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31. 发明专利

JP4175294B2 Bonding apparatus and a bonding tool 有权
公开(公告)号：JP4175294B2
公开(公告)日：2008-11-05
申请号：JP2004165284
申请日：2004-06-03
申请人：松下電器産業株式会社
发明人：雅史檜作
IPC分类号： H01L21/60 , H05K3/32
CPC分类号： H01L2224/75 , H01L2224/75355

32. 发明专利

JPWO2005117095A1 超音波接合方法および超音波接合装置有权
公开(公告)号：JPWO2005117095A1
公开(公告)日：2008-04-03
申请号：JP2006513821
申请日：2005-04-04
申请人：株式会社村田製作所
发明人：東山　祐三 , 祐三東山
IPC分类号： H01L21/607 , H01L21/60
CPC分类号： H01L24/81 , H01L2224/16 , H01L2224/75 , H01L2224/75355 , H01L2224/81801 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/10329
摘要：【課題】印加部材による超音波振動を効率よく接合部材に伝えることができ、機械的強度の低い接合部材であっても、良好な接合品質を得ることができる超音波接合方法を提供する。【解決手段】部品Pに超音波振動を加えて基板Bに対して接合する超音波接合方法であって、部品Pの超音波振動方向の両側面を、所定の超音波振動を印加する印加部材10,17と、挟持部材35とで挟持する。挟持部材35には、印加部材17に当接する当接部35aと弾性部材37とが設けられ、弾性部材37のたわみ力で部品Pを挟持する。挟持部材35を印加部材10,17から当接部35aを介して伝達される超音波振動によって同期振動させ、部品Pを印加部材10,17に押しつけた状態で部品Pを基板Bに対して接合する。【選択図】図4

33. 发明专利

JP2007242657A Oscillatory horn holder bonding apparatus 有权
标题翻译：振荡器手持架连接装置
公开(公告)号：JP2007242657A
公开(公告)日：2007-09-20
申请号：JP2006058925
申请日：2006-03-06
申请人： Shinkawa Ltd , 株式会社新川
发明人： SEYAMA KOHEI
IPC分类号： H01L21/607 , H01L21/60
CPC分类号： H01L24/85 , B23K20/005 , B23K2201/42 , H01L24/78 , H01L24/80 , H01L2224/75355 , H01L2224/78301 , H01L2224/7835 , H01L2224/78801 , H01L2224/78823 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01033 , Y10S228/904 , H01L2224/48 , H01L2224/45099
摘要： PROBLEM TO BE SOLVED: To reduce moment of inertia and to miniaturize an apparatus. SOLUTION: A horn holder 4 for holding an ultrasonic horn 1, a means for driving oscillation of the horn holder 4, and the virtual fulcrum 6 of the horn holder 4 are secured on the bonding surface 5. The drive means consists of a motor 10, and located in the upper central portion of the horn holder 4. Forward and rearward arcuate portions 4a and 4b are formed on the horn holder 4 around the virtual fulcrum 6 as a center. Front and rear cams 20 and 21 are formed to oscillatably through supports 22a and 23a at the portions of a bonding head 13 corresponding to the arcuate portions 4a and 4b of the horn holder 4. Arcuate portions 20a and 21a are formed on the front and rear cams 20 and 21 to make contact with the arcuate portions 4a and 4b of the horn holder 4 around the supports 22a and 23a as centers. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：减少转动惯量并使装置小型化。解决方案：用于保持超声波喇叭1的喇叭支架4，用于驱动喇叭支架4的振动的装置和喇叭支架4的虚拟支点6固定在接合表面5上。驱动装置由电动机10，位于喇叭保持器4的上部中央部。前后的弓形部4a，4b以虚拟支点6为中心形成在喇叭座4上。前凸轮20和后凸轮21形成为在与焊头保持器4的弓形部分4a和4b对应的接合头13的部分处可摆动地穿过支撑件22a和23a。弧形部分20a和21a形成在前后凸轮20和21与作为中心的支撑件22a和23a周围的喇叭支架4的弓形部分4a和4b接触。版权所有（C）2007，JPO＆INPIT

34. 发明专利

JP2007201108A Device and method for bonding electronic part 审中-公开
标题翻译：用于连接电子部件的装置和方法
公开(公告)号：JP2007201108A
公开(公告)日：2007-08-09
申请号：JP2006016891
申请日：2006-01-25
申请人： Sharp Corp , シャープ株式会社
发明人： MARUSAKI TSUNEJI
IPC分类号： H01L21/607 , H01L21/60
CPC分类号： H01L2224/16 , H01L2224/75 , H01L2224/75355 , H01L2224/75743
摘要： PROBLEM TO BE SOLVED: To provide an electronic part bonding device which prevents a reduction of a lifetime of a chucking tool without providing a jig, etc. separately, and also prevents a crack, etc. of an electronic part. SOLUTION: In the electronic part bonding device 20, a bump 27 provided in an electronic part 21 chucked and held to a chucking tool 22 is bonded to a line 25 formed in a board 24 chucked, and held to a stage 26 by applying a pressing load by a pressing means 28 and an ultrasonic oscillation by an ultrasonic oscillation applying means 29. A coefficient of friction between the stage 26 and the board 24 of the electronic part bonding device 20 is constituted to making it smaller than a coefficient of friction between the chucking tool 22 and the electronic part 21. When a bond between the bump 27 and the line 25 progresses and a predetermined coupling force occurs between the bump 27 and the line 25, a relative slide occurs between the board 24 and the stage 26. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种电子部件接合装置，其不分开地提供夹具等来防止夹紧工具的寿命降低，并且还防止电子部件的裂纹等。解决方案：在电子部件接合装置20中，将设置在夹持并夹持在夹紧工具22上的电子部件21中的凸块27接合到形成在卡盘24上的线25上，并通过通过按压装置28施加按压负荷，通过超声振动施加装置29进行超声波振动。电子部件接合装置20的台架26与板24之间的摩擦系数构成为使其小于夹紧工具22与电子部件21之间的摩擦。当突起27和线25之间的接合进行并且在凸起27和线25之间发生预定的耦合力时，在板24和台架之间发生相对滑动 26.版权所有（C）2007，JPO＆INPIT

35. 发明专利

JP2006128487A Method and apparatus of ultrasonic packaging electronic part 有权
标题翻译：超声波包装电子零件的方法与装置
公开(公告)号：JP2006128487A
公开(公告)日：2006-05-18
申请号：JP2004316537
申请日：2004-10-29
申请人： Fujitsu Ltd , 富士通株式会社
发明人： MATSUMURA TAKAYOSHI , KIRA HIDEHIKO , KOYAE KENJI , KAINUMA NORIO
IPC分类号： H01L21/60 , H01L21/607
CPC分类号： B23K20/106 , B23K20/10 , B23K2201/42 , H01L21/67144 , H01L24/75 , H01L24/81 , H01L2224/75 , H01L2224/75355 , H01L2224/81205 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/014
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus of ultrasonic packaging of an electronic part which can raise the bonding reliability of the bonding part of a bump and a substrate when the electronic part, such as a semiconductor chip, is carried on the substrate by utilizing an ultrasonic vibration.
SOLUTION: The method of ultrasonic packaging of the electronic part includes the steps of applying the ultrasonic vibration to the semiconductor chip and carrying the semiconductor chip by flip chip bonding to a circuit substrate in which an electrode terminal is provided. The semiconductor chip is packaged by operating the ultrasonic vibration in parallel with the chip surface to the semiconductor chip and operating a load by interlocking with the oscillating cycle of the ultrasonic vibration perpendicularly to the chip surface.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种电子部件的超声波包装的方法和装置，当半导体芯片等的电子部件为半导体芯片时，能够提高凸点的接合部和基板的接合可靠性通过利用超声波振动在基板上承载。解决方案：电子部件的超声波包装的方法包括以下步骤：将超声波振动施加到半导体芯片，并通过倒装芯片接合将半导体芯片携带到其中设置有电极端子的电路基板。半导体芯片通过与芯片表面平行地操作超声波振动而被封装到半导体芯片，并通过与垂直于芯片表面的超声振动的振荡周期互锁来操作负载。版权所有（C）2006，JPO＆NCIPI

36. 发明专利

JP3767547B2 Bonding apparatus and a bonding tool 有权
公开(公告)号：JP3767547B2
公开(公告)日：2006-04-19
申请号：JP2002356415
申请日：2002-12-09
申请人：松下電器産業株式会社
发明人：誠司 ▲高▼橋 , 雅史檜作
IPC分类号： H01L21/60
CPC分类号： H01L2224/16 , H01L2224/75 , H01L2224/75302 , H01L2224/75355 , H01L2224/75745

37. 发明专利

JP3664155B2 Bonding apparatus and a bonding tool of electronic components 有权
公开(公告)号：JP3664155B2
公开(公告)日：2005-06-22
申请号：JP2002224550
申请日：2002-08-01
申请人：松下電器産業株式会社
发明人：誠司 ▲高▼橋 , 雅史檜作
IPC分类号： H05K3/32 , H01L21/60 , H01L21/607 , H05K3/34
CPC分类号： H01L2224/75355

38. 发明专利

JP3536677B2 Bonding tools and bonding equipment 有权
公开(公告)号：JP3536677B2
公开(公告)日：2004-06-14
申请号：JP24806698
申请日：1998-09-02
申请人：松下電器産業株式会社
发明人：健一大竹 , 雅史桧作
IPC分类号： B06B1/02 , B06B1/06 , H01L21/60 , H01L21/607
CPC分类号： H01L2224/75 , H01L2224/75355

39. 发明专利

JP4593176B2 Bonding apparatus and a bonding tool 有权
公开(公告)号：JP4593176B2
公开(公告)日：2010-12-08
申请号：JP2004165285
申请日：2004-06-03
申请人：パナソニック株式会社
发明人：雅史檜作
IPC分类号： H01L21/60 , H05K3/32 , H01L21/607
CPC分类号： H01L2224/16 , H01L2224/75355 , H01L2924/01019

40. 发明专利

JP4423166B2 Ultrasonic mounting method and ultrasonic mounting apparatus of electronic components 有权
公开(公告)号：JP4423166B2
公开(公告)日：2010-03-03
申请号：JP2004316537
申请日：2004-10-29
申请人：富士通株式会社
发明人：秀彦吉良 , 健二小八重 , 貴由松村 , 則夫海沼
IPC分类号： H01L21/60 , H01L21/607
CPC分类号： B23K20/106 , B23K20/10 , B23K2201/42 , H01L21/67144 , H01L24/75 , H01L24/81 , H01L2224/75 , H01L2224/75355 , H01L2224/81205 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01079 , H01L2924/014

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