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31. 发明专利

JP2006148240A Coupling line and directional coupler 审中-公开
标题翻译：耦合线和方向耦合器
公开(公告)号：JP2006148240A
公开(公告)日：2006-06-08
申请号：JP2004332140
申请日：2004-11-16
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YUASA TAKESHI , TAWARA YUKIHIRO , OHASHI HIDEMASA
IPC分类号： H01P5/18
摘要： PROBLEM TO BE SOLVED: To obtain a coupling line in which variation in characteristics can be lessened for variation in substrate thickness, and to obtain a directional coupler employing that coupling line. SOLUTION: The coupling line comprises a first ground conductor 2a formed on the rear surface of a substrate 1, a second ground conductor 2b formed on the surface of the substrate 1, and a first signal line conductor 3a and a second signal line conductor 3b laid in layers in the substrate 1 between the first ground conductor 2a and the second ground conductor 2b to be coupled electromagnetically. The coupling line is further provided with at least one conductor wall 4 in the substrate 1 to be connected electrically with at least any one of the first ground conductor 2a and the second ground conductor 2b in close proximity to at least any one of the first signal line conductor 3a and the second signal line conductor 3b and continuously to the signal transmitting direction of the first signal line conductor 3a and the second signal line conductor 3b. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了获得可以减小基板厚度变化的特性变化的耦合线，并且获得使用该耦合线的定向耦合器。解决方案：耦合线包括形成在基板1的后表面上的第一接地导体2a，形成在基板1的表面上的第二接地导体2b和第一信号线导体3a和第二信号线导体3b以第一接地导体2a和第二接地导体2b之间的基板1的方式铺设成电磁耦合。耦合线还在衬底1中设置有至少一个导体壁4，以与第一接地导体2a和第二接地导体2b中的至少任何一个电连接，接近第一信号中的至少任何一个线路导体3a和第二信号线导体3b连续地连接到第一信号线导体3a和第二信号线导体3b的信号发送方向。版权所有（C）2006，JPO＆NCIPI

32. 发明专利

JP2005328650A Retro directive array antenna device and space photovoltaic power generation system using same 审中-公开
标题翻译： RETRO方向阵列天线装置和空间光伏发电系统
公开(公告)号：JP2005328650A
公开(公告)日：2005-11-24
申请号：JP2004145134
申请日：2004-05-14
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NISHIMOTO KENGO , OTSUKA MASATAKA , FUKAZAWA TORU , OHASHI HIDEMASA , NISHIOKA YASUHIRO
IPC分类号： B64G1/44 , H01L31/04 , H01Q3/26 , H02J17/00
CPC分类号： Y02E10/50
摘要： PROBLEM TO BE SOLVED: To obtain a small size/light weight retro directive array antenna device which does not need a calculating process without coupling a pilot reception wave and a transmission wave. SOLUTION: The retro directive array antenna device uses a pilot signal sent from the reception antenna installing position being AM modulated light. The retro directive array antenna device includes an array antenna having a plurality of transmission antenna elements, light receiving means respectively provided one by one correspondingly near the plurality of the transmission antennas to receive the pilot signal and to convert it into an electric signal, and a phase conjugate circuit for radiating the radio wave of the phase inverted from the phase of the electrical signal from the plurality of the transmission antenna elements. The main beam of the array antenna is directed in the incoming direction of the pilot signal. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：为了获得不需要计算处理而不耦合导频接收波和发送波的小尺寸/轻量级的复数指示阵列天线装置。解决方案：复数指示阵列天线装置使用从接收天线安装位置发送的导频信号是AM调制光。复数指示阵列天线装置包括具有多个发送天线元件的阵列天线，分别相应地在多个发送天线附近设置的光接收装置，以接收导频信号并将其转换成电信号，相位共轭电路，用于辐射从多个发送天线元件的电信号的相位反转的相位的无线电波。阵列天线的主波束被引导到导频信号的输入方向。版权所有（C）2006，JPO＆NCIPI

33. 发明专利

JP2005244831A Rf-mems switch device and antenna device with rf-mems switch apparatus mounted thereon 有权
标题翻译： RF-MEMS开关器件和天线器件与RF-MEMS开关器件安装在一起
公开(公告)号：JP2005244831A
公开(公告)日：2005-09-08
申请号：JP2004054660
申请日：2004-02-27
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： NISHIZAWA KAZUFUMI , KOGA YOKO , MIYASHITA HIROAKI , OHASHI HIDEMASA , NISHINO TAMOTSU
IPC分类号： H01P1/00 , H01P1/12 , H01Q1/38 , H01Q9/14 , H01Q13/08
摘要： PROBLEM TO BE SOLVED: To obtain an RF-MEMS switch device and antenna device with the same loaded thereon in which an influence exerted by a bias line upon an electromagnetic field inside an RF circuit can be reduced.
SOLUTION: An RF circuit including a plurality of conductor cells 2 serially provided on the upper surface of a silicon substrate 1, a ground conductor 3 provided on the lower surface of the silicon substrate 1 and a power feeding line 6 connected between a conductor cell 2a and the ground conductor 3 comprises an RF-MEMS switch 11 provided between conductor cells 2a and 2b and an RF-MEMS switch 13 provided between conductor cells 2b and 2c. The RF-MEMS switch 11 includes a driving metallic plate 11a, a lower metallic plate 11b, a bias line 11c, a bias line 11d, and a DC variable power source, and the RF-MEMS switch 13 includes a driving metallic plate 13a, a lower metallic plate 13b, a bias line 13d, and a DC variable power source.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：为了获得装载在其上的RF-MEMS开关装置和天线装置，其中可以减少由偏置线对RF电路内的电磁场施加的影响。解决方案：包括串联设置在硅衬底1的上表面上的多个导体单元2的RF电路，设置在硅衬底1的下表面上的接地导体3和连接在硅衬底1之间的馈电线6 导体单元2a和接地导体3包括设置在导体单元2a和2b之间的RF-MEMS开关11和设置在导体单元2b和2c之间的RF-MEMS开关13。 RF-MEMS开关11包括驱动金属板11a，下金属板11b，偏置线11c，偏置线11d和直流可变电源，RF-MEMS开关13包括驱动金属板13a，下金属板13b，偏压线13d和直流可变电源。版权所有（C）2005，JPO＆NCIPI

34. 发明专利

JP2005175803A High frequency filter and multi-layer capacitor circuit 有权
标题翻译：高频滤波器和多层电容电路
公开(公告)号：JP2005175803A
公开(公告)日：2005-06-30
申请号：JP2003412166
申请日：2003-12-10
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： YONEDA SATOSHI , OWADA SATORU , OHASHI HIDEMASA , SHIGENAGA KOICHI
IPC分类号： H01P1/203 , H01P1/20 , H01P1/205
摘要： PROBLEM TO BE SOLVED: To provide a high frequency filter having a blocking band with absolute necessary band width and attenuation amounts at the high frequency side and low frequency side of a pass band wherein an insertion loss is small.
SOLUTION: Branch stabs 38a and 38b configured of transmission lines 29a, 29b, 30a, 30b, 34a and 34b with branch parts in the middle of the transmission lines are used for the parallel inductance circuit of a high frequency filter 100, and the physical length and characteristic impedances of the transmission lines 29a, 29b, 30a, 30b, 34a and 34b are adjusted to set an anti-resonance frequency f
1 .
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供具有绝对必需带宽的阻挡带和在插入损耗小的通带的高频侧和低频侧的衰减量的高频滤波器。解决方案：在高频滤波器100的并联电感电路中使用由传输线中间的分支部分的传输线29a，29b，30a，30b，34a和34b构成的分支线38a和38b，调整传输线路29a，29b，30a，30b，34a和34b的物理长度和特性阻抗，以设定反共振频率f 1 。版权所有（C）2005，JPO＆NCIPI

35. 发明专利

JP2005117139A Microwave module, and array antenna system employing the same 审中-公开
标题翻译：微波模块和使用其的阵列天线系统
公开(公告)号：JP2005117139A
公开(公告)日：2005-04-28
申请号：JP2003345636
申请日：2003-10-03
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： IKEMATSU HIROSHI , OHASHI HIDEMASA , KITAMURA YOICHI
IPC分类号： H05K3/46 , H01L23/12 , H01L25/00 , H01Q1/38 , H01Q13/08 , H01Q21/08 , H01Q23/00
CPC分类号： H01L2223/6677 , H01L2224/16227 , H01L2924/15153 , H01L2924/15321 , H01L2924/15787
摘要： PROBLEM TO BE SOLVED: To provide a microwave module wherein molding by a resin or the like is attained for active elements such as a high output amplifier and a low noise amplifier and antenna elements can spatially efficiently be arranged. SOLUTION: Ceramic substrates are stacked and a cavity 15 is formed by holes formed to the ceramic substrates. The active elements and an integrated circuit are arranged in the cavity 15. Solder balls 20 connected to the other substrate are provided to a bottom face of the microwave module 14. The active elements or the like are arranged to the cavity 15, and resin mold is applied to shield the active elements or the like from an external environment. COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种微波模块，其中通过树脂等来实现用于诸如高输出放大器和低噪声放大器的有源元件的模制，并且可以在空间上有效地布置天线元件。
解决方案：陶瓷基板被堆叠，并且通过形成在陶瓷基板上的孔形成空腔15。有源元件和集成电路被布置在空腔15中。连接到另一基板的焊球20被提供到微波模块14的底面。有源元件等被布置到空腔15，树脂模具用于屏蔽来自外部环境的有源元件等。版权所有（C）2005，JPO＆NCIPI

36. 发明专利

JP2005045341A Waveguide reflectionless terminator and waveguide circuit 有权
标题翻译：波导无反射终端和波形电路
公开(公告)号：JP2005045341A
公开(公告)日：2005-02-17
申请号：JP2003200370
申请日：2003-07-23
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： ASAO HIDEKI , YOSHINO YUKIJI , HENMI KAZUHISA , OHASHI HIDEMASA , TAWARA YUKIHIRO , OGAWA HIDEO , YONEDA HISAFUMI , MUKUDA MUNEAKI
IPC分类号： H01P1/26
CPC分类号： H01P1/264
摘要： PROBLEM TO BE SOLVED: To provide a waveguide reflectionless terminator or a waveguide circuit with a small size, a light weight, having excellent power withstanding performance at a low manufacturing cost.
SOLUTION: The waveguide reflectionless terminator includes: a waveguide section 1 having a rectangular aperture within a plane perpendicular to a radio wave propagation direction, one end of which in the radio wave propagation direction is opened and the other end of which is closed by a termination metallic inner wall 25, and surrounded by a first metallic inner wall a short side of the aperture of which includes a radio wave propagation space and located in parallel with the electric field of the radio wave, a second metallic inner wall opposed to the first metallic inner wall, a third metallic inner wall including a long side of the aperture and located perpendicular to the electric field of the radio wave, and a fourth metallic inner wall opposed to the third metallic inner wall; and a radio wave absorbing body 22 whose outer shape is a rectangular parallelepiped shape, the rear end face of a rectangular parallelepiped shape of which is located at a position apart from a termination metallic inner wall by a prescribed distance in parallel with its inner wall face, and a face with a maximum area of the rectangular parallelepiped shape of which is placed on the third or fourth metallic inner wall.
COPYRIGHT: (C)2005,JPO&NCIPI
摘要翻译：要解决的问题：提供一种具有体积小，重量轻的波导反射终止器或波导电路，在低制造成本下具有优异的功率耐受性能。解决方案：波导反射终止器包括：波导部分1，其在垂直于无线电波传播方向的平面内具有矩形孔，其一端在无线电波传播方向上被打开，另一端封闭通过终端金属内壁25，并且被第一金属内壁包围，孔的短边包括无线电波传播空间并且与无线电波的电场平行定位，第二金属内壁与第一金属内壁，包括孔的长边并且垂直于无线电波的电场定位的第三金属内壁和与第三金属内壁相对的第四金属内壁; 以及外形为长方体形状的无线电波吸收体22，其长方体形状的后端面位于与终端金属内壁隔开规定距离的位置，与其内壁面平行并且其长方体形状的最大面积被放置在第三或第四金属内壁上的面。版权所有（C）2005，JPO＆NCIPI

37. 发明专利

JP2004158665A Substrate for package and its manufacturing method 审中-公开
公开(公告)号：JP2004158665A
公开(公告)日：2004-06-03
申请号：JP2002323547
申请日：2002-11-07
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： USAMI AKIRA , OHASHI HIDEMASA , NISHINO TAMOTSU , OWADA SATORU , MAEDA CHISAKO , YOSHIDA YUKIHISA
IPC分类号： H01L23/12 , H01L23/13
摘要： PROBLEM TO BE SOLVED: To provide a substrate for a package of high performance in which components formed of a metal conductor or a resistor of high dimensional precision are built. SOLUTION: The substrate for package is formed by laminating dielectrics and at least one out of the conductor or the resistor, and performing the firing thereof. Components including either of a substrate wherein the resistor or the conductor is previously deposited, metal strips and an MEMS device are built in the substrate for package, thereby enabling manufacture of a substrate for package with high dimensional precision. COPYRIGHT: (C)2004,JPO

38. 发明专利

JP2003309483A High frequency module, active phased array antenna and communication equipment 审中-公开
标题翻译：高频模块，主动定时阵列天线和通信设备
公开(公告)号：JP2003309483A
公开(公告)日：2003-10-31
申请号：JP2002113758
申请日：2002-04-16
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： IKEMATSU HIROSHI , TAKEUCHI NORIO , OWADA SATORU , OHASHI HIDEMASA , HIEDA MORISHIGE , MORI KAZUTOMI , TAKAGI SUNAO
IPC分类号： H01Q3/26 , H01Q13/08 , H04B1/18
摘要： PROBLEM TO BE SOLVED: To realize a small and low-cost high frequency module, which is used for a communication system using a microwave such as mobile satellite communication.
SOLUTION: A multilayer package 17 comprising a box-shaped cavity 17a wherein one face forms an opening part and a lid 17a covering the opening part, wherein the lid composed of multilayer substrates layered in the direction of its thickness, and in the cavity, the bottom part and four side walls are composed of multilayer substrates whose laying direction is the same as that of the lid is provided. An element antenna 31 is formed on the surface of the lid 17b of the multilayer package, and low noise amplifiers 2 and 9 are mounted on the rear face of the lid 17b. A 90° hybrid circuit 4 and low-pass filters 3 and 10 as well as low noise amplifiers 5 and 11 and phase shifters 6 and 17 are mounted in the cavity 17a. A ball grid array 21 for connection with a mother substrate 22 is provided on the bottom face of the cavity 17a.
COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：实现用于使用诸如移动卫星通信之类的微波的通信系统的小型和低成本的高频模块。解决方案：一种多层封装17，其包括盒形腔17a，其中一个面形成开口部分和覆盖开口部分的盖子17a，其中由沿其厚度方向分层的多层基板构成的盖子和空腔，底部和四个侧壁由多层基板构成，其布置方向与盖的方向相同。元件天线31形成在多层封装的盖17b的表面上，低噪声放大器2和9安装在盖17b的后表面上。 90°混合电路4和低通滤波器3和10以及低噪声放大器5和11以及移相器6和17安装在腔17a中。用于与母基板22连接的球栅阵列21设置在空腔17a的底面上。版权所有（C）2004，JPO

39. 发明专利

JP2003283217A High-frequency circuit device 审中-公开
标题翻译：高频电路设备
公开(公告)号：JP2003283217A
公开(公告)日：2003-10-03
申请号：JP2002083689
申请日：2002-03-25
申请人： Mitsubishi Electric Corp , 三菱電機株式会社
发明人： TSUMURA AKIRA , SATO HIROYUKI , OWADA SATORU , OHASHI HIDEMASA , TAWARA YUKIHIRO , MIYAZAKI MORIYASU , YANAGIURA SATOSHI
IPC分类号： H01P3/08
摘要： PROBLEM TO BE SOLVED: To solve the problem that improvement of mounting density may increase feed losses and to reduce the cost of entire antenna sub-system, in a high-frequency circuit device provided on a multilayer dielectric substrate. SOLUTION: Two layers of build-up layers 13 are laminated on each of three-layer laminated substrate (BT resin) 12 having a thickness of 0.1 mm for each layer, totalling seven layers (e.g. eight-layer conductive layer 2) to form a multilayer dielectric substrate 3. The actually measured thickness of the substrate 3 is 1.0 mm. In this substrate 3, the layer 2 consisting of multiple layers (eight layers) is provided only in a region A in a Fig. 1 (reference numeral 4 in the figure), and the layer 2 is not provided in a region B (reference numeral 5 in the figure) in an intermediate layer in the substrate. A strip line 1 is provided on the uppermost layer in the region A, and a ground conductor pattern is provided on the second layer therebelow to form a transmission line. Also, a distribution circuit and a control line are arranged highly densely by using the other conductive layers. COPYRIGHT: (C)2004,JPO
摘要翻译：解决的问题为了解决设置在多层电介质基板上的高频电路装置中，安装密度的提高可能增加馈电损耗并降低整个天线子系统的成本的问题。解决方案：对于每层厚度为0.1mm的三层层压基板（BT树脂）12，共计七层（例如八层导电层2），分别层叠两层积层13，以形成多层电介质基板3.基板3的实测厚度为1.0mm。在该基板3中，仅在图1的区域A中设置由多层（8层）构成的层2。在图1中的中间层中，图1中的区域B（附图标记5）中没有设置层2。在区域A中的最上层设置带状线1，在其下方的第二层上设置接地导体图案，形成传输线。此外，分配电路和控制线通过使用其它导电层而被高度密集地布置。版权所有（C）2004，JPO

40. 发明专利

JP2015035468A プリント回路基板有权
标题翻译：印刷电路板
公开(公告)号：JP2015035468A
公开(公告)日：2015-02-19
申请号：JP2013164956
申请日：2013-08-08
申请人：三菱電機株式会社 , Mitsubishi Electric Corp
发明人： MOTOHASHI AYUMI , NAKAMOTO HISAYUKI , SASAKI YUICHI , OKA NAOTO , OHASHI HIDEMASA
IPC分类号： H05K3/46
摘要：【課題】差動線路からの放射ノイズを抑制し、耐ノイズ性を向上させる。【解決手段】この発明に係るプリント回路基板は、配線及び部品を実装する層とグラウンド層とを有し、配線及び部品を実装する層に形成された第1の導体と第2の導体から成る差動線路と、差動線路をはさみ近接した位置に置かれた第1、第2の部品と、第1の部品と第1の導体とを接続する第1の接続導体と、第2の部品と第2の導体とを接続する第2の接続導体とを備え、配線及び部品を実装する層およびグラウンド層の間の層に、第1の接続導体および第1の部品の直下の位置に形成した第1の金属パターンと、第2の接続導体および第2の部品の直下の位置に形成した第2の金属パターンとを備え、第1の導体または第1の接続導体と第1の金属パターンおよび第2の導体または第2の接続導体と第2の金属パターンを、それぞれ電気的に接続した。【選択図】図1
摘要翻译：要解决的问题：抑制来自差分线路的辐射噪声以提高抗噪声性能。解决方案：根据本实施例的印刷电路板包括用于安装布线和部件的层和接地层。用于安装布线和组件的层包括：由第一导体和第二导体组成的差分线; 第一和第二部件被放置在跨越差动线的彼此相邻的位置; 用于连接第一部件和第一导体的第一导体; 以及用于连接第二部件和第二导体的第二连接导体。电路板还包括：形成在用于安装布线的层与部件和接地层之间的第一金属图案，以及位于第一连接导体和第一部件正下方的位置; 以及形成在用于安装布线的层与部件和接地层之间的第二金属图案，以及在第二连接导体和第二部件正下方的位置处，第一导体或第一连接导体与第二连接导体电连接第一金属图案和第一导体或第二连接导体与第二金属图案电连接。

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