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    • 33. 发明专利
    • MANUFACTURE OF PRINTED WIRING BOARD
    • JPH01194496A
    • 1989-08-04
    • JP1993188
    • 1988-01-29
    • HITACHI CHEMICAL CO LTD
    • HASEGAWA KIYOSHIOKAMURA TOSHIRO
    • C23C18/16C23C18/24C23C18/30C23C18/31C23C18/34C23C18/40H05K3/18H05K3/42
    • PURPOSE:To prevent being plated on an unnecessary part other than a circuit, for the forming of the conductor circuit being performed well, by dipping at first in the acid aqueous solution of a chromic acid without any halogen ions as a dipping in a chemical roughening solution, and then dipping in the acid aqueous solution of a chromic acid containing specified halogen ions as a dipping in a treating solution. CONSTITUTION:A base board with a plating-resist with through-holes provided at specified positions is dipped in a chemical roughening solution, an acid aqueous solution of a chromic acid without any halogen ions. The halogen ions are F , Cl , Br , and I , and each ion concentration of the chemical roughening solution is less than 10ppm. Next, the base board having been dipped in the chemical roughening solution is then dipped in an treating solution, the acid aqueous solution of a chromic acid containing the halogen ions. This treating solution contains more then one kind of ions out of the halogen ions, F , Cl , Br , and I , by the concentration of more than 10ppm a kind. As a contained compound, such acid as a fluoric acid and hydrochloric acid or such salt as a sodium fluoride and sodium chloride is given. The temperature and time of this treatment differ depending upon the combination and concentration of a halogen ion, acid, and a hexahydric chromium compound in the treating solution.