters 11, 12 and deflectors 14, 15, and the corner of the single crystal material 17 having sharp sectional shape located on the tool 23 is irradiated, and no reflection electron beam from the tool 23 is impinged on the reflection electron detector 3 placed opposingly to the upper surface a of the crystal material 17, and the reflection beam from the surface a is detected with the detector 3 with the catching rate in response to the direction of deflection of the electron beam. The result of detection is stored at the coordinate corresponding to the memory of the unit 13, and the unit 13 calculates and determines the two-dimensional density distribution of electron beam with high accuracy and resolution according to the memory content of the result of detection per each coordinate.