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31. 发明专利

JPS62194699A WEAR DETECTOR OF COOLER 失效
公开(公告)号：JPS62194699A
公开(公告)日：1987-08-27
申请号：JP3634486
申请日：1986-02-20
申请人： FUJITSU LTD
发明人： KATSUYAMA YUKIHISA , MISHIRO MASAHIRO , KIKUCHI SHUNICHI
IPC分类号： H01L23/473 , H01L23/46 , H05K7/20

32. 发明专利

JPS62131549A COOLING DEVICE FOR INTEGRATED CIRCUIT ELEMENT 失效
公开(公告)号：JPS62131549A
公开(公告)日：1987-06-13
申请号：JP27307185
申请日：1985-12-03
申请人： FUJITSU LTD
发明人： YAMAMOTO HARUHIKO , KATSUYAMA YUKIHISA , KIKUCHI SHUNICHI , SUZUKI MASAHIRO
IPC分类号： H01L23/04 , H01L23/36 , H01L23/40
摘要： PURPOSE:To optimize the amount of a solder, which is a heat transfer medium, and to improve the cooling efficiency of an integrated circuit element, by providing an effluence preventing wall, which prevents the flow-out of fused solder, between a heat sink and the integrated circuit element. CONSTITUTION:An effluence preventing wall 3 for preventing the flow-out of a solder 2 is provided on an integrated circuit element 1 facing a heat sink 8. The effluence preventing wall 3, which is formed around the integrated circuit element 1, prevents the flow out-of the fused solder 2 when the integrated circuit element 1 is coupled with a cooling mechanism 10 and the heat sink 8 compresses the integrated circuit element 1 in the direction of an arrow A. Thus the adequare amount of the solder 2 is secured between the integrated circuit element 1 and the cooling mechanism 10. The amount of the solder 2 to be secured between the integrated circuit element 1 and the cooling element mechanism 10 is determined by the height H of the effluence preventing wall 3. Even if the solder 2 is fused in order to bond the integrated circuit element 1 and the cooling mechanism 10, the solder 2 does not flow out, and the cooling efficiency of the integrated circuit element is improved.

33. 发明专利

JP2003188506A BOARD UNIT EQUIPPED WITH HEAT ABSORBING DUMMY COMPONENT, AND METHOD FOR MANUFACTURING THE SAME 审中-公开
公开(公告)号：JP2003188506A
公开(公告)日：2003-07-04
申请号：JP2001381326
申请日：2001-12-14
申请人： FUJITSU LTD
发明人： KIKUCHI SHUNICHI , YAMADA MITSUTAKA , IKETAKI KENJI
IPC分类号： H05K1/02 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To enable good bonding of components within an appropriate temperature by suppressing components mounted on a board unit from being exposed to too high a temperature rise beyond thermal protection due to the heat supplied thereto at the time of reflow. SOLUTION: The board unit is provided with a circuit component which is mounted on the board and constitute a portion of a circuit, pads for mounting components which are disposed around the circuit component and are not electrically connected to the circuit component, and heat absorbing dummy components which are each mounted on the pads and absorb the heat from the circuit component through the pads. COPYRIGHT: (C)2003,JPO

34. 发明专利

JP2001077543A MULTILAYER WIRING BOARD 失效
公开(公告)号：JP2001077543A
公开(公告)日：2001-03-23
申请号：JP25079599
申请日：1999-09-03
申请人： FUJITSU LTD
发明人： UMEMATSU MIMIO , KIKUCHI SHUNICHI , MORIIZUMI KIYOKAZU , SATO KAZUAKI , OZAKI TOKUICHI
IPC分类号： H05K3/46 , H01L21/3205 , H01L23/498 , H01L23/52 , H05K1/02
摘要： PROBLEM TO BE SOLVED: To provide a multilayer wiring board which is free of such defects as short-circuiting caused by the deformation of the periphery, etc., when precisely by CMP method or the like. SOLUTION: This multilayer film wiring part 26 of a multilayer wiring board 25 is provided with a wiring region 34, where one of a signal wiring pattern 28, a power wiring pattern 30, and a via 32 is formed in each layers 38a-38i consisting of insulators and one of a dummy signal wiring pattern 28a, a dummy power wiring pattern 30a, and a dummy via 32a is arranged continuously throughout the entire periphery 36 of each layers 38a-38i provided with wiring regions 34, in a periphery 36 around the wiring region 34, corresponding to the whole of the layers 38a-38i provided with the wiring regions 34.

35. 发明专利

JPH10294396A THIN FILM MULTILAYERED BOARD AND ELECTRONIC DEVICE 失效
公开(公告)号：JPH10294396A
公开(公告)日：1998-11-04
申请号：JP10195597
申请日：1997-04-18
申请人： FUJITSU LTD
发明人： MORIIZUMI KIYOKAZU , KIKUCHI SHUNICHI , NIIZEKI KAZUHIRO , FUKUNAGA NAOMI , SUEHIRO MITSUO
IPC分类号： H05K3/34 , H01L23/12 , H01L23/498 , H01L23/538 , H05K1/00 , H05K1/11 , H05K3/46
摘要： PROBLEM TO BE SOLVED: To ensure the joint of a pin which serves as an input/output terminal of sufficient strength, by a method wherein the base of a via structure connected to one of conductor layers of thin film structure is laminated directly on a board parent material, and the pin is secured onto the via structure. SOLUTION: Conductor layers 24a to 24f of a via structure 22 are formed corresponding to the conductor layers 18a to 18f together with them at the same time, where the conductor layers 24a to 24f are directly and separately laminated. The via structure 22 is provided without insulating layer interposed between the uppermost conductor layer 24a and a board parent material 12. The stepped part of the conductor layers 24a to 24f serves as the via structure, and the center flat of the conductor layers 24a to 24f is made to serve as a pad where a pin 16 is mounted. The uppermost conductor layer 24a is plated with nickel and gold. Moreover, the pin 16 is provided with a mounting seat 16a at its lower end, and the mounting seat 16a is soldered to the uppermost conductor layer 24a with solder 26. By this setup, the joint of a pin can be enhanced in strength, so that an electronic device of this constitution can be used in an environment where it is high in temperature and humidity.

36. 发明专利

JPH0745762A SEMICONDUCTOR DEVICE COOLING DEVICE 失效
公开(公告)号：JPH0745762A
公开(公告)日：1995-02-14
申请号：JP19060393
申请日：1993-07-30
申请人： FUJITSU LTD
发明人： FUJISAKI AKIHIKO , ISHIMINE JIYUNICHI , SUZUKI MASUMI , MISHIRO MASAHIRO , KIKUCHI SHUNICHI , HIRANO MINORU , NORI HITOSHI
IPC分类号： H01L23/36 , H01L23/367 , H01L23/433 , H01L23/467 , H01L23/473 , H01L29/06
摘要： PURPOSE:To provide a semiconductor device cooling device of improved cooling efficiency by a method wherein a coolant oblique guide means which enables coolant to obliquely contact the upside of a semiconductor device from the upstream side of a flow of coolant to the downstream side. CONSTITUTION:Tilted column-like heat dissipating fins 37 are arranged in matrix on the upside 11a of a semiconductor device 11 and fixed as tilted by an angle of theta toward the upstream of a parallel flow of coolant 43. The parallel flow of coolant 43 is made to flow obliquely downward 44 along the front side 38 of the tilted column-like heat dissipating fin 37 and then separated into two flows 45 traveling along the sides of the column-like heat dissipating fin 37 toward a downstream side. Therefore, coolant is increased in flow rate around the lower part of the column-like heat dissipating fin 37 and in the vicinity 39 of the lower end of the column-like heat dissipating fin 37 on the uppside 11a of the semiconductor device 11, so that the corresponding part of the upside 11a of the semiconductor device 11 can be efficiently cooled down. The column-like heat dissipating fin 37 is tilted, whereby it can be enhanced in surface area, and in result heat transmitted from the column-like heat dissipating fins 37 to the parallel flow 43 of coolant is increased in quantity.

37. 发明专利

JPH0661670A COOLING STRUCTURE FOR CERAMIC BOARD 失效
公开(公告)号：JPH0661670A
公开(公告)日：1994-03-04
申请号：JP20808492
申请日：1992-08-04
申请人： FUJITSU LTD
发明人： KIKUCHI SHUNICHI , MISHIRO MASAHIRO , UDAGAWA YOSHIAKI , SUZUKI MASAHIRO
IPC分类号： H01L23/36 , H05K7/20
摘要： PURPOSE:To provide a cooling structure for a ceramic board which can be manufactured easily while minimizing environmental change in the housing. CONSTITUTION:In the cooling structure for a ceramic board where the element mounting face of a ceramic board 1 is enclosed by a housing 2 and cooling elements 3 mounted on the housing 2 cool the heating elements 4 mounted on the element mounting face, internal space of the housing 2 is opened to the outer air through appropriate number of micro holes made through the housing 2.

38. 发明专利

JPH0329199B2 失效
公开(公告)号：JPH0329199B2
公开(公告)日：1991-04-23
申请号：JP18192884
申请日：1984-08-31
申请人： FUJITSU LTD
发明人： KATSUYAMA YUKIHISA , YAMAMOTO HARUHIKO , SHIBA AKIRA , KIKUCHI SHUNICHI
IPC分类号： H05K7/20 , F25D3/00 , F25D9/00 , H01L23/46 , H01L23/473

39. 发明专利

JPH0311548B2 失效
公开(公告)号：JPH0311548B2
公开(公告)日：1991-02-18
申请号：JP1300784
申请日：1984-01-26
申请人： FUJITSU LTD
发明人： YAMAMOTO HARUHIKO , KATSUYAMA YUKIHISA , NAKADA MITSUHIKO , KIKUCHI SHUNICHI
IPC分类号： H01L23/433 , H01L23/473 , H05K7/20

40. 发明专利

JPH0311547B2 失效
公开(公告)号：JPH0311547B2
公开(公告)日：1991-02-18
申请号：JP1300684
申请日：1984-01-26
申请人： FUJITSU LTD
发明人： YAMAMOTO HARUHIKO , KATSUYAMA YUKIHISA , NAKADA MITSUHIKO , KIKUCHI SHUNICHI
IPC分类号： H01L23/433 , H01L23/473 , H05K7/20

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