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41. 发明专利

JPS54146985A Package for semiconductor device 失效
标题翻译：半导体器件封装
公开(公告)号：JPS54146985A
公开(公告)日：1979-11-16
申请号：JP5449878
申请日：1978-05-10
申请人： Hitachi Ltd
发明人： TSUNENO HIROSHI , OKIKAWA SUSUMU , HORIUCHI KATSUTADA , KITAMURA WAHEI , YAMAMOTO EIJI
IPC分类号： H01L23/02 , H01L21/8247 , H01L27/14 , H01L29/788 , H01L29/792 , H01L31/0203 , H04N5/335 , H04N5/372
CPC分类号： H01L31/0203 , H01L2224/48091 , H01L2924/16195 , H01L2924/00014
摘要： PURPOSE:To make it possible to perform a low-temperature sealing with a good light transfer characteristic of a light transmission part by sealing a bar-shaped cap material, where a glass plate for light transmission is fixed to the upper face side or the lower face side of the window part directly or through intermediate materials, in a base assembly by welding. CONSTITUTION:Base assembly 10 has a ceramic base haivng the chip arrangement part, where a semiconductor chip should be arranged, in the face side opposite to cap assembly 30 and frame material 20 which is fixed onto the chip while surrounding the chip arrangement part and can be welded. Meanwhile, assembly 30 is provided with frame material 31 which should be superposed onto frame material 20 and can be welded, and glass plate 37 for light transmission is equipped in the upper side face or the lower side face so that the window part of material 31 may be enclosed. As a result, a low-temperature sealing can be performed with a good light transfer characteristic of the light transmission part by superposing rame materials 20 and 31 onto each other and welding and sealing them.
摘要翻译：目的：通过密封条形帽材料，可以通过密封透光部分的良好的光传递特性来进行低温密封，其中用于透光的玻璃板固定在上表面侧或下表面窗口部分的正面部分直接或通过中间材料，通过焊接在基座组件中。构成：基座组件10具有一个陶瓷基座，该陶瓷基座配置有芯片布置部分，其中半导体芯片应该布置在与盖组件30相对的正面以及固定在芯片上的框架材料20，同时围绕芯片布置部分并且可以焊接。同时，组件30设置有框架材料31，框架材料31应重叠在框架材料20上并且可以被焊接，并且用于透光的玻璃板37装配在上侧面或下侧面中，使得材料31的窗口部分可以封闭。结果，通过将反射材料20和31叠置在一起并进行焊接和密封，可以以光传输部分的良好的光传输特性进行低温密封。

42. 发明专利

JPS5487185A PACKAGE FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS5487185A
公开(公告)日：1979-07-11
申请号：JP15448977
申请日：1977-12-23
申请人： HITACHI LTD
发明人： KITAMURA WAHEI , MOMONA HIROSHI
IPC分类号： G11C17/00 , G11C11/34 , G11C16/02 , H01L21/8247 , H01L23/02 , H01L23/08 , H01L29/76 , H01L29/788 , H01L29/792
摘要： PURPOSE:To bond the lid of glass of ultraviolet ray transparency on the main body with resin system adhesive, by using the molding body of resin system material as the package main body. CONSTITUTION:The semiconductor pellet 2 is fitted to the package main body consisting of resin molder. Next, wiring is made with the lead frame 4 by means of the bonding wire 3. Further, the lid 3 consisting of the ultraviolet ray transparent glass is bonded on the package main body 1 with the resin adhesives 6. With the above constitution, since the main body 1 is the resin molder, the cost is lower and the bonding strength of the lid 5 is greater. Then, the heat treatment process in using low melting point glass is made unnecessary and the manufacturing process can be simplified.

43. 发明专利

JP2000043979A MANUFACTURE OF PACK OF SURFACE-MOUNTED SEMICONDUCTOR PACKAGE 失效
公开(公告)号：JP2000043979A
公开(公告)日：2000-02-15
申请号：JP21861999
申请日：1999-08-02
申请人： HITACHI LTD
发明人： KITAMURA WAHEI , MURAKAMI HAJIME
IPC分类号： B65D85/86 , B65D81/26
摘要： PROBLEM TO BE SOLVED: To prevent peeling of package interface and cracks due to absorption of moisture of a surface-mounted semiconductor package. SOLUTION: The material for manufacturing a pack of a surface-mounted semiconductor package includes processes of baking the surface-mounted semiconductor package 12 which has been resin-sealed, receiving the baked semiconductor package in a magazine 13 or a tray or a tape, receiving the magazine 13 or the tray or the tape with the semiconductor package received in a bag-like moisture-proof member 11 which is a packaging bag having moisture permeability of 2.0 g/m2.24 hrs or less together with moisture-proof agent, and sealing the bag.

44. 发明专利

JPH0717592A TRAY FOR TRANSPORTATION OF DEVICE 失效
公开(公告)号：JPH0717592A
公开(公告)日：1995-01-20
申请号：JP14468593
申请日：1993-06-16
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： KITAMURA WAHEI , NUMAZAKI MASAHITO
IPC分类号： B65D85/00 , B65D85/86 , H01L21/673 , H01L21/68
摘要： PURPOSE:To provide a tray for transportation of integrated circuits, which prevents lead wires of circuits from shifting or deforming during appearance inspections. CONSTITUTION:A pocket 3 for containing a semiconductor IC device 2 is provided at the front face 1a side of a tray 1. Holes 4 for tweezers from which the semiconductor IC device 2 is taken out with tweezers or the like are molded integrally with the pocket 3 at respective four sides of pocket 3. The holes 4 for tweezers are formed by protrusions projecting from the front surfaces 1a side of transferable tray 1 to the rear face thereof and the semiconductor IC device on the rear face of transferable tray 1 is restricted its moving by the protrusion.

45. 发明专利

JPH05330584A SEMICONDUCTOR DEVICE TRAY 失效
公开(公告)号：JPH05330584A
公开(公告)日：1993-12-14
申请号：JP12898792
申请日：1992-05-21
申请人： HITACHI LTD , HITACHI VLSI ENG
发明人： WADA TAMAKI , NUMAZAKI MASAHITO , KITAMURA WAHEI
IPC分类号： B65D85/00 , B65D85/38 , B65D85/86 , H01L21/673 , H01L21/68
摘要： PURPOSE:To comply with flexible production, moreover to reduce the design, manufacturing and management costs by providing steps on side walls of package containing portions, for enabling multi-stacking of a plurality of packages different in shape and size, in a tray for conveying and shipping LSI packages. CONSTITUTION:A semiconductor device tray 1 is formed by a synthetic resin molding body, and a plurality of package containing portions 3 are provided thereon. Then, step portions 4 formed into a step shape are formed on the side walls of the package containing portions 3. Moreover, LSI packages 2 different in length are contained in the package containing portions 3 so as to be overlapped without contacting to each other. By this construction, plural kinds of the LSI packages 2 can be contained in one tray, so that the kinds of trays can be decreased.

46. 发明专利

JPH0446452B2 失效
公开(公告)号：JPH0446452B2
公开(公告)日：1992-07-30
申请号：JP17794483
申请日：1983-09-28
申请人： HITACHI LTD
发明人： OKIKAWA SUSUMU , SUZUKI HIROMICHI , KITAMURA WAHEI , MIKINO HIROSHI
IPC分类号： H01L21/60 , H01L21/48

47. 发明专利

JPH0338738B2 失效
公开(公告)号：JPH0338738B2
公开(公告)日：1991-06-11
申请号：JP14113982
申请日：1982-08-16
申请人： HITACHI LTD
发明人： OOTSUKA KENICHI , KITAMURA WAHEI , MIKINO HIROSHI , SATO HAJIME
IPC分类号： H01L21/603 , H01L21/60

48. 发明专利

JPH0373562A ELECTRONIC PARTS AND LEAD FRAME THEREFOR 失效
公开(公告)号：JPH0373562A
公开(公告)日：1991-03-28
申请号：JP21028489
申请日：1989-08-14
申请人： HITACHI LTD
发明人： SATO HAJIME , KITAMURA WAHEI
IPC分类号： H05K3/34 , H01L23/50 , H05K1/18
摘要： PURPOSE:To improve the yield of package, even for a lead having fine pitch, by providing a clad layer for making uniform the amount of solder at the tip of the lead in a gull wing type semiconductor device. CONSTITUTION:A semiconductor device 1 comprises an insulating resin package 2 and a plurality of leads 3 of metallic body projecting in parallel from four sides of the package 2. The lead 3 is provided with a solder clad layer 8 in the mounting region on the rear surface at the outer mounting end 4. The semiconductor device 1 is mounted on a wiring substrate 15 such that the mounting end 4 of each lead 3 is lapped over a footprint 17 arranged on the surface of the wiring substrate 15. Each mounting end 4 section is then subjected to partial heating through irradiation of infrared beam and the like. Consequently, the clad layer 8 is melted and spread over the footprint 17 on the wiring substrate 15. Solder 19 is set upon stoppage of heating and the mounting end 4 is secured to the footprint 17. By such arrangement, appropriate amount of solder can be provided and leakage of solder or formation of solderbridge can be prevented.

49. 发明专利

JPH01134958A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01134958A
公开(公告)日：1989-05-26
申请号：JP29201087
申请日：1987-11-20
申请人： HITACHI LTD
发明人： SATO HAJIME , NISHI KUNIHIKO , KITAMURA WAHEI
IPC分类号： H01L23/50 , H01L21/60
摘要： PURPOSE:To render a semiconductor device thinner by a method wherein a lead and a suspension lead are built of a metal foil, a prescribed spot on the lead is covered by a non-conductive film, the leads are formed thinner, and the need of bonding wires is eliminated. CONSTITUTION:A semiconductor device of this design is constituted of a semiconductor pellet 1 sealed in a package, a lead 5a with one end connected to the pellet 1 and the other end extending out from the package, and a suspension lead 5b installed on the upper surface of the pellet 1. The lead 5a and the suspension lead 5b are constituted of a metal foil. A specified spot on the lead 5a is covered by a non-conductive film 7. In such a design, the lead 5a and the suspension lead 5b may be thinner and bonding wires are not needed, both contributing to a further reduction in thickness of the semiconductor device.

50. 发明专利

JPS6458670A MOISTUREPROOF PACKAGING BAG OF ELECTRONIC PART 失效
公开(公告)号：JPS6458670A
公开(公告)日：1989-03-06
申请号：JP20629087
申请日：1987-08-21
申请人： HITACHI LTD
发明人： KITAMURA WAHEI , MURAKAMI HAJIME , NISHI KUNIHIKO
IPC分类号： B65D25/54 , B65D33/04 , B65D81/26 , B65D85/38 , B65D85/86 , G09F3/02
摘要： PURPOSE:To easily confirm the hygroscopic state of the interior of a transparent moistureproof packaging bag from outside, by providing a humidity indicator detecting the internal humidity of the transparent moistureproof packaging bag for packaging an electronic part in a moistureproof state at a position visible from outside. CONSTITUTION:A receiving container 3 having plurality of electronic parts 2 such as surface mounting semiconductor devices received therein is received in an inner box 4 which is, in turn, inserted in a bag like moistureproof member 1 and both end parts 1A, 1B of said member 1 are sealed to perform moistureproof packaging. In performing the moistureproof packaging, a humidity indicator 5 detecting the humidity in a moistureproof packaging bag 100 is provided on the inner side surface of the transparent bag like moistureproof member 1 at a position visible from the outside. For example, a humidity detecting label 5 is bonded to the inside of the transparent bag like moistureproof member 1 by an adhesive member 6 having vent holes 6A so as to be capable of being confirmed from outside. For example, as the humidity detecting label, a material prepared by impregnating paper made of pulp with a substance discoloring by humidity such as cobalt chloride is used.

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