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    • 32. 发明专利
    • MANUFACTURE OF PHOTOVOLTAIC ELEMENT
    • JPH01248674A
    • 1989-10-04
    • JP7672188
    • 1988-03-30
    • MATSUSHITA ELECTRIC IND CO LTD
    • MORI KOSHIROHANABUSA AKIRASAITO YASUHIROOSAWA MICHIO
    • H01L31/042H01L31/04
    • PURPOSE:To decrease manhours by simultaneously cutting a first substrate, a second substrate for protecting the surface and a third substrate for reinforcement and holding and arraying a plurality of solar cells singly separated on a fourth substrate in a matrix manner. CONSTITUTION:All of laminated substrates up to first - third substrates 1-3 except a fourth substrate 4 are cut into laminated multi-layer boards, and a plurality of independently detached photovoltaic element 5 are arranged and held onto the fourth substrate 4, thus manufacturing the title photovoltaic element. When a solar cell is used as the photovoltaic element 5, terminal sections 6 at a positive pole and a negative pole are fitted at both ends of the photovoltaic element normally, and leads are led out to the terminal sections 6 through a heat seal method and soldering. The leads can be led out in such a manner that sections laminated onto the terminal sections and superposed to the terminal sections are employed previously as opening sections 7 in the second - fourth substrates 2-4 laminated onto the first substrate. Accordingly, the manufacture of the photovoltaic element in which processes are treated continuously by the substrates in large size is acquired, thus reducing the complicatedness of the treatment of each photovoltaic element in conventional devices and the manhours.
    • 36. 发明专利
    • SOLAR BATTERY POWER SOURCE
    • JPS63289970A
    • 1988-11-28
    • JP12625987
    • 1987-05-22
    • MATSUSHITA ELECTRIC IND CO LTD
    • ONO MASAHARUMORI KOSHIROHANABUSA AKIRAOSAWA MICHIOARITA TAKASHI
    • H01L31/04G05F1/67
    • PURPOSE:To obtain a small-scaled solar battery power source which has a small forward dark current and is capable of rapid charge-and-discharge without a backward flow-resisting diode accompanied by voltage loss, by introducing an element, for use in enlarging a band gap, to either a P layer or an N layer so that it is substituted partially for Si to form an amorphous silicon solar battery and next by connecting a capacitor with this solar battery. CONSTITUTION:An element for use in enlarging a band gap is introduced to at least either a P layer or an N layer in PIN junction so that it is substituted partially for Si to form an amorphous silicon solar battery 7. A capacitor 5 of 1mF to 10F in its capacitance is connected with this solar battery without using a backward flow-resisting diode. As shown in a figure, for example, an electric double layer capacitor 5, a constant voltage diode 6, and an amorphous silicon solar battery 7 are connected to each other without using the backward flow-resisting diode. The amorphous silicon solar battery 7 is formed as follows: C, N, or H is introduced 5 to 50% to the P or N layer so that it is substituted for Si, and next CH4, C2H2, or the like is mixed into SiH4 upon the forming of the P or N layer so that Si-C or C-H coupling is increased to enlarge the gap.
    • 37. 发明专利
    • MANUFACTURE OF AMORPHOUS SOLAR BATTERY
    • JPS63207182A
    • 1988-08-26
    • JP4084287
    • 1987-02-24
    • MATSUSHITA ELECTRIC IND CO LTD
    • HANABUSA AKIRAARITA TAKASHIOSAWA MICHIOONO MASAHARUMORI KOSHIROAOKI HIROMICHI
    • H01L31/04
    • PURPOSE:To decrease the number of working processes by removing a titanium layer through scribing by a metallic piece, etc., without using a resist and getting rid of an aluminum layer through etching. CONSTITUTION:An amorphous silicon film 3 is patterned, a comparatively soft I metallic thin-film 4 is deposited, a II metallic thin-film 5 harder than the I metallic thin-film 4 is deposited, the whole II metallic thin-film 5 in a section to be taken off mechanically and one part of the I metallic thin-film 4 in the section are removed, and the whole is dipped into an etchant dissolving only the I metal 4. Consequently, the soft I metallic thin-film 4 reduces force applied to the amorphous silicon film 3 at the time of scribing on scribing by a metallic piece, etc., force is concentrated to the hard II metallic thin-film 5, and force is applied in the direction of scribing, thus damaging no amorphous film 3, then scribing the II metallic thin-film 5 up to a section near the interface of the II metallic thin-film 5 and the I metallic thin-film 4. The I metallic film 4 left in a scribing section is dipped into a liquid etching only the I metallic film 4, and gotten rid of selectively, thus acquiring a predetermined pattern.
    • 38. 发明专利
    • MANUFACTURE OF THIN FILM SOLAR CELL
    • JPS63147374A
    • 1988-06-20
    • JP29524886
    • 1986-12-11
    • MATSUSHITA ELECTRIC IND CO LTD
    • OSAWA MICHIOARITA TAKASHIHANABUSA AKIRAMORI KOSHIROAOKI HIROMICHI
    • H01L31/04H01L21/302H01L21/3065H01L21/461H01L27/142
    • PURPOSE:To eliminate thermal damage to thin films in the case of patterning by a method wherein, after the various thin films for constituting a thin film solar cell are formed on a supporting substrate, the thin films are selectively peeled off by an ultrasonic processing needle. CONSTITUTION:Various thin films for constituting a thin film solar cell are formed on a supporting substrate 1, then the above thin films are selectively peeled off by an ultrasonic processing needle 5. For example, a transparent electrode layer 2 is formed on the glass substrate 1 by a vacuum deposition and so on. Then, the ultrasonic processing needle 5 connected to an ultrasonic oscillator is applied to the film surface and is made to shift while being made to oscillate and the transparent electrode layer 2 is continuously peeled off and patterned linearly. Moreover, an amorphous Si layer 3, which is used as a photoelectric conversion layer, is formed thereon by laminating in order a P-type layer and an N-type layer in such a way that a P-I-N junction is formed by a plasma CVD method and so on. Then, the amorphous Si layer 3 is shaved by the ultrasonic processing needle 5 like the pattern of the transparent electrode layer 2 and the amorphous Si layer 3 is formed on the transparent electrode layer 2.
    • 40. 发明专利
    • THIN FILM SEMICONDUCTOR DEVICE
    • JPS6358975A
    • 1988-03-14
    • JP20407186
    • 1986-08-29
    • MATSUSHITA ELECTRIC IND CO LTD
    • ONO MASAHARUMORI KOSHIROHANABUSA AKIRAARITA TAKASHIOSAWA MICHIO
    • H01L27/14H01L27/12H01L29/78H01L29/786H01L31/10
    • PURPOSE:To facilitate forming thin film semiconductor devices on one substrate with small sizes and a low cost by a method wherein a plurality of thin film photodetectors and a thin film transistor which constitute a logic circuit are formed on the one substrate and the output terminal of the thin film photodetectors which are connected in series or in parallel is connected to the gate electrode of the thin film transistor on the substrate. CONSTITUTION:A gate electrode 2 formed by evaporation of Cr, NiCr or the like and a gate insulating film 3 made of silicon nitride, silicon oxide or the like are provided on a substrate 1. Then the lower electrodes 4 and 5 of thin film photodiodes are formed and the lower electrode 4 is connected to the gate electrode 2 on the substrate. A semiconductor thin film 6 made of amorphous silicon hydride is formed on the gate insulating film 3. Semiconductor thin films 7 and 8 made of amorphous silicon hydride, amorphous germanium hydride, amorphous silicon germanium hydride or the like are formed on the lower electrodes 4 and 5 in the order of P-type layers, I-type layers and N-type layers. Then a source electrode 9 and a drain electrode 10 are formed and, at the same time, the upper electrodes 11 and 12 of the thin film photodiodes are formed and the upper electrode 11 is connected to the lower electrode 5 and the upper electrode 12 is connected to the source electrode 9.