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41. 发明专利

JP2001348245A REINFORCED GLASS, METHOD FOR MANUFACTURING THE SAME AND GLASS FOR DISPLAY 失效
公开(公告)号：JP2001348245A
公开(公告)日：2001-12-18
申请号：JP2000166574
申请日：2000-06-02
申请人： HOYA CORP
发明人： HACHITANI YOICHI
IPC分类号： C03B27/04 , C03C3/085 , C03C3/087 , C03C3/095 , C03C21/00 , H01J29/86
摘要： PROBLEM TO BE SOLVED: To provide reinforced glass having high bending strength and thick stress-strained layer, glass for a display consisting of the reinforced glass, and particularly to provide a glass panel for a cathode ray tube and a cathode ray tube. SOLUTION: The reinforced glass is prepared by chemically reinforcing a physically reinforced base glass at the temperature lower than the strain point of the base glass. The reinforced glass has a stress-strained layer of >=250 μm thickness and >=300 MPa bending strength. The glass for a display consists of the aforementioned reinforced glass. The glass panel for a cathode ray tube consists of the glass for a display and the cathode ray tube has the aforementioned glass panel.

42. 发明专利

JPH10190190A BOARD AND ITS MANUFACTURE 失效
公开(公告)号：JPH10190190A
公开(公告)日：1998-07-21
申请号：JP29661897
申请日：1997-10-29
申请人： HOYA CORP
发明人： HACHITANI YOICHI , WATANABE ITARU
IPC分类号： H05K1/11 , H05K3/00 , H05K3/40
摘要： PROBLEM TO BE SOLVED: To provide a board which can realize the high-density mounting of semiconductors, such as the both-side mounting, multilayered mounting, multi- surface mounting, etc., by cutting a block body into two or more pieces so that linear conductors and/or heat conductors may conduct the front sides to the rear sides of the pieces. SOLUTION: A block composed of such an insulating material as glass, etc., in which linear conductors are buried is cut into pieces so that the cut faces of the conductors may appear on the cut face of the insulating material. In such a way, a substrate can be manufactured. Since the board is obtained by cutting the insulating material containing buried linear conductors, complicated processes for driving the insulating material and making plating, etc., for providing the conductors becomes unnecessary. In addition, the cutting of the insulating material containing the buried conductors can be performed easily by utilizing the cutting method of glass, etc., as it is. The insulating material can be cut in a direction which is substantially perpendicular to the conductors and, when required, in another direction which is not perpendicular to the conductors.

43. 发明专利

JPH05178640A GLASS CERAMICS 失效
公开(公告)号：JPH05178640A
公开(公告)日：1993-07-20
申请号：JP34743291
申请日：1991-12-27
申请人： HOYA CORP
发明人： HACHITANI YOICHI
IPC分类号： C03C10/16
摘要： PURPOSE:To provide glass ceramics having excellent machinability, high mechanical strength and stability to devitrification. CONSTITUTION:Sodium-calcium mica is deposited as a principal crystal phase from glass contg. 30-55% Si , 8-20% Al , 25-50% Mg , 1-10% Na , 0.1-10% Ca and 0.1-7% Zn as cation components and further contg. fluorine and oxygen as anion components to obtain the objective glass ceramics.

44. 发明专利

JP2003226548A PHOTOSENSITIVE GLASS, METHOD OF PROCESSING THE SAME, METHOD OF MANUFACTURING MEMBER FOR INK JET PRINTER, AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE 有权
公开(公告)号：JP2003226548A
公开(公告)日：2003-08-12
申请号：JP2002025872
申请日：2002-02-01
申请人： HOYA CORP
发明人： HACHITANI YOICHI
IPC分类号： B41J2/16 , C03C3/095 , C03C4/04 , C03C10/12 , C03C14/00
摘要： PROBLEM TO BE SOLVED: To provide photosensitive glass capable of being easily processed, a method of processing the same, a member for an ink jet printer, which is obtained by using the photosensitive glass, and a method of manufacturing a semiconductor substrate. SOLUTION: The photosensitive glass contains CeO 2 and has transmittance characteristics that the spectral transmittance (in term of the thickness of 1 mm) at the wavelength of 250 nm is ≥11%, and the spectral transmittance (in term of the thickness of 1 mm) at the wavelength of 500 nm becomes ≤10% after being irradiated with ultraviolet rays in a wavelength region of 290 to 340 nm, having an energy density in a range of 500 to 700 mj/cm 2 in air and further being subjected to heat treatment at 580°C for 2 h. The method of processing the glass above, the member for an ink jet printer, which is obtained by using the photosensitive glass, and the method of manufacturing the semiconductor substrate are also provided. COPYRIGHT: (C)2003,JPO

45. 发明专利

JP2002060242A FUNNEL FOR CATHODE RAY TUBE AND CATHODE RAY TUBE USING THE SAME 失效
公开(公告)号：JP2002060242A
公开(公告)日：2002-02-26
申请号：JP2000247442
申请日：2000-08-17
申请人： SONY CORP , HOYA CORP
发明人： ASAKI TAMAO , MITOKU MASATAKA , OKADA MASAMICHI , HASHIMOTO MITSUO , WATANABE ITARU , HACHITANI YOICHI
IPC分类号： C03C3/105 , C03C4/08 , C03C21/00 , H01J29/86
摘要： PROBLEM TO BE SOLVED: To decrease the weight of a CRT as a whole without decreasing the shock resistance, pressure resistance or the like of a funnel. SOLUTION: The funnel for a cathode ray tube is obtained by chemically strengthening glass containing, by wt.%, 45 to 60% SiO2, 0.1 to 15% Al2O3, 5 to 20% Na2O and 15 to 30% PbO. The cathode ray tube is obtained by using the above funnel for a cathode ray tube.

46. 发明专利

JP2000236147A GLASS SUBSTRATE AND MANUFACTURE THEREOF 失效
公开(公告)号：JP2000236147A
公开(公告)日：2000-08-29
申请号：JP3483799
申请日：1999-02-12
申请人： HOYA CORP
发明人： HACHITANI YOICHI
IPC分类号： H05K1/03 , C03C3/066 , H01L23/15
摘要： PROBLEM TO BE SOLVED: To provide an electronic component glass board which is equipped with a glass board that is useful as a semiconductor mounting board, possessed of an embedded conductor, and provided with a front and a rear surface which are electrically connected together, and a surface circuit or a pattern that is high in durability and resistance to etchants. SOLUTION: A conductor is embedded in a borosilicate glass base material, which is lower in viscosity than 104 Pas at a certain temperature below 1,000 deg.C and contains 25 or more mol.% ZnO or 15 or more mol.% B2O3 for the formation of a glass board provided with the front and rear surface which are electrically connected together, and a circuit or a pattern is formed on the surface of a no-alkali borosilicate glass board, which contains 1 to 45 mol.% SiO2 and at least one selected from among oxides such as Al2O3, ZrO2, TiO2, and P2O5 for the formation of an electronic component glass board.

47. 发明专利

JP2000001332A CIRCUIT BOARD MATERIAL 失效
公开(公告)号：JP2000001332A
公开(公告)日：2000-01-07
申请号：JP10394899
申请日：1999-04-12
申请人： HOYA CORP
发明人： HACHITANI YOICHI
IPC分类号： H05K1/03 , C03C3/16 , C03C3/17 , C03C3/247
摘要： PROBLEM TO BE SOLVED: To obtain a circuit board material excellent in flatness, smoothness, electric insulating property, etc., and having an appropriate coefft. of thermal expansion by using alkali-free glass contg. specified amts. of P2O5, BaO, Al2O3, ZnO and SrO. SOLUTION: The circuit board material comprises alkali-free glass contg., by weight, 35-70% P2O5, 20-60% BaO, 0-5% Al2O3, 0-15% ZnO and 0-20% SrO, preferably contg. 40-65%, in particular 40-50% P2O5, 30-50%, in particular 35-50% BaO, 0.1-5% Al2O3, 0-13%, in particular 0-10% ZnO and 0-18% SrO and preferably having 0.1-20%, in particular 0.1-18% total content of ZnO and SrO. The glass may further contain one or more selected from CaO, MgO, TiO2, ZrO2, Nb2O5, Sb2O3, B2O3, SiO2, SnO2, La2O3, Bi2O3 and F.

48. 发明专利

JPH1072234A GLASS MATERIAL FOR CARRYING PHOTOCATALYST 失效
公开(公告)号：JPH1072234A
公开(公告)日：1998-03-17
申请号：JP24884496
申请日：1996-08-30
申请人： HOYA CORP
发明人： HACHITANI YOICHI , NISHII YOSHIKAZU
IPC分类号： A61L9/00 , B01J32/00 , B01J35/02 , C02F1/30 , C02F1/72 , C03C3/064 , C03C3/091 , C03C3/093
摘要： PROBLEM TO BE SOLVED: To obtain a glass material capable of suppressing the deterioration of the activity of a photocatalyst by using low alkali silicate glass contg. specified amts. of SiO2 and alkali components, aluminosilicate glass, borosilicate glass or alkali-free glass. SOLUTION: Starting materials for glass are weighed and mixed so as to obtain a desired compsn. and the resultant mixture is melted by heating at 1,200-1,650 deg.C for 2-4hr, homogenized by stirring, refined, poured into a casting mold and slowly cooled to obtain the objective glass material for carrying a photocatalyst having >=75% transmissivity at the wavelength of light exciting the photocatalyst in the case of 10mm thickness. This glass material has a compsn. contg., by weight, 30-70% SiO2 , 1-35% Al2 O3 , 0-20% MgO, 0-20% CaO, 0-20% SrO, 0-40% BaO, 0-20% ZnO, 0-10% Li.0, 0-10% Na2 O, 0-10% K2 O and 0-10% Cs2 O (0%

49. 发明专利

JPH09199011A MANUFACTURE OF SUBSTRATE WITH PILLAR FOR SELF-EMISSION TYPE DISPLAY 失效
公开(公告)号：JPH09199011A
公开(公告)日：1997-07-31
申请号：JP29651796
申请日：1996-11-08
申请人： HOYA CORP
发明人： SAGARA HIROHARU , HACHITANI YOICHI
IPC分类号： H01J9/24 , H01J5/03 , H01J9/02 , H01J29/86 , H01J29/87 , H01J31/12
摘要： PROBLEM TO BE SOLVED: To provide the manufacture of a substrate with spacer for self- emission type display, in which accuracy and heat resistance of a spacer is improved and roughness of the substrate surface is hard to be developed, by forming spacers made of non-exposure photosensitive glass on a glass substrate. SOLUTION: A glass mask 13 having a chrome film pattern 12 at about 100μm of diameter is adhered to the main surface of a photosensitive glass 11, and exposed by a ultraviolet-ray radiating lamp so as to form a latent image part 14 corresponding to the exposed part (a). A non-photosensitive glass substrate 15 is superposed on the photosensitive glass 11 (b), and a load at about 50kg/cm is applied thereto, and heat treated at about 550 deg.C, and the latent image part 14 is crystallized so as to form a crystallized glass part, and while the superposed parts are adhered to each other (c). Etching is performed so as to melt the crystallized glass part for elimination, and washing with water is performed, and a glass substrate 15, on which pillar-shaped spacers 17 of the non-exposed and the non-crystallized part are arranged in order, is obtained.

50. 发明专利

JPH1050970A SOLID-STATE IMAGE SENSOR, GLASS PLATE AND PRODUCTION OF SOLID-STATE IMAGE SENSOR 失效
公开(公告)号：JPH1050970A
公开(公告)日：1998-02-20
申请号：JP20574596
申请日：1996-08-05
申请人： HOYA CORP
发明人： HACHITANI YOICHI
IPC分类号： H01L27/14 , H01L23/02
摘要： PROBLEM TO BE SOLVED: To provide a solid-state image sensor excellent in shape accuracy and reliability. SOLUTION: The solid-state image sensor is made of glass and components are mounted on a base plate 1 having upper surface where warping is suppressed. A frame member 2 having an elongated central hole is bonded onto the base plate 1. A chip 3 mounting a charge transfer element is set in the hole. Leads 4a, 4b corresponding, in number, to the electrode terminals of the chip 3 are arranged on the frame member 2. Each lead 4a, 4b is connected with the electrode terminals of the chip 3 through a bonding wire 5a, 5b. A frame member 6 is bonded onto the frame member 2 while sandwiching the lead 4a, 4b. An elongated hole for ensuring the region of the chip 3 and the region of the bonding wires 5a, 5b connecting the chip 3 with the lead 4 is made in the center of the frame member 6. A cover glass 7 is bonded onto the frame member 6.

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