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41. 发明专利

JP2010266107A Gas temperature control device 审中-公开
标题翻译：气体温度控制装置
公开(公告)号：JP2010266107A
公开(公告)日：2010-11-25
申请号：JP2009117183
申请日：2009-05-14
申请人： Daikin Ind Ltd , ダイキン工業株式会社
发明人： TERAKI JUNICHI
IPC分类号： F25B21/02
摘要： PROBLEM TO BE SOLVED: To provide a gas temperature control device in which small and light-weight fins are jointed to Peltier elements to maximize heat exchange by the fins.
SOLUTION: The gas temperature control device 1 includes a plurality of thermoelectric units 3 and a support body 5. The thermoelectric unit 3 is formed, by nipping the Peltier element 11, by using the opposite side to a heat-absorbing face 7 as a heat release face 9 between a heat absorbing fin 15 jointed to the heat absorbing face 7 via a fin base 13 and a heat release fin 19 jointed to the heat release face 9 via a fin base 17. The support body 5 is formed, by framing vertical frames 21, 23 and two cross members 25 to form a square shape and inner sides of these members form an opening 27. The plurality of thermoelectric units 3 are arranged in a gap, from the vertical frame 21 to the vertical frame 23 of the support body 5.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供一种气体温度控制装置，其中小型和重量级的翅片与珀耳帖元件接合以最大限度地利用翅片进行热交换。解决方案：气体温度控制装置1包括多个热电单元3和支撑体5.热电单元3通过使用与吸热面7相反的一侧夹持珀尔帖元件11而形成作为经由翅片基座13与吸热面7连接的吸热片15和经由散热片基座17与散热面9连接的散热片19之间的散热面9。通过框架垂直框架21,23和两个横向构件25以形成正方形，并且这些构件的内侧形成开口27.多个热电单元3布置在从垂直框架21到垂直框架23的间隙中的支持机构5.版权所有（C）2011，JPO＆INPIT

42. 发明专利

JP2014093303A Power module and power conversion device having the same 审中-公开
标题翻译：具有相同功能的电源模块和电源转换装置
公开(公告)号：JP2014093303A
公开(公告)日：2014-05-19
申请号：JP2012240833
申请日：2012-10-31
申请人： Daikin Ind Ltd , ダイキン工業株式会社
发明人： YOSHIMOTO AKIO , TERAKI JUNICHI
IPC分类号： H01L25/07 , H01L25/18 , H02M7/48
CPC分类号： H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To achieve reduction in size of a power module.SOLUTION: A power module includes a plurality of power semiconductor chips (37, 39), a lead frame (41) to which the plurality of power semiconductor chips (37, 39) are attached, and a rectangular-parallelepiped-shaped mold resin portion (43) integrally sealing the power semiconductor chips (37, 39) and the lead frame (41). The lead frame (41) is configured so that leads (45) extend toward an outer side from at least first to third side surfaces (43a to 43c) among the first to fourth side surfaces (43a to 43d) of the mold resin portion (43).
摘要翻译：要解决的问题：实现功率模块尺寸的减小。解决方案：功率模块包括多个功率半导体芯片（37,39），引线框架（41），多个功率半导体芯片（37,39） 39）和一体地密封功率半导体芯片（37,39）和引线框架（41）的矩形平行六面体形状的树脂部分（43）。引线框架（41）被构造成使得引线（45）从模制树脂部分的第一至第四侧表面（43a至43d）中的至少第一至第三侧表面（43a至43c）向外侧延伸 43）。

43. 发明专利

JP2014062732A Freezer unit 有权
标题翻译：冷冻机组
公开(公告)号：JP2014062732A
公开(公告)日：2014-04-10
申请号：JP2013251118
申请日：2013-12-04
申请人： Daikin Ind Ltd , ダイキン工業株式会社
发明人： HARADA KOICHI , KIDO NAOHIRO , TERAKI JUNICHI , TANAKA MITSUHIRO
IPC分类号： F24F11/02 , F24F1/24
摘要： PROBLEM TO BE SOLVED: To prevent a trouble caused by dew formation at a power element and its peripheral portions in advance at a freezer unit for cooling the power element and improve a reliability in operation of the freezer unit.SOLUTION: In an air conditioner (10) constituted by a freezer unit, a cooling member (50) is installed between an expansion valve (43) in a refrigerant circuit (20) and an outdoor heat exchanger (42). The cooling member (50) cools a power element (56) arranged at an inverter device (55) acting as a power supply with refrigerant. A controller (60) of the air conditioner (10) is provided with an expansion valve control part (62). In addition, a dew condensation sensor for detecting a presence or non-presence of dew condensation is fixed to the cooling member (50). During heating operation, the expansion valve control part (62) monitors an output of the dew condensation sensor and upon detection of occurrence of dew condensation with the dew condensation sensor, a degree of opening of the expansion valve (43) is forcedly enlarged to prevent a temperature of refrigerant flowing from the expansion valve (43) to the cooling member (50) from becoming too low.
摘要翻译：要解决的问题：为了防止功率元件及其周边部分预先在用于冷却功率元件的冷冻机组中的结露而引起的故障，并提高冷冻机组的运行可靠性。解决方案：在空调 10），由制冷剂回路（20）的膨胀阀（43）和室外热交换器（42）之间设置有冷却部件（50）。冷却部件（50）将配置在作为电源的逆变器装置（55）的动力元件（56）冷却制冷剂。空调机（10）的控制器（60）设有膨胀阀控制部（62）。此外，用于检测是否存在结露的结露传感器固定在冷却部件（50）上。在加热运转时，膨胀阀控制部62对结露传感器的输出进行监视，并且在与结露传感器检测出结露之后，强制扩大膨胀阀43的开度，从膨胀阀（43）向冷却部件（50）流动的制冷剂的温度变得太低。

44. 发明专利

JP2013232518A Air conditioning apparatus 审中-公开
标题翻译：空调设备
公开(公告)号：JP2013232518A
公开(公告)日：2013-11-14
申请号：JP2012103597
申请日：2012-04-27
申请人： Daikin Ind Ltd , ダイキン工業株式会社
发明人： TERAKI JUNICHI
IPC分类号： H05K7/20 , H01L23/473
CPC分类号： H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To prevent failures such as short circuits and corrosion in wiring of a printed board (51) without deteriorating cooling performance in a structure that a power element (53) provided at the control printed board (51) is cooled by a refrigerant flowing through a refrigerant pipe (15) of a refrigerant circuit.SOLUTION: In a refrigerant jacket (60), a water-cutoff part (63f) blocking dew condensation water of a refrigerant pipe (15) from flowing to a power element (53) is provided on a surface where the refrigerant pipe (15) extends from the refrigerant jacket (60).
摘要翻译：要解决的问题：为了防止在设置在控制印刷电路板（51）上的功率元件（53）被冷却的结构中，不会降低印刷电路板（51）的布线中的短路和腐蚀的故障，而不会降低冷却性能制冷剂流过制冷剂回路的制冷剂管道（15）。解决方案：在制冷剂套管（60）中，阻止制冷剂管道（15）的结露水流向功率元件的防水部分（63f） 53）设置在制冷剂配管（15）从制冷剂套（60）延伸的表面上。

45. 发明专利

JP2013225582A Freezer 有权
标题翻译：冰箱
公开(公告)号：JP2013225582A
公开(公告)日：2013-10-31
申请号：JP2012096841
申请日：2012-04-20
申请人： Daikin Ind Ltd , ダイキン工業株式会社
发明人： OGURI AKIHIKO , TERAKI JUNICHI , KITA MASANOBU , DOMAE HIROSHI , IKEDA MOTONOBU , FUJIWARA MASAHIDE
IPC分类号： H01L23/473 , H02M7/48 , H05K7/20
CPC分类号： F25D23/00 , F24F1/24 , F25D31/00 , H01L23/367 , H01L23/4006 , H01L23/473 , H01L2023/405 , H01L2924/0002 , H05K1/0203 , H05K7/20927 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a freezer which secures the insulation quality between a coolant jacket and a lead part of a power device and enables an insulation sheet to be omitted.SOLUTION: A facing surface 52 of a coolant jacket 40 includes: a contact part 520 contacting with a device body 200; a first recessed part 521 that faces a first lead part 201 and is positioned in a direction that moves further away from a power device 20 than the contact part 520 thereby securing an insulation distance from the first lead part 201; and a second recessed part 522 that faces a second lead part 202 and is positioned in a direction that moves further away from the power device 20 than the contact part 520 thereby securing an insulation distance from the second lead part 202.
摘要翻译：要解决的问题：提供一种冷冻机，其确保冷却剂护套和动力装置的引导部分之间的绝缘质量，并且能够省略绝缘片。解决方案：冷却剂护套40的面对表面52包括：接触部件520与装置主体200接触; 第一凹部521面对第一引线部201并且位于比接触部520更远离功率器件20的方向上，从而确保与第一引线部201的绝缘距离; 以及第二凹部522，其面向第二引线部202并且位于比接触部520更远离动力装置20的方向上，从而确保与第二引导部202的绝缘距离。

46. 发明专利

JP2013073949A Electric power conversion apparatus and freezer including the same 审中-公开
标题翻译：电力转换装置和冷冻机，包括它们
公开(公告)号：JP2013073949A
公开(公告)日：2013-04-22
申请号：JP2011209619
申请日：2011-09-26
申请人： Daikin Ind Ltd , ダイキン工業株式会社
发明人： YOSHIMOTO AKIO , TERAKI JUNICHI , FUJII KAZUHISA
IPC分类号： H01L25/07 , H01L23/473 , H01L25/18 , H02M7/48
CPC分类号： H01L2224/48091 , H01L2224/73265 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00012
摘要： PROBLEM TO BE SOLVED: To provide an electric power conversion apparatus including cooling means which efficiently cools a power semiconductor chip with a simple structure, and to provide a freezer including the electric power conversion apparatus.SOLUTION: An electric power conversion apparatus (30) includes: a power semiconductor chip (50); and a main substrate (51) where a main circuit, to which the power semiconductor chip (50) connects, is formed. In the electric power conversion apparatus (30), the power semiconductor chip (50) is mounted on a surface (52b) through an insulation layer (54), and a recessed groove (52c), into which a cooling pipe (23a), allowing a cooling fluid to circulate therein, fits, is formed on a rear surface (52a). Further, a heat radiation substrate (52), formed by a material different from the main substrate (51), and a fixing member (53), which fixes the heat radiation substrate (52) to the main substrate (51) so that the heat radiation substrate (52) is positioned on a surface different from the main substrate (51), are provided.
摘要翻译：解决的问题：提供一种电力转换装置，其包括以简单结构有效地冷却功率半导体芯片的冷却装置，并提供包括电力转换装置的冷冻机。电力转换装置（30）包括：功率半导体芯片（50）; 和形成功率半导体芯片（50）所连接的主电路的主基板（51）。在电力转换装置（30）中，通过绝缘层（54）将功率半导体芯片（50）安装在表面（52b）上，并且将冷却管（23a）的凹槽（52c）允许冷却流体在其中循环，在后表面（52a）上形成。此外，由不同于主基板（51）的材料形成的散热基板（52）和固定部件（53）将热辐射基板（52）固定在主基板（51）上，使得散热基板（52）位于与主基板（51）不同的表面上。版权所有（C）2013，JPO＆INPIT

47. 发明专利

JP2010210216A Air conditioning system 有权
标题翻译：空调系统
公开(公告)号：JP2010210216A
公开(公告)日：2010-09-24
申请号：JP2009059973
申请日：2009-03-12
申请人： Daikin Ind Ltd , ダイキン工業株式会社
发明人： YAMAGUCHI TAKAHIRO , TERAKI JUNICHI
IPC分类号： F24F3/00
摘要： PROBLEM TO BE SOLVED: To individually adjust temperatures of a plurality of rooms with small energy.
SOLUTION: This air conditioning system includes supply ducts (33a, 33b) for distributing and supplying the supply air of an air conditioner to the plurality of rooms (B, C), and temperature conditioning units (31a, 31b). The air conditioner includes an air-conditioning controller for controlling the temperature of the intake air to an intermediate temperature (Tc) of a set temperature of each room (B, C), and the temperature conditioning units (31a, 31b) have Peltier elements (35) having a temperature conditioning face (35a) and a heat exhaust face (35b), and conditioning the temperature of the supply air of the air conditioner by the temperature conditioning face (35a), and also have a heat medium circuit (40) connected to the heat exhaust faces (35b) of the Peltier elements (35) of the temperature-conditioning unit (31a, 31b) for circulating a refrigerant exchanging heat between the exhaust heat faces (35b).
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：单独调节具有小能量的多个房间的温度。解决方案：该空调系统包括用于向多个房间（B，C）和温度调节单元（31a，31b）分配和供应空调的供给空气的供应管道（33a，33b）。该空气调节装置具有将吸入空气的温度控制在各房间的设定温度（B，C）的中间温度（Tc）的空调控制器，温度调节单元（31a，31b）具有珀耳帖元件（35a），具有温度调节面（35a）和排热面（35b），并且通过温度调节面（35a）调节空调的供给空气的温度，并且还具有热介质回路（40a ）连接到温度调节单元（31a，31b）的珀尔帖元件（35）的热排出面（35b），用于使在热交换器（35b）之间交换热量的制冷剂循环。版权所有（C）2010，JPO＆INPIT

48. 发明专利

JP2010117041A Cooling member and manufacturing method therefore 审中-公开
标题翻译：冷却成员及其制造方法
公开(公告)号：JP2010117041A
公开(公告)日：2010-05-27
申请号：JP2008288567
申请日：2008-11-11
申请人： Daikin Ind Ltd , ダイキン工業株式会社
发明人： TERAKI JUNICHI , OKUDA NORIYUKI
IPC分类号： F28F3/12
摘要： PROBLEM TO BE SOLVED: To provide a cooling member composed of a heat transfer member firmly joined to a refrigerant introduction pipe, and the manufacturing method therefor.
SOLUTION: The cooling member 15 is plastically deformed so that the refrigerant introduction pipe 13 can closely press the inner peripheral surface 17 of a groove 1 with by inserting the refrigerant introduction pipe 13 into the groove 1 of the heat transfer member 7 and pressing the refrigerant introduction pipe 13 to the groove 1 with a press mold 11. The groove part 1 of the heat transfer member 7 positions the curvature center O of the inner peripheral surface 17 following an ellipse form at an inner part of a groove opening 3. The cooling member 15 conforms a direction of a major axis of the ellipse form with a width direction of the groove opening 3. Thus, as an over-hang amount can be increased compared with a conventional case in which the cross section of the inner peripheral surface 17 is formed to follow a circular arc, the heat transfer member 7 can be firmly joined to the refrigerant introduction pipe 13.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种由与制冷剂导入管牢固连接的传热构件构成的冷却构件及其制造方法。解决方案：冷却构件15塑性变形，使得制冷剂导入管13能够通过将制冷剂导入管13插入传热构件7的槽1中而紧密地挤压槽1的内周面17，以及用压制模具11将制冷剂导入管13向槽1内挤压。传热部件7的槽部1将内周面17的曲率中心O在凹槽开口部3的内部配置成椭圆形状冷却部件15使椭圆形状的长轴方向与槽口3的宽度方向一致。因此，与以往的情况相比，能够提高过悬挂量，外周表面17形成为遵循圆弧，传热构件7可以牢固地接合到制冷剂引入管13。版权所有（C）2010，JPO＆INPIT

49. 发明专利

JP2010117040A Cooling member and manufacturing method therefor 有权
标题翻译：冷却构件及其制造方法
公开(公告)号：JP2010117040A
公开(公告)日：2010-05-27
申请号：JP2008288566
申请日：2008-11-11
申请人： Daikin Ind Ltd , ダイキン工業株式会社
发明人： TERAKI JUNICHI , OKUDA NORIYUKI
IPC分类号： F28F3/12 , B21D39/00 , H01L23/473
摘要： PROBLEM TO BE SOLVED: To provide a cooling member capable of realizing excellent heat transfer from a heat transfer member to a refrigerant introducing tube and securing the excellent flow of refrigerant introduced to the refrigerant introducing tube, even though a dimension error is included in the circumferential length of the outer periphery of the refrigerant introducing tube or an inner peripheral surface of a groove, and its manufacturing method.
SOLUTION: In the groove part 1, the curvature center O of its inner peripheral surface 17 is positioned inside a groove opening 3. The circumferential length L of the inner peripheral surface 17 is the length of the inner peripheral surface 17 from a corner 19 to a corner 21. The groove part 1 satisfies a condition that a length obtained by adding a width A of the groove opening 3 and the circumferential length L of the inner peripheral surface 17 (A+L) is shorter than the outer periphery (πG) of the refrigerant introducing tube 13.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种冷却构件，其能够实现从传热构件到制冷剂导入管的良好的热传递，并确保引入到制冷剂导入管的制冷剂的优异流动，即使包括尺寸误差在制冷剂导入管的外周的周长或槽的内周面的周向长度及其制造方法。解决方案：在槽部1中，其内周面17的曲率中心O位于槽口3的内侧。内周面17的周向长度L为内周面17的长度角部19到角部21.槽部1满足通过将槽孔3的宽度A和内周面17（A + L）的周长L相加而得到的长度比外周（πG）。（C）2010，JPO＆INPIT

50. 发明专利

JP2009300007A Temperature control device 审中-公开
标题翻译：温度控制装置
公开(公告)号：JP2009300007A
公开(公告)日：2009-12-24
申请号：JP2008155659
申请日：2008-06-13
申请人： Daikin Ind Ltd , ダイキン工業株式会社
发明人： TERAKI JUNICHI
IPC分类号： F24F5/00 , F25B13/00 , F25B21/02
摘要： PROBLEM TO BE SOLVED: To enable the use of latent heat of a heating medium both in heating and cooling and reduce the size of a device.
SOLUTION: This temperature control device is provided with a circulation circuit (20) in which the heating medium constituted by mixing latent heat materials is circulated and with a heat source side heat pump (10) for performing heat absorption or heat release with respect to the heating medium so that the temperature of the heating medium of the circulation circuit (20) becomes phase change temperature of the latent heat materials. The temperature control device is further provided with a use side heat pump (30) having a thermoelectric element (31), a first heat exchange part (34) formed on a first face (32) of the thermoelectric element (31) and performing heat exchange with indoor air and a second heat exchange part (35) formed on a second face (33) of the thermoelectric element (31) and performing heat exchange with the heating medium of the circulation circuit (20).
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了能够在加热和冷却中使用加热介质的潜热并且减小装置的尺寸。解决方案：该温度控制装置设置有循环回路（20），其中通过混合潜热材料构成的加热介质循环，并且与用于进行吸热或放热的热源侧热泵（10）相对于加热介质，使得循环回路（20）的加热介质的温度成为潜热材料的相变温度。所述温度控制装置还具有热电元件（31）的使用侧热泵（30），形成于所述热电元件（31）的第一面（32）上的第一热交换部（34）与室内空气交换，形成在热电元件（31）的第二面（33）上的第二热交换部（35），与循环回路（20）的加热介质进行热交换。版权所有（C）2010，JPO＆INPIT

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