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    • 48. 发明专利
    • Laser processing equipment
    • JP4397229B2
    • 2010-01-13
    • JP2003430071
    • 2003-12-25
    • 株式会社ブイ・テクノロジー
    • 康一 梶山通伸 水村
    • B23K26/06B23K26/00
    • PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus capable of correctly and efficiently machining a work at a predetermined position by allowing the work to be irradiated with laser beams of the beam shape shaped to a required machining shape and of the uniform energy. SOLUTION: The laser beam machining apparatus comprises a laser beam oscillator 3, an aperture mechanism 4 to shape the beam shape of laser beams L 1 output from the laser beam oscillator 3, and an optical system 7 having an imaging lens 5 and an objective 6 to focus the irradiated laser beams L 0 passed through the aperture mechanism 4 and shaped on a work W. The aperture mechanism 4 comprises a pair of slit mechanisms 4A and 4B deviated in position in the direction of the optical axis R of the laser beams L 1 , and each of the slit mechanisms 4A and 4B has a pair of slit plates 8, 8, 9, 9 facing each other with tip edges of knife edges parallel to each other in the plane orthogonal to the optical axis R of the laser beams L 1 , and a pair of driving means 10a and 10b to independently advance/retract the slit plates 8, 8, 9, 9 in the facing direction. COPYRIGHT: (C)2005,JPO&NCIPI