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42. 发明专利

JP5276571B2 Phosphorus-containing compound and a method of manufacturing the same 有权
公开(公告)号：JP5276571B2
公开(公告)日：2013-08-28
申请号：JP2009256838
申请日：2009-11-10
申请人：長春人造樹脂廠股▲分▼有限公司
发明人：義政許 , 炳傑王 , 安邦杜 , 坤源黄
IPC分类号： C07F9/6574 , C08K5/5377 , C09K21/12
CPC分类号： C07F9/657172
摘要： The present invention provides a phosphorus compound of formula (I). The phosphorus compound is prepared by reacting a compound of formula (II) with alkylene carbonate. As compared with the conventional phosphorus compounds as flame-resistant additives, the phosphorus compound of the present invention has not only a high pyrolysis temperature but also excellent solubility in most of the organic solvents with high or low polarity, and is therefore a suitable flame-resistant additive for use in thermosetting or thermoplastic resins.

44. 发明专利

JP5074551B2 Phosphorus-based epoxy resin and a half solidified and manufacturing method thereof 有权
公开(公告)号：JP5074551B2
公开(公告)日：2012-11-14
申请号：JP2010103369
申请日：2010-04-28
申请人：長春人造樹脂廠股▲分▼有限公司
发明人：アン−パン・ツウ , ケン−イェン・ファン , チイ−フン・リウ , チュン−シン・ガオ , ファン−シエン・スウ
IPC分类号： C08G59/02
CPC分类号： C08G59/304 , C08G59/1488

45. 发明专利

JP2011144345A Phosphorus-based epoxy resin semisolid, and production method thereof 有权
标题翻译：基于磷酸盐的环氧树脂半溶胶及其制备方法
公开(公告)号：JP2011144345A
公开(公告)日：2011-07-28
申请号：JP2010103369
申请日：2010-04-28
申请人： Chang Chun Plastics Co Ltd , 長春人造樹脂廠股▲分▼有限公司
发明人： SU FANG-HSIEN , LIU CHI-HUNG , KAO CHUN-HSIUNG , TU AN-PANG , HWANG KUEN-YUAN
IPC分类号： C08G59/02
CPC分类号： C08G59/304 , C08G59/1488
摘要： PROBLEM TO BE SOLVED: To solve the problem of poor stability in alkali resistance of conventional epoxy resin semisolids.
SOLUTION: A phosphorus-based epoxy resin semisolid represented by chemical formula (I) is produced by performing a chain-lengthening reaction of a phosphorus-based bisphenol represented by chemical formula (i) and an epoxy resin represented by chemical formula (ii) in the presence of a catalyst, wherein n indicates an integer of 1-9; and R indicates a methyl group or a phenyl group.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：解决常规环氧树脂半固体的耐碱稳定性差的问题。解决方案：由化学式（I）表示的磷基环氧树脂半固体是通过进行由化学式（i）表示的磷基双酚和由化学式（i）表示的环氧树脂的链延长反应而制备的， ii）在催化剂存在下，其中n表示1-9的整数; R表示甲基或苯基。版权所有（C）2011，JPO＆INPIT

46. 发明专利

JP4478095B2 Modified polyamide-imide resin and its composition by the polyoxyalkylene amine 有权
公开(公告)号：JP4478095B2
公开(公告)日：2010-06-09
申请号：JP2005311390
申请日：2005-10-26
申请人：長春人造樹脂廠股▲分▼有限公司
发明人：勝彦巫 , 安邦杜 , 坤源黄
IPC分类号： C08G18/34 , B05D7/24 , C08G59/40 , C08K3/00 , C08L79/08 , C08L101/00 , C09D179/08 , H05K1/03
CPC分类号： C08G18/603 , C08G73/14 , C09D175/12 , H05K1/0346 , H05K1/0393 , H05K2201/0133 , H05K2201/0154 , H05K2201/0209

47. 发明专利

JP2010024231A New phosphorus-based biphenol, and method for producing derivative thereof 有权
标题翻译：新的基于磷的BIPHENOL及其衍生物的制备方法
公开(公告)号：JP2010024231A
公开(公告)日：2010-02-04
申请号：JP2009163461
申请日：2009-07-10
申请人： Chang Chun Plastics Co Ltd , National Chung Hsing Univ , 國立中興大學 , 長春人造樹脂廠股▲分▼有限公司
发明人： LIN CHING-HSUAN , CHANG CHIA-WEI , LIN TSUNG-LI , HWANG KUEN-YUAN , TU AN-PANG , SU FANG-HSIEN
IPC分类号： C07F9/6574 , C07B61/00
CPC分类号： C07F9/657172
摘要： PROBLEM TO BE SOLVED: To provide an commercial method for producing DOPOBQ which is a precursor of a phosphorus-based biphenol monomer, which can be suitably used for producing the precursor improved in solubility and reactivity at a reduced material cost.
SOLUTION: There is provided a method for synthesizing a phosphorus-based compound having a structure represented by formula 1 by using an organic cyclic phosphorus compound, a ketone-based compound, phenol, and an acid catalyst. New phosphorus-based biphenols including substances producing a group of derivatives and the derivatives thereof are synthesized by using the phosphorus-based compound.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供一种生产作为磷基联苯酚单体的前体的DOPOBQ的商业方法，其可以适当地用于制备在降低的材料成本下提高溶解度和反应性的前体。解决方案：提供一种通过使用有机环磷化合物，酮基化合物，苯酚和酸催化剂合成具有式1所示结构的磷基化合物的方法。包括产生一组衍生物的物质及其衍生物的新的磷基联苯酚通过使用磷基化合物合成。版权所有（C）2010，JPO＆INPIT

48. 发明专利

JP2006336012A Soluble polyimide resin and method for producing the same 有权
标题翻译：可溶性聚酰胺树脂及其制造方法
公开(公告)号：JP2006336012A
公开(公告)日：2006-12-14
申请号：JP2006148853
申请日：2006-05-29
申请人： Chang Chun Plastics Co Ltd , 長春人造樹脂廠股▲分▼有限公司
发明人： KO KONGEN , TO ANHO , WU SHENG YEN
IPC分类号： C08G73/10 , C09J179/08 , H05K1/03 , H05K3/00
CPC分类号： H05K1/0346 , C08G73/16 , H05K1/0393
摘要： PROBLEM TO BE SOLVED: To provide a polyimide resin soluble in an organic solvent and method for producing the same and to provide a polyimide resin with high stability in size and to provide a method for producing the same.
SOLUTION: The polyimide resin is obtained by forming a polyamide resin by carrying out a polycondensation reaction of an acid dianhydride monomer containing an acid dianhydride represented by formula (I) with a specific diamine monomer (II) containing an aromatic group, and then imidizing the polyamide resin. The invention provides the polyimide resin with low water absorption, small coefficient of linear expansion, high in size stability, and excellent in thermal resistance, and provides a method for producing the same. The polyimide resin is preferably applied to adhesive use, the adhesive is preferably used for production of soft circuit boards, or the like.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供可溶于有机溶剂的聚酰亚胺树脂及其制备方法，并提供具有高稳定性的聚酰亚胺树脂并提供其制备方法。解决方案：通过进行含有式（I）表示的酸式二酸酐的酸二酐单体与含有芳香族基团的特定二胺单体（II）的缩聚反应，形成聚酰胺树脂，得到聚酰亚胺树脂，然后酰亚胺化聚酰胺树脂。本发明提供了吸水率低，线膨胀系数小，稳定性高，耐热性优异的聚酰亚胺树脂，并提供了其制造方法。聚酰亚胺树脂优选用于粘合剂用途，粘合剂优选用于生产软电路板等。版权所有（C）2007，JPO＆INPIT

49. 发明专利

JP3825715B2 Phosphorus-containing flame retardant epoxy resin and its composition 有权
公开(公告)号：JP3825715B2
公开(公告)日：2006-09-27
申请号：JP2002116417
申请日：2002-04-18
申请人：長春人造樹脂廠股▲分▼有限公司
发明人：智富陳 , 鴻星陳 , 坤源黄
IPC分类号： C08G59/08 , C08K3/00 , C08G59/30 , C08G59/50 , C08G59/62 , C08L63/00 , H01L23/29 , H01L23/31
CPC分类号： H01L2924/0002 , H01L2924/00

50. 发明专利

JP2005126662A Epoxy resin composition for use in mounting photosemiconductor device 审中-公开
标题翻译：环氧树脂组合物用于安装光电子器件
公开(公告)号：JP2005126662A
公开(公告)日：2005-05-19
申请号：JP2004018769
申请日：2004-01-27
申请人： Choshun Jinzo Jushisho Kofun Yugenkoshi , 長春人▲造▼樹脂廠股▲分▼有限公司
发明人： KO KONGEN , TO ANHO , CHEN CHIH-FU
IPC分类号： C08G59/20 , C08G59/68 , H01L23/29 , H01L23/31
摘要： PROBLEM TO BE SOLVED: To provide an epoxy resin composition useful for mounting a photosemiconductor, in particular applied for a blue and a white photosemiconductor, as it has particularly excellent translucency and resistance to UV light, does not discolor even after heated for a long period of time, and has low moisture absorption.
SOLUTION: This epoxy resin composition comprises (A) an epoxy resin component containing an epoxy resin having a structure represented by general formula (1), (B) a curing agent and (C) a curing accelerator.
COPYRIGHT: (C)2005,JPO&NCIPI

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