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31. 发明专利

JP3112762B2 失效
公开(公告)号：JP3112762B2
公开(公告)日：2000-11-27
申请号：JP1770193
申请日：1993-02-04
IPC分类号： G01K7/16 , G01K7/18 , H01B5/02 , H01C1/14 , H01C7/00 , H01C17/12 , H01C17/24

32. 发明专利

JP2000306712A MULTIPLE CHIP RESISTOR AND MANUFACTURE THEREOF 失效
公开(公告)号：JP2000306712A
公开(公告)日：2000-11-02
申请号：JP11073199
申请日：1999-04-19
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： KOBAYASHI HIDEO , HASHIMOTO MASATO , FUKUOKA AKIO
IPC分类号： H01C13/02 , H01C17/06 , H01C17/12
摘要： PROBLEM TO BE SOLVED: To provide a multiple chip resistor which can reduce a soldering area occupied in a mounting area, when the resistor is mounted on a substrate. SOLUTION: This chip resistor consists of a plurality of pairs of first upper surface electrodes 22, formed on both end portions of the upper surface of a substrate 21 and a part of both side surfaces, a plurality of resistance layers 23 formed to be electrically connected with the first upper surface electrode layers 22, a plurality of pairs of second upper surface electrode layers 25 formed on the upper surface of the first upper surface electrode layers 22, and a protective layer 24 formed to cover at least the plurality of resistance layers 23.

33. 发明专利

JP2000299203A RESISTOR AND MANUFACTURE THEREOF 失效
公开(公告)号：JP2000299203A
公开(公告)日：2000-10-24
申请号：JP10789399
申请日：1999-04-15
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YONEDA NAOTSUGU , TAKASHIMA HISAHIRO
IPC分类号： H01C17/06 , H01C7/00 , H01C17/12
摘要： PROBLEM TO BE SOLVED: To provide a resistor having highly accurate resistance. SOLUTION: This resistor is provided with a substrate 21, a pair of backside electrode layers 22 provided on both ends of the backside of the substrate 21, a pair of top surface electrode layers 23 provided on both ends of the upper surface of the substrate 21, a resistance layer 24 which is provided in such a manner that it is electrically connected to the pair of top electrode layer 23, a protective layer 26 provided at least covering the resistance layer 24, a pair of side face electrode layer 27 provided at least on a part of both end faces of the substrate 21, a pair of top surface electrode layer 23 and the backside electrode layer 22 in such a manner that the pair of top surface electrode 23 and the backside electrode layer 22 are electrically connected, a copper plated layer 28 provided covering the pair of backside electrode layers 22, the top surface electrode layers 23 and the side face electrode layer 27, and an outer electrode plated layer 29 provided which covers the copper plated layer 28.

34. 发明专利

JP2000150204A NTC THERMISTOR AND CHIP NTC THERMISTOR 失效
公开(公告)号：JP2000150204A
公开(公告)日：2000-05-30
申请号：JP31603298
申请日：1998-11-06
申请人： MURATA MANUFACTURING CO
发明人： MIHARA KENJIRO , TAKAOKA YUICHI
IPC分类号： G01K7/22 , H01B3/12 , H01C7/04 , H01C17/12
摘要： PROBLEM TO BE SOLVED: To provide a chip thermistor with fast response to temperature sensitivity, low resistance and enhanced reliability by forming a temperature sensitive resistance wire including a La-Co-O based rare earth transition element as a principal component and providing a pair of electrodes so as to obtain continuity with the temperature sensitive resistance wire. SOLUTION: A temperature sensitive resistance wire 2 of a thermistor material is formed on the surface of an electrically insulating substrate 1 formed of an electrically insulating material by sputtering. A pair of external electrodes 5 are provided at both ends of a pair of electrodes (surface electrode) 3 formed on the surface of the temperature sensitive resistance wire 2, and a device in which the temperature sensitive resistance wire 2 and the surface electrode 3 is formed on the substrate 1 so as to obtain continuity with the surface electrode 3, and the surfaces of the temperature sensitive resistance wire 2 and the surface electrode 3 are coated with an insulating coating 6. Although the temperature sensitive resistance film is formed by sputtering, a thin film forming method such as alcoxide and the like, or a thick film forming method, for example, a method by which a thermistor material paste is coated and baked, and the like may be used.

35. 发明专利

JP3026656B2 失效
公开(公告)号：JP3026656B2
公开(公告)日：2000-03-27
申请号：JP25192591
申请日：1991-09-30
IPC分类号： H01C17/06 , H01C17/12 , H01L21/02 , H01L21/822 , H01L27/04 , H01L21/3065

36. 发明专利

JP2872823B2 失效
公开(公告)号：JP2872823B2
公开(公告)日：1999-03-24
申请号：JP8757691
申请日：1991-03-26
申请人： NIPPON GAISHI KK
发明人： YAJIMA YASUHITO
IPC分类号： H01C17/12

37. 发明专利

JP2872822B2 失效
公开(公告)号：JP2872822B2
公开(公告)日：1999-03-24
申请号：JP8140591
申请日：1991-03-19
申请人： NIPPON GAISHI KK
发明人： YAJIMA YASUHITO
IPC分类号： H01C17/12 , H01C17/24

38. 发明专利

JPH10321405A RESISTOR AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH10321405A
公开(公告)日：1998-12-04
申请号：JP13074797
申请日：1997-05-21
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： HASHIMOTO MASATO , YAMADA HIROYUKI
IPC分类号： H01C1/034 , H01C1/142 , H01C7/00 , H01C17/06 , H01C17/12
摘要： PROBLEM TO BE SOLVED: To reduce the soldering area occupying the mounting area, by providing a pair of upper electrode layers at lateral parts of the main surface and parts of the lateral surfaces of a substrate, then providing a resistance layer so as to be electrically connected with the upper electrode layers, and providing a protection layer so as to cover the upper surface of the resistance layer. SOLUTION: Upper electrode layers 32 made of silver conductive powder containing glass are provided at lateral parts of the main surface and parts of the lateral surfaces of a substrate 31. The upper electrode layers 32 have round contours. The area of the upper electrode layer 32 on the lateral surface of the substrate 31 is not greater than half the area of the lateral surface of the substrate 31. A resistance layer 33 containing ruthenium oxide as a principal component is provided, which is to be electrically connected with the upper electrode layers 32. A protection layer 34 containing glass as a principal component is provided on the upper surface of the resistance layer 33. If necessary, nickel plating layers 35 and solder plating layers 36 are provided.

39. 发明专利

JPH10321403A MANUFACTURE OF RESISTOR 失效
公开(公告)号：JPH10321403A
公开(公告)日：1998-12-04
申请号：JP12924897
申请日：1997-05-20
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： YAMADA HIROYUKI , NAKATANI MITSUNARI
IPC分类号： H01C13/02 , H01C7/00 , H01C17/06 , H01C17/12 , H01C17/242
摘要： PROBLEM TO BE SOLVED: To manufacture a resistor with the film thickness of allover resistor pattern made approximately uniform and superior to an electrical characteristic. SOLUTION: A pair of plural upper face electrode layer 22 are formed on the lateral of the upper face of a substrate 21, an allover resistor layer 31 is formed on the upper face of the substrate 21 being electrically connected to a pair of plural upper face electrode layer 22, a plurality of independent resistor layer 24 are formed partially removing the allover resistor layer 31, and a protective layer 25 is formed to cover at least the resistor layer 24.

40. 发明专利

JPH09129421A METHOD OF FORMING LEAD WIRE 失效
公开(公告)号：JPH09129421A
公开(公告)日：1997-05-16
申请号：JP30988495
申请日：1995-11-02
申请人： NIPPON SOKEN
发明人： YOSHIDA TAKAHIKO , UCHIDA MITSUNORI
IPC分类号： H01C17/12 , H01C17/28
摘要： PROBLEM TO BE SOLVED: To improve the bond strength between an electrode film and leads by cleaning the electrode film without damage to neighboring areas, while avoiding the increase in the number of process steps. SOLUTION: Electrode films 4 and 5 to be connected to leads are formed on a film of Cr or Ni-Cr cermet and annealed in an oxidative atmosphere. The whole surface, except the upper electrode film 5, is covered with a metal mask 7, and contamination 6 is removed from the electrode film 5 by dry etching. This prevents damage to other portions than the electrode film while avoiding the increase in the number of process steps. Thereafter, leads are connected to the electrode film 5 by soldering or wire bonding 8.

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