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    • 31. 发明专利
    • ARBITER CIRCUIT
    • JPS63143654A
    • 1988-06-15
    • JP29072686
    • 1986-12-05
    • MITSUBISHI ELECTRIC CORP
    • MIHARA MASAAKIKOBAYASHI TOSHIFUMI
    • G06F13/362G06F13/14G06F13/26
    • PURPOSE:To execute a competition deciding processing without simultaneously activating input signals to an RS flip flop by providing the titled circuit with a device for controlling a transfer gate for transmitting a 2nd request signal by a 1st request signal. CONSTITUTION:When a request signal REQ-B is turned from 'L' to 'H', a connection terminal 4 is turned from 'L' to 'H' with the delay of time ta. A connection terminal 4d is also turned from 'H' to 'L' with the delay of time tb from the ta. Thereby, the voltage of a terminal 4e is kept at 'L' only for the time ta+tb from the time turning the request signal REQ-B from 'L' to 'H' and the transfer gate 5 is turned off. When a request signal REQ-A is turned from 'L' to 'H', the connection terminal 4a is turned from 'H' to 'L'. When the transfer gate 5 is ON, the connection terminal 4b is turned from 'L' to 'H' in accordance with the change of the connection terminal 4a, but when the gate 5 is OFF, the connection terminal 4b is held at the immediately preceding state by a latch circuit constituted of inverters 2c, 2d.
    • 34. 发明专利
    • SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
    • JPS61148860A
    • 1986-07-07
    • JP27116584
    • 1984-12-21
    • MITSUBISHI ELECTRIC CORP
    • MOROOKA KIICHIYAMADA MICHIHIROKOBAYASHI TOSHIFUMIMASUKO KOICHIRO
    • H01L27/06H01L27/02
    • PURPOSE:To make it possible to ensure operational allowance, by providing a switch circuit, which controls the amount of current of a discharge circuit in correspondence with an operation control signal of a semiconductor integrated circuit device, in the discharge circuit between a substrate-potential and a reference-potential, thereby reducing the fluctuation of the substrate-potential due to the operation of the semiconductor integrated circuit device. CONSTITUTION:When an operation control signal has the same potential as that of a reference-potential wiring GND, a substrate-potential wiring VBB wiring is kept at a level, which is lower than the reference-potential wiring GND by the sum of the threshold voltages of field effect transistors Q11-Q15. When the operation control signal is increased to a potential, which is sufficiently higher than the threshold voltage of the transistor 15, the transistor 15 becomes a conducting state. and its potential is increased to the potentials of the gate and drain of the transistor Q14 and the reference-potential wiring GND. The current supplying capability of a discharge circuit 1 becomes large. Even if the semiconductor integrated circuit device is operated and the substrate- potential is decreased, the specified potential can be immediately restored and kept constant.
    • 35. 发明专利
    • Mos type semiconductor integrated circuit
    • MOS型半导体集成电路
    • JPS6149456A
    • 1986-03-11
    • JP17200284
    • 1984-08-17
    • Mitsubishi Electric Corp
    • KOBAYASHI TOSHIFUMIYAMADA MICHIHIROMASUKO KOICHIROMIYAMOTO HIROSHIARIMOTO KAZUTAMIMOROOKA KIICHI
    • H01L27/04H01L21/822H01L27/02
    • H01L27/0218
    • PURPOSE:To prevent a change into a positive value of substrate voltage by forming a MOSFET for clamping substrate voltage in which a drain and a gate are connected to a substrate and a source is connected to a ground. CONSTITUTION:A bonding pad 3 is connected to a die frame for a package with which a chip 1 for a MOS dynamic RAM is die-bonded, and substrate voltage is applied to a substrate for the chip 1. When a memory cell is formed generally by using a process of double layer poly Si, a memory cell plate is constituted by first poly Si, but a gate oxide film in first poly Si is thinned extremely. A grounding wiring 4 and an output 5 from a substrate-voltage generating circuit are wired so as to make a round on the outer circumference of the chip 1. Accordingly, when a first poly Si gate FET in which a drain and a gate are connected to the wiring 5 in a transistor region 8 for clamping substrate voltage and a source is connected to the wiring 4 is formed, a MOSFET for clamping substrate voltage having extremely low threshold voltage can be constituted.
    • 目的:通过形成用于钳位衬底电压的MOSFET来防止衬底电压的正值变化,其中漏极和栅极连接到衬底并且源极连接到地。 构成:接合焊盘3连接到用于MOS动态RAM的芯片1裸片结合的封装的管芯框架,并且将衬底电压施加到用于芯片1的衬底。当通常形成存储器单元时 通过使用双层多晶硅的工艺,存储单元板由第一多晶硅构成,但第一多晶硅中的栅极氧化膜极其稀薄。 来自基板电压产生电路的接地布线4和输出5被布线以在芯片1的外圆周上圆形化。因此,当连接漏极和栅极的第一多晶硅栅极FET 对于用于钳位基板电压的晶体管区域8中的布线5,并且形成与布线4连接的源极,可以构成用于钳位具有极低阈值电压的基板电压的MOSFET。
    • 36. 发明专利
    • Dymanic random access memory
    • DYMANIC随机存取存储器
    • JPS6120298A
    • 1986-01-29
    • JP14079284
    • 1984-07-05
    • Mitsubishi Electric Corp
    • MIYAMOTO HIROSHIYAMADA MICHIHIROMASUKO KOUICHIROUKOBAYASHI TOSHIFUMIARIMOTO KAZUTAMIMOROOKA KIICHI
    • G11C11/407G11C11/34G11C11/401G11C11/408
    • PURPOSE: To obtain a dynamic RAM advantageous in layout chip area and in which penetration radio wave from power source potential to grounding potential in a column predecoder does not flow by making decoder operation in the column predecoder only by a signal corresponding to a column address.
      CONSTITUTION: Sense amplifiers SA are arranged at the center of each block, and divided column decoders CD1 and CD2 are arranged on both sides of the sense amplifiers and memory cells MC are arranged further outside. A row decoder RD is placed on upper end of all blocks. PD1WPD4 are column predecoders, and signals CA1 or C'A'1, CA2 or C'A'2 corresponding to 2 bits of the column address and a column address driving signal CY are connected to each column predecoder. CY1WCY4 are column predecoded signals.
      COPYRIGHT: (C)1986,JPO&Japio
    • 目的:为了获得有利于布局芯片面积的动态RAM,并且在列预解码器中,从源电位到接地电位的穿透无线电波不能仅通过与列地址对应的信号在列预解码器中进行解码器运行。 构成:感测放大器SA布置在每个块的中心,并且分离列解码器CD1和CD2被布置在读出放大器的两侧,并且存储单元MC被进一步布置在外部。 行解码器RD放置在所有块的上端。 PD1-PD4是列预解码器,并且对应于列地址的2位和列地址驱动信号CY的信号CA1或C'A'1,CA2或C'A'2连接到每列预解码器。 CY1-CY4是列预编码信号。
    • 38. 发明专利
    • Input circuit for semiconductor device
    • 半导体器件的输入电路
    • JPS60211864A
    • 1985-10-24
    • JP6942184
    • 1984-04-05
    • Mitsubishi Electric Corp
    • YAMAGATA NARIHITOYAMADA MICHIHIROMIYAMOTO HIROSHIMOROOKA KIICHIARIMOTO KAZUTAMIKOBAYASHI TOSHIFUMIMASUKO KOUICHIROU
    • H01L29/41H01L23/485
    • H01L24/05H01L23/485H01L2224/05554H01L2924/00014H01L2924/01013H01L2924/01082H01L2224/05599
    • PURPOSE:To prevent breakdown due to an electrostatic surge in a connecting section between a first diffusion layer and a second diffusion layer gy gently connecting said first diffusion layer and second diffusion layer by the connecting section, width thereof slowly changes. CONSTITUTION:Currents from a bonding pad reach to a first diffusion layer 4a thrugh an aluminum lead wire 1 and a polysilicon layer 2. The currents flow into a second diffusion layer 4b having width narrower than the first diffusion layer 4a from the first diffusion layer 4a, but the sudden concentration of currents to a connecting section between the first diffusion layer 4a and the second diffusion layer 4b can be avoided because the width of the connecting section between both layers 4a and 4b gradually reduceds at that time. Accordingly, breakdown due to an electrostatic surge in the connecting section 4c between the first diffusion layer 4a and the second diffusion layer 4b can be prevented.
    • 目的:为了防止由连接部分轻轻地连接所述第一扩散层和第二扩散层的第一扩散层和第二扩散层之间的连接部分中的静电浪涌导致的破坏,其宽度缓慢变化。 构成:来自焊盘的电流到达第一扩散层4a,而铝导线1和多晶硅层2.电流从第一扩散层4a流入具有比第一扩散层4a窄的宽度的第二扩散层4b 但是由于两层4a和4b之间的连接部分的宽度在此时逐渐减小,所以可以避免对第一扩散层4a和第二扩散层4b之间的连接部分的电流的突然浓度。 因此,可以防止由于第一扩散层4a和第二扩散层4b之间的连接部分4c中的静电浪涌引起的故障。