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31. 发明专利

JPH09115956A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH09115956A
公开(公告)日：1997-05-02
申请号：JP27221295
申请日：1995-10-20
申请人： CITIZEN WATCH CO LTD
发明人： TERAJIMA KAZUHIKO
IPC分类号： H01L21/60 , H01L23/12 , H01L23/36
摘要： PROBLEM TO BE SOLVED: To obtain a device with superb cooling property and less noise by providing a substrate electrode connected to each electrode of a chip to be mounted on the front of an insulation substrate, a ball terminal connected to a mother board on the rear, and an electrical path for leading the substrate electrode to the ball terminal and a member for guiding heat on the upper surface of a chip to a ball terminal. SOLUTION: A substrate electrode 3 and an insulation film 5 are provided on the front of a wiring insulation substrate 6, a pad electrode 4 and the insulation film 5 are provided on the rear, and further the front substrate electrode 3 and the rear pad electrode 4 are electrically connected via a through hole. Also, a cooling pattern 13 and a thermal core 2a are provided as heat conduction members for reaching from front to rear on the substrate 3. A chip 7 is mounted on the substrate 6, each electrode of an active element surface is guided to the substrate electrode 3, heat from an upper part is guided to the substrate 6 by a heat conduction board 12 and a heat conductive adhesive 9a, and each is guided to a mother board through a ball terminal 10 and a cooling terminal 10a, thus obtaining a device with improved cooling property and less noise.

32. 发明专利

JPH0997860A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0997860A
公开(公告)日：1997-04-08
申请号：JP11750896
申请日：1996-05-13
申请人： CITIZEN WATCH CO LTD
发明人： TERAJIMA KAZUHIKO
IPC分类号： H01L23/12 , H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device for preventing peeling due to improved adhesion force by a structure for directly adhering a semiconductor chip to a resin substrate or a resin insulation film using an adhesive resin composition even if shear stress is generated between the semiconductor chip and the wiring board. SOLUTION: A semiconductor device has a connection electrode 4 for electrically connecting each electrode of a semiconductor chip 8, an electrical path for connecting the connection electrode 4 and a solder ball terminal 12 arranged on the reverse side of the resin board, a resin insulation film 6 for protecting the electrical path, and an electrical path to the connection electrode 4 for directly bonding the semiconductor chip 8 onto the resin board using the adhesive and an opening 14 of a resin insulation film.

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