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31. 发明专利

JPH01198829A DIGITAL ANALOG CONVERTER 失效
公开(公告)号：JPH01198829A
公开(公告)日：1989-08-10
申请号：JP2434388
申请日：1988-02-03
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TAKAYAMA TAKEYUKI , NISHIDA KOJI , KOGA HIROSHI
IPC分类号： H03M1/10 , H03M1/08
摘要： PURPOSE:To prevent zero cross distortion from taking place by adding a prescribed offset value to an input digital signal to the 1st digital analog converter DAC and the 2nd DAC respectively. CONSTITUTION:The amplitude of an input digital signal 1 is detected by a level detection circuit 6 and offset adders 5, 7 use an offset switching signal 3 to switch the offset value from zero to a value of 1/4 of the maximum amplitude. The signal added with the offset to the input signal 1 is converted into an analog signal by a DAC 10 and a signal adding with the offset to the signal being the result of inverting the phase of the input signal 1 by a polarity inversion circuit 11 is converted by the DAC 12. Then the output voltages of the DACs 10, 12 are subtracted by an operational amplifier 13 to eliminate the offset component. Then an output voltage of ant DAC is positive or 0V and no zero crossing is caused and zero cross distortion is eliminated.

32. 发明专利

JPS6451693A MANUFACTURE OF ELECTRONIC CIRCUIT SUBSTRATE 失效
公开(公告)号：JPS6451693A
公开(公告)日：1989-02-27
申请号：JP20961187
申请日：1987-08-24
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NAKAMURA HISASHI , HARUTA YOICHI , NISHIDA KOJI , KAWAYAMA MASARU
IPC分类号： H05K3/32 , H05K1/09 , H05K3/24 , H05K3/34
摘要： PURPOSE:To reduce the connection resistance inbetween circuit elements and a circuit conductor layer, and to improve the reliability of connection, by a method wherein small-sized circuit elements of plane connection type are mounted before conductive resin on which a circuit conductor layer is formed by screen printing method is not cured, and then an electronic circuit is constituted by depositing simultaneously a conducting metal layer on both a conductive resin layer fixed by an electroless plating and an external connection terminal layer for circuit elements. CONSTITUTION:On the main surface of an insulating substrate 5, paste composed of conductive resin 6 obtained by electroless plating is spread in a desired form of wiring circuit pattern, by screen printing art. Then, small-sized circuit elements 7 are mounted. External connection terminals 8, 8' of the circuit elements 7 are brought into contact with a part of conductive resin 6 in the uncured state, and then the conductive resin 6 is cured. One in which the small-sized circuit elements 7 are fixed at specified positions of an insulating substrate 5 with the conductive resin 6, is dipped in the electroless plating solution, and a conducting metal layer 9 is deposited on the surface of the conductive resin 6 fixed in the form of a wiring circuit, and on the external connection terminals 8, 8' of the circuit element 7.

33. 发明专利

JPS63226053A HYBRID INTEGRATED CHIP MODULE 失效
公开(公告)号：JPS63226053A
公开(公告)日：1988-09-20
申请号：JP5935887
申请日：1987-03-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NISHIDA KOJI
IPC分类号： H01L23/538 , H01L23/32 , H01L23/52 , H05K3/46
摘要： PURPOSE:To facilitate a printing process and prevent a substrate edge electrode section from degrading in conductivity by a method wherein a plurality of internal leadout electrodes are provided along the bottom circumference of a substrate mounted with a wiring circuit and the substrate is placed on a chip carrier provided with a plurality of external leadout electrodes to be connected to said internal leadout electrodes. CONSTITUTION:A printed wiring circuit substrate 1 includes a single-layer or multilayer wiring circuit, and is provided with a plurality of internal leadout electrodes 3 along its bottom circumference for input/output signals. A glass- made protecting film 9 is provided. In a chip carrier 4, along the peripheral walls of a package, grooves 5 are provided, which correspond to the internal leadout electrodes 3. Along the circumference of the chip carrier 4, a plurality of solderable external leadout electrodes 6 are built at equal intervals. The internal leadout electrodes 3 of the printed wiring circuit substrate 1 to be installed thereon are soldered to said external leadout electrodes 6. Resin is caused to flow into an opening 8 provided at the middle of the chip carrier 4 for the protection of chip parts 7 against moisture. The resin also establishes adhesion between the printed wiring circuit substrate 1 and chip carrier 4.

34. 发明专利

JPS63226006A LASER TRIMMING OF FILM RESISTOR 失效
公开(公告)号：JPS63226006A
公开(公告)日：1988-09-20
申请号：JP5935787
申请日：1987-03-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： OISHI KAZUO , URYU HIDEKAZU , NISHIDA KOJI , HASEGAWA HIROSHI
IPC分类号： H01C17/242 , H01C17/24 , H01L21/822 , H01L27/01 , H01L27/04

35. 发明专利

JPS63225484A MANUFACTURE OF CHIP JUMPER 失效
公开(公告)号：JPS63225484A
公开(公告)日：1988-09-20
申请号：JP5936187
申请日：1987-03-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NISHIDA KOJI
IPC分类号： H01R11/01 , H01B13/00 , H01C17/06 , H01R43/00

36. 发明专利

JPS62169846A SEALING RESIN COMPOSITION 失效
公开(公告)号：JPS62169846A
公开(公告)日：1987-07-27
申请号：JP1170586
申请日：1986-01-22
申请人： MATSUSHITA ELECTRIC WORKS LTD , MATSUSHITA ELECTRIC IND CO LTD
发明人： MIYATANI YOSHIHIRO , TAKAHASHI TERUHISA , NISHIDA KOJI , SUGIURA YASUO
IPC分类号： H01L23/29 , C08G59/00 , C08L63/00 , H01B3/40 , H01C1/02 , H01G4/224 , H01L23/31
摘要： PURPOSE:To obtain a sealing resin compsn. which has good developability and color contrast and allows laser marking to be easily carried out, by adding a phenolic resin, a curing agent, a filler and a metal-contg. azo dye as a coloring material to an epoxy resin. CONSTITUTION:In a sealing resin compsn. obtd. by adding a phenolic resin, a curing agent, a coloring material, a solvent and optionally, modifiers such as a reactive diluent, a thickener, a gelling agent, etc. to an epoxy resin, a metal-contg. azo dye is used as said coloring material. Preferred examples of the phenolic resin are resol type phenolic resins. The ratio of 50-90pts.wt. epoxy resin to 50-10pts.wt. phenolic resin is preferred from the viewpoints of well-balanced properties between the performance for the sealing material and laser marking.

37. 发明专利

JPS6265306A FINE PITCH INDEPENDENT RESISTANCE CIRCUIT PATTERN 失效
公开(公告)号：JPS6265306A
公开(公告)日：1987-03-24
申请号：JP20474785
申请日：1985-09-17
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： OISHI KAZUO , NISHIDA KOJI , HOSHITOKU SEIJI
IPC分类号： H01C13/02 , H01C7/00 , H01C17/24 , H01C17/242

38. 发明专利

JPS6143842B2 失效
公开(公告)号：JPS6143842B2
公开(公告)日：1986-09-30
申请号：JP12764781
申请日：1981-08-13
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NISHIDA KOJI
IPC分类号： H01C17/24 , H01C13/02 , H01C17/22 , H03M1/78

39. 发明专利

JPS5152758A 失效
公开(公告)号：JPS5152758A
公开(公告)日：1976-05-10
申请号：JP12699574
申请日：1974-11-01
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： NISHIDA KOJI , SHINDO YASUHIRO , KOKADO HIRONOBU
IPC分类号： H01C13/00 , H03H7/24

40. 发明专利

JP2002228533A MEASURING DEVICE AND MEASURING SYSTEM 失效
公开(公告)号：JP2002228533A
公开(公告)日：2002-08-14
申请号：JP2001026084
申请日：2001-02-01
申请人： MATSUSHITA ELECTRIC IND CO LTD , T & T KK
发明人： NISHIDA KOJI , WAKABAYASHI KATSUJI , ONUKI SATORU
IPC分类号： G01L19/00 , G01K1/14 , G01L7/00 , G01L9/04 , G01N11/08
摘要： PROBLEM TO BE SOLVED: To solve the problem of stagnation of a fluid to be measured caused by stagnation of the fluid generated in the cylinder of the inside face in the radial direction of a measuring conduit branched in the middle of a pipe to be measured in a conventional pressure measuring instrument. SOLUTION: This pressure measuring instrument is equipped with a pressure sensitive block 2 wherein the fluid flows inside, having a thin-walled part 3 having the thinner thickness than the thickness of other parts, and a strain gage 5 installed on the different side from the flowing side of the fluid in the thin-walled part 3, for detecting the deformation quantity of the thin-walled part 3.

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