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41. 发明专利

JP5370074B2 Loop heat pipe and the electronic device having the same 有权
公开(公告)号：JP5370074B2
公开(公告)日：2013-12-18
申请号：JP2009246329
申请日：2009-10-27
申请人：富士通株式会社
发明人：聖二日比野 , 孝浩木村 , 浩基内田 , 重憲青木
IPC分类号： F28D15/02 , F28D15/06
CPC分类号： F28D15/0266
摘要： PROBLEM TO BE SOLVED: To provide a loop-type heat pipe and an electronic device including the same, superior in starting performance and a heat transporting capacity. SOLUTION: This loop type heat pipe 10 includes: a compensation chamber 11 for storing working liquid 18; an evaporating section 12 receiving heat from the external and evaporating the working liquid 18; a steam pipe 13 for guiding the steam of the evaporating section 12 to a condensing section 14; the condensing section 14 radiating heat to the external and condensing the steam; a liquid pipe 15 for guiding the condensed working liquid 18 to the compensation chamber 11; and a wick 22 partitioning a working liquid flow channel 22b communicated with the compensation chamber 11 and a steam flow channel 22b communicated with the steam pipe 13 in the evaporating section 12. In the loop type heat pipe 10, a spacer 16 is disposed movably between the compensation chamber 11 and the working liquid flow channel 22b, and moved into the working liquid flow channel 22b to reduce a volume of the working liquid flow channel 22b when the heat pipe is disposed in a state that a position of the evaporating section 12 is higher than a position of the condensing section 14. COPYRIGHT: (C)2011,JPO&INPIT

42. 发明专利

JP5344847B2 Cooling system 有权
公开(公告)号：JP5344847B2
公开(公告)日：2013-11-20
申请号：JP2008098683
申请日：2008-04-04
申请人：富士通株式会社
发明人：浩基内田
IPC分类号： F28D15/06
摘要： PROBLEM TO BE SOLVED: To provide a cooling apparatus for suppressing dropping of circulation speed of a working fluid even under a condition wherein a heat value of a heating element is small when carrying out cooling of the heating element by using a loop heat pipe. SOLUTION: The cooling apparatus includes an evaporator evaporating the working fluid of a liquid phase during passing of a wick composed of a porous material by heat received from the heating element, a condenser discharging heat of the working fluid of a gaseous phase and condensing the working fluid, a plurality of loop heat pipes having a steam pipe moving the working fluid of the gaseous phase evaporated by the evaporator from the evaporator to the condenser, and a liquid pipe moving the working fluid of the liquid phase condensed by the condenser from the condenser to the evaporator, and comprised by thermally joining respective evaporators by a common heating element, a heat value detecting means for detecting the heat value of the heating element, and a switching control part carrying out switching control between operation and stopping of the plurality of loop heat pipes in response to the heat value detected by the heat value detecting means. COPYRIGHT: (C)2010,JPO&INPIT

43. 发明专利

JP5321716B2 Loop-type heat pipe and electronic equipment 有权
公开(公告)号：JP5321716B2
公开(公告)日：2013-10-23
申请号：JP2012136812
申请日：2012-06-18
申请人：富士通株式会社
发明人：浩基内田
IPC分类号： F28D15/06 , F28D15/02
摘要： PROBLEM TO BE SOLVED: To provide a loop heat pipe that starts circulation of working fluid so as not to prevent the circulation after starting the circulation in a top heat state or the like, and to provide an electronic apparatus with the loop heat pipe mounted thereon. SOLUTION: In the loop heat pipe 100, a steam pipe 130 for connecting an evaporator 110 with a condenser 120, and a liquid pipe 140 for connecting the condenser 120 with the evaporator 110 are connected in a loop, and the working fluid passes through the inside of the liquid pipe 140. The loop heat pipe includes a controller 190 for controlling the circulation of the working fluid. The controller 190 cools the working fluid in a reservoir tank 150 which connects the liquid pipe 140 to the evaporator 110 using a Peltier element 160, at start-up for starting the circulation. COPYRIGHT: (C)2013,JPO&INPIT

44. 发明专利

JP5136376B2 Loop-type heat pipe and electronic equipment 有权
公开(公告)号：JP5136376B2
公开(公告)日：2013-02-06
申请号：JP2008307858
申请日：2008-12-02
申请人：富士通株式会社
发明人：浩基内田 , 健司塩賀 , 重憲青木
IPC分类号： F28D15/06 , F28D15/02 , H01L23/427
CPC分类号： F28D15/0266

45. 发明专利

JP5061911B2 Loop-type heat pipe and electronic equipment 有权
公开(公告)号：JP5061911B2
公开(公告)日：2012-10-31
申请号：JP2008004325
申请日：2008-01-11
申请人：富士通株式会社
发明人：浩基内田
IPC分类号： F28D15/02 , F28D15/06 , H01L23/38 , H01L23/427 , H05K7/20

46. 发明专利

JP5023735B2 Cooling plate and electronic equipment 有权
公开(公告)号：JP5023735B2
公开(公告)日：2012-09-12
申请号：JP2007040514
申请日：2007-02-21
申请人：富士通株式会社
发明人：浩基内田
IPC分类号： H01L23/473 , H01L23/32 , H05K7/20
CPC分类号： H01L2924/0002 , H01L2924/00

47. 发明专利

JP4997954B2 Circuit board, the method of manufacturing a semiconductor device and 有权
公开(公告)号：JP4997954B2
公开(公告)日：2012-08-15
申请号：JP2006339133
申请日：2006-12-15
申请人：富士通株式会社
发明人：浩基内田 , 知行阿部
IPC分类号： H05K3/46 , H01L23/12 , H01L23/36 , H05K1/02 , H05K1/05
CPC分类号： H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/15311 , H01L2924/00

48. 发明专利

JP4899903B2 A printed wiring board, method of manufacturing an electronic device, and a printed wiring board 有权
公开(公告)号：JP4899903B2
公开(公告)日：2012-03-21
申请号：JP2007025542
申请日：2007-02-05
申请人：富士通株式会社
发明人：仁昭伊達 , 浩基内田 , 稔石鍋 , 耕太西井 , 元昭谷 , 淳谷口
IPC分类号： H05K1/02

49. 发明专利

JP4731366B2 Cooling system 有权
公开(公告)号：JP4731366B2
公开(公告)日：2011-07-20
申请号：JP2006077285
申请日：2006-03-20
申请人：富士通株式会社
发明人：仁昭伊達 , 浩基内田 , 稔石鍋 , 耕太西井 , 淳谷口
IPC分类号： H01L23/473 , H05K7/20

50. 发明专利

JPWO2006098001A1 冷却装置及びその製造方法审中-公开
公开(公告)号：JPWO2006098001A1
公开(公告)日：2008-08-21
申请号：JP2007507971
申请日：2005-03-15
申请人：富士通株式会社
发明人：石鍋　稔 , 稔石鍋 , 仁昭伊達 , 仁昭伊達 , 内田　浩基 , 浩基内田 , 賢伸石塚 , 賢伸石塚 , 英士徳平 , 英士徳平 , 淳谷口 , 淳谷口
IPC分类号： H01L23/373 , H01L23/36
CPC分类号： F28F13/18 , F28F2245/02
摘要：下面が放熱対象の発熱体に接合される基材1の上面には、銅製の複数のフィン2が等ピッチで直立状態で設けられている。各フィン2の側面の基材1側半分には、親水性材料(TiO2)からなる親水性膜12が形成され、各フィン2の側面の基材1とは反対側の半分には、吸湿性材料(ゼオライト)からなる吸湿性膜11が形成されている。基材1の下面を処理対象の発熱体に接合させ、空気中の水蒸気を吸湿性膜11にて吸収してフィン2の表面に水を付着させる。付着した水は、親水性膜12上に広がり、広がった水は、発熱体からの熱を吸収して蒸発する。

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