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31. 发明专利

JPH0766559A CONNECTION STRUCTURE BETWEEN WIRING LAYERS OF MULTI-LAYER CIRCUIT BOARD AND FORMATION OF THE CONNECTION STRUCTURE 失效
公开(公告)号：JPH0766559A
公开(公告)日：1995-03-10
申请号：JP23074393
申请日：1993-08-25
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA SAAKIT FOIL KK
发明人： OTANI KENICHI , MUGISHIMA TOSHIO , SEKI OSAMU , MATSUKI NOBORU
IPC分类号： H05K3/40 , H05K1/00 , H05K3/46
摘要： PURPOSE:To provide a new wiring interlayer connection structure, which replaces a conventional through-hole system, to contrive a finer miniaturization of the metal wirings of a multilayer circuit board and the improvement of the mounting density of the metal wirings. CONSTITUTION:In a wiring interlayer connection structure of a multilayer-circuit board, wherein wirings provided via an insulator are connected to each other through a through hole to penetrate the insulator, the through hole 5 has an edge of roughly a linear form and at the same time, a slant face 6 formed into such a form that the thickness of the insulator is gradually decreased from the outside of the hole toward the inward of the hole is formed at the edge part. A plurality of the wirings 2, which are provided on the surface A on one side of the surfaces of the insulator 1, go down the face 6 and are extendedly provided in the hole 5, and a plurality of the wirings 3, which are provided on the other surface B of the insulator 1 and are extendedly provided in the hole 5, are connected to each other. Accordingly, the pitch between the wirings can be miniaturized to a degree of 100 or shorter to 50mum at a low-cost manufacturing cost.

32. 发明专利

JPH04338656A CHIP CARRIER AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH04338656A
公开(公告)日：1992-11-25
申请号：JP13946891
申请日：1991-05-16
申请人： FURUKAWA ELECTRIC CO LTD
发明人： OTANI KENICHI , MUGISHIMA TOSHIO , SEKI OSAMU
IPC分类号： H01L21/60 , H05K1/00
摘要： PURPOSE:To reduce cost by covering a drilled hole at a portion to be bent by a flexible film layer consisting of an adhesive layer. CONSTITUTION:A polyimide film 2 is prepared. A scheduled laying portion as its device hole 1 and a portion to be bent 6 overlapping with metal wiring are punched and processed by a continuous press drilling machine to a corresponding shape. A copper foil applied with an adhesive is bonded by a laminating machine to the polyimide film 2 punched and processed. Then, the adhesive layer is heated and hardened, and a base member is produced by using the adhesive layer as a flexible film 8. And a photoresist at the copper foil side is applied and dried, a predetermined pattern is exposed and developing is performed, the copper foil is etched and then metal wiring 3 is formed.

33. 发明专利

JPH04277421A MANUFACTURE OF DOUBLE LAYER TAB TAPE 失效
公开(公告)号：JPH04277421A
公开(公告)日：1992-10-02
申请号：JP4007291
申请日：1991-03-06
申请人： FURUKAWA ELECTRIC CO LTD
发明人： SEKI OSAMU , OTANI KENICHI , MUGISHIMA TOSHIO
IPC分类号： H01B17/62 , H01B19/00 , H05K3/02
摘要： PURPOSE:To provide a double layer TAB tape by accurately and safely forming an insulating layer of a predetermined pattern on a conductor layer. CONSTITUTION:A pattern having a sprocket hole, an outer lead hole, and a device hole is printed onto a conductor layer 10 made of an electrolytic copper foil by a gravure printing method so as to form a polyimide layer 12. Heat- treatment for a predetermined time is repeated for curing so that a double layer TAB tape having a polyimide insulating layer of a predetermined pattern may be produced.

34. 发明专利

JPH04217386A MANUFACTURE OF CIRCUIT 失效
公开(公告)号：JPH04217386A
公开(公告)日：1992-08-07
申请号：JP41130190
申请日：1990-12-18
申请人： FURUKAWA ELECTRIC CO LTD
发明人： MUGISHIMA TOSHIO , SEKI OSAMU , OTANI KENICHI
IPC分类号： H01L21/60 , H05K3/06
摘要： PURPOSE:To provide a method thereby to prepare easily a microcircuit which is excellent in terms of reliability and electric properties on an insulation board. CONSTITUTION:As illustrated in Fig. 1(a), a groove is formed on a section which serves as a circuit on an insulation board 1. Copper 3 is sputtered to the surface of the insulation board 1 which includes this groove so as to provide electrical conductivity as illustrated in Fig. 1(b). Then, electrolytic plating is applied to the insulation board which contains the groove so that the groove section may be filled with a conductor 4 as illustrated in Fig. 1(c), and then an unnecessary part of a surface conducting layer is etched and removed so that the conductor upper part of he groove section may be exposed as illustrated in Fig. 1(d). Then, the thickness of the insulation board 1 is reduced by etching at least partially so that the conductor in the groove section may be exposed from the surface of the insulation board 1 by a required height, thereby forming a circuit as illustrated in Fig. 1(e).

35. 发明专利

JPH04215448A PRODUCTION OF CHIP CARRIER 失效
公开(公告)号：JPH04215448A
公开(公告)日：1992-08-06
申请号：JP41064190
申请日：1990-12-14
申请人： FURUKAWA ELECTRIC CO LTD
发明人： OTANI KENICHI , MUGISHIMA TOSHIO , SEKI OSAMU
IPC分类号： H01L21/60
摘要： PURPOSE:To reduce the cost by covering the surface on the opening side of a metal thin film with another insulating flexible layer thicker than a flexible film member and forming metal wiring by etching the metal thin film. CONSTITUTION:For a base film 2, an area 6 which forms the thin part on a part to be bent is punched out to form an opening using an adhesive polyimide film. Copper foil is laminated on the base film 2 and a metal thin film is formed. An area surrounded by the circumference including the opening is coated with urethane ultraviolet hardening resin and a resin layer 11 is formed. Then, photoresist is coated on the copper foil side, dried, exposed and developed by a prescribed pattern. Resist is coated on the whole plane on the base film 2 side, the copper foil is etched and metal wiring 3 is formed. Then, the resist films on the both planes are removed, tin plated and a chip carrier which has a thin part 6 composed of the resin layer 11 on the part to be bent is produced.

36. 发明专利

JPH0434934A POLYIMIDE SOLUTION 失效
公开(公告)号：JPH0434934A
公开(公告)日：1992-02-05
申请号：JP14056890
申请日：1990-05-30
申请人： FURUKAWA ELECTRIC CO LTD
发明人： OGIWARA YOSHIAKI , YASUHARA MASANORI , MUGISHIMA TOSHIO , SEKI OSAMU
IPC分类号： C09K13/06 , H01L21/308 , H05K3/06
摘要： PURPOSE:To be used as an etchant of a substrate when a conductor circuit is formed on a polyimide substrate by incorporating special normal of concentration of potassium hydroxide, special wt.% of concentration of compound of at least one type selected from a group consisting of N-propanol, isopropanol and ethanol, and the residue of water. CONSTITUTION:3 - 10 normal of concentration of potassium hydroxide, 5 - 90wt.% of concentration of at least one compound selected from a group consisting of N-propanol, isopropanol and ethanol, and the residue of water are contained. If this solution is used to form a conductor circuit on a polyimide substrate, the substrate is first dipped in the solution, and gelled substance formed on the surface is removed by washing. Then, the board is dipped in activating solution, and activating component is adhered on the rough surface of the substrate. Thereafter, the substrate is dipped in electroless plating solution to form an electrolessly plated layer on the substrate.

37. 发明专利

JPH1140567A METHOD FOR FORMING SOLDER BUMP 失效
公开(公告)号：JPH1140567A
公开(公告)日：1999-02-12
申请号：JP19231297
申请日：1997-07-17
申请人： FURUKAWA ELECTRIC CO LTD
发明人： MUGISHIMA TOSHIO , KAGA YASUHISA , ONAMI HIDETAKA
IPC分类号： H01L21/60 , H05K3/34 , H01L21/321
摘要： PROBLEM TO BE SOLVED: To provide a method for forming metal bumps on a semiconductor wafer, with which a transfer plate can be readily removed in a short time, from the semiconductor wafer without damaging the semiconductor wafer. SOLUTION: In this method for forming solder bumps, a transfer plate comprises recessed portions disposed in positions which, respectively, correspond to electrode pads 3, and a through-hole 15 which is in correspondence with neither of the electrode pads 3. Cream solder is applied to the surface of the transfer plate having the recessed portions so as to fill the recesses with the solder. Subsequently, the transfer plate is heated to melt the cream solder thereon, followed by positional adjustment for superposing a semiconductor wafer 1 on the transfer plate, so that the electrode pads 3 are in correspondence with solder balls 24. Thus, the solder balls 24 are transferred to the electrode pads 3.

38. 发明专利

JPH088539A MULTILAYER PRINTED WIRING BOARD AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH088539A
公开(公告)日：1996-01-12
申请号：JP15969994
申请日：1994-06-20
申请人： FURUKAWA ELECTRIC CO LTD , FURUKAWA CIRCUIT FOIL KK
发明人： MUGISHIMA TOSHIO , SEKI OSAMU , OTANI KENICHI
IPC分类号： H05K3/46
摘要： PURPOSE:To enable a multilayer printed wiring board to be lessened in permittivity and enhanced in reliability by a method wherein a first and a second insulating layer are provided adjacent to each other providing a gap between them, a metal layer is provided to each of the opposed surfaces of the adjacent insulating layers, and the metal layers partially confronting each other are joined together by plating. CONSTITUTION:The copper circuit pattern 4b of a double-sided printed wiring board 5b is so shaped as to confront the copper circuit pattern 4a of a double-sided printed printed wiring board 5a like a reflected image. The two double-sided printed wiring boards 5a arnd 5b are so aligned as to make their copper circuit patterns 4a and 4b confront each other interposing a gap between them, and the printed wiring boards 5a and 5b are subjected to copper electroplating as kept in a state that they are confronting each other. By this setup, the circuit patterns 4a and 4b are joined together by a plating layer 7 grown on the patterns 4a and 4b for the formation of an inner circuit pattern 4 of integral structure. A gap between the conductors of the inner circuit pattern 4 is empty, and therefore a multilayer printed wiring board of this constitution is excellent in electrical properties and high in flexibility because an air layer of low permittivity is located between the conductors of a circuit pattern.

39. 发明专利

JPH04255239A CHIP CARRIER AND MANUFACTURE THEREOF 失效
公开(公告)号：JPH04255239A
公开(公告)日：1992-09-10
申请号：JP3652991
申请日：1991-02-07
申请人： FURUKAWA ELECTRIC CO LTD
发明人： OTANI KENICHI , MUGISHIMA TOSHIO , SEKI OSAMU
IPC分类号： H01L21/60
摘要： PURPOSE:To prevent a turbulence of inner lead parts from being generated and to improve the reliability of a product by a method wherein a support member for coupling the fellow tip parts of the inner lead parts with each other is provided independently of a flexible film member. CONSTITUTION:An epoxy acrylate negative-type resist is applied on the side, on which a metal wiring 1 is formed, of a flexible tape 2, an exposure is performed using a mask conformed to the form of a support member 8, developing and curing are performed and the member 8 is formed on the tip parts of inner leads 1a. The form of the member 8 is straplike, is conformed to the form of a device hole 3 and is formed into four rod-like forms divided in such a way as to correspond to each side of the quadrangle of the hole 3.

40. 发明专利

JPH03289193A CIRCUIT BOARD MATERIAL 失效
公开(公告)号：JPH03289193A
公开(公告)日：1991-12-19
申请号：JP9027590
申请日：1990-04-06
申请人： FURUKAWA ELECTRIC CO LTD
发明人： OTANI KENICHI , MUGISHIMA TOSHIO , SEKI OSAMU , KABUMOTO AKIRA , TAGUCHI EIICHI
IPC分类号： B32B15/08 , B32B9/00 , H05K3/38
摘要： PURPOSE:To prevent peeling between a base material and a copper film layer even if a post-treatment or secondary processing for forming a circuit is conducted and to improve characteristics by employing a polymer material as the base material and sequentially providing a chromium oxide film layer and a copper film layer directly or through a chromium film layer on one or both side surfaces of the base material. CONSTITUTION:A chromium oxide film layer is provided between the base material of a polymer material and a copper film layer as an anchor directly or through a chromium film. In this case, the chromium oxide film layer may be brought into direct contact with the base material of the polymer material or a composite anchor for bringing the base material of the polymer material into close contact with the chromium oxide film layer through the chromium film layer may be provided. As a method of providing a copper film layer at the top of the chromium oxide film layer, a sputter depositing method, a plating method or a method of combination of them is employed. Thus, the close contact of the base material of the polymer material with the copper film layer is sufficient, and even if a secondary processing for conducting substitutional-plating of tin plating, etc., is executed, a decrease in circuit characteristics can be suppressed as much as possible.

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