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    • 42. 发明专利
    • HEAD ACTUATOR MECHANISM
    • JP2000357376A
    • 2000-12-26
    • JP16745299
    • 1999-06-14
    • MATSUSHITA ELECTRIC IND CO LTD
    • IMADA KATSUMIMORITOKI KATSUNORIKAWASAKI OSAMU
    • G11B21/10
    • PROBLEM TO BE SOLVED: To obtain a head actuator mechanism integrally performing both of coarse movement and fine movement of the head. SOLUTION: The mechanism is provided with a piezoelectric body 6 applied with a specific AC voltage, a protrusion 15 connected with an elastic body 5 which is adhered to one surface of the piezoelectric body 6, a moving body 11 linked with the movement of the protrusion 15, a supporting arm 2 connected with the moving body 11, and a magnetic head 3 arranged on the supporting arm 2, then the voltage is applied on the piezoelectric body 6 so that the specific standing wave is formed on the circumferential direction which a specified point in the surface of the piezoelectric body 6 is substantially made to the center, and the moving body 11 is rotationally moved in the surface substantially vertical to the oscillating direction of the standing wave, then the magnetic head 3 is rotated with the rotational movement of the moving body 11. The both coarse movement and fine movement of the magnetic head 3 are allowed by controlling only the amplitude and/or the frequency of the AC voltage applied on the piezoelectric body 6.
    • 49. 发明专利
    • PIEZOELECTRIC RESONATOR
    • JPH1051260A
    • 1998-02-20
    • JP19871996
    • 1996-07-29
    • MATSUSHITA ELECTRIC IND CO LTD
    • TAKEDA KATSUMORITOKI KATSUNORINAKAJIMA YASUOIKEDA HIROYASUDOI TOSHIKATSU
    • H03H9/17
    • PROBLEM TO BE SOLVED: To suppress the spurious due to a thickness tilt of a piezoelectric element in the shape of a vibration electrode for a thickness vertical containment type piezoelectric resonator by adding a rectangular vibration electrode to a piezoelectric element that has a tilt in its thickness direction. SOLUTION: A piezoelectric resonator 8 consists of the rectangular vibration electrodes 2 and 3, the extraction electrodes 4 and 6 and the connection electrodes 5 and 7 which are formed on both opposite main surfaces of a piezoelectric element 1. The electrode 2 is connected to the electrode 4 positioned at a point near one of both ends of the element 1 in its longer side direction via the electrode 5, and the electrode 3 is connected to the electrode 6, positioned at a point near the other end of the element 1 in its longer side direction via the electrode 7 respectively. For example, if the element 1 has the thickness vertical containment type resonance frequency of about 25MHz and has a ratio of 0.03 to 0.1% set for a thin part with respect to a thick part of the element 1, the spurious can be reduced most effectively with a ratio of 50 to 70%, set for the shorter side with respect to the longer side of a vibration electrode.
    • 50. 发明专利
    • PIEZOELECTRIC RESONANCE COMPONENT AND ITS MANUFACTURE
    • JPH09238043A
    • 1997-09-09
    • JP4257796
    • 1996-02-29
    • MATSUSHITA ELECTRIC IND CO LTD
    • TAKEDA KATSUMORITOKI KATSUNORISUGIMOTO MASAHITOSOGO HIROSHIHASE HIROYUKIIKEDA HIROYASU
    • H03H3/02H03H9/02H03H9/17
    • PROBLEM TO BE SOLVED: To obtain a stable vibration space and an excellent sealing performance at a low cost by interposing a resin layer blended with plural solid materials with ununiform shape between a seal plate and a piezoelectric resonator so as to form the vibration space at a region in the vicinity of a vibration electrode of a piezoelectric resonator. SOLUTION: A resin layer 5 is placed between a piezoelectric resonator 1 and a seal plate 4 to form a vibration space. In the case that the shape and the size of solid materials are nearly uniform and that the piezoelectric resonator 1 and the sealing plate 4 are formed to be flat plates, the thickness of a resin layer is decided definitely by the size of the solid materials and excellent sealing performance is obtained. However, there are bents or waves in the piezoelectric resonator 1 and the sealing plate 4, then the uneven thickness of the resin layer 5 is increased to lose the sealing performance. Thus, the solid materials whose shape and size are not uniform are blended, and then even when there are bents or waves in the piezoelectric resonator 1 and the sealing plate 4, the solid materials are dispersed properly, and the rate of assisting the uneven thickness of the resin layer 5 is reduced more the case that the shape and the size of the solid materials are nearly uniform, and the rate of losing the air-tightness is decreased.