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    • 36. 发明专利
    • WASHING DEVICE
    • JPH03165519A
    • 1991-07-17
    • JP30562989
    • 1989-11-24
    • OMI TADAHIRO
    • OMI TADAHIROSHIBATA SUNAO
    • H01L21/304B05B7/28B05B7/30B05B7/32H01L21/00
    • PURPOSE:To make it possible to successively wash a large quantity of materials to be washed by mixed chemical solution without contamination by a method wherein a plurality of suction tubes, which are connected to a jet-stream tube at prescribed interval, and a plurality of chemical liquid vessels, in which the end opening of the suction tubes are inserted, are provided. CONSTITUTION:Two suction tubes 4a and 4b, which are communicated to a jet-stream tube 1 while being separated by a prescribed distance, are connected to the jet-stream tube 1, and the suction tubes are inserted to chemical solution vessels 5a and 56 respectively. When a pressure-feeding pump 2 is operated, the solution medium which is sucked up from a liquid refrigerant vessel 3 is allowed to flow in the jet-stream tube 1 along the longitudinal direction of the tube. At this time, the chemical liquid is sucked up from the chemical liquid vessels 5a and 5b by the jet stream of the solution medium, it is mixed with the solution medium of the jet-stream tube 1, and the mixture is jetted out from the end opening of the jet-stream tube 1. The material 6 to be washed is washed by the jetted mixture liquid. As a result, the material 6 to be washed can be washed by the chemical solution repeatedly without contamination, and also the washing device is protected from corrosion and the like.
    • 37. 发明专利
    • THIN FILM FORMING DEVICE AND METHOD
    • JP2000323469A
    • 2000-11-24
    • JP2000003025
    • 2000-01-11
    • OMI TADAHIRO
    • OMI TADAHIROSHIBATA SUNAOUMEDA MASARU
    • C23C14/40H01L21/203H01L21/285H01L21/31
    • PROBLEM TO BE SOLVED: To provide a thin film forming device and a method, where a semiconductor substrate is less damaged by impact of ions, and a target sputtering rate can be accurately lessened or enhanced. SOLUTION: A thin film forming device has a structure where a first electrode and a second electrode are arranged confronting each other in a vacuum chamber, a first high-frequency power supply is connected to the first electrode, a second high-frequency power supply is connected to the second electrode, and the material of a target mounted on the second electrode is deposited on a substrate mounted on the first electrode by sputtering the target, where a first circuit which is resonant with only the output frequency of the second high-frequency power supply is connected to the first electrode, and a second circuit which is resonant with only the output frequency of the first high-frequency power supply is connected to the second electrode. RF power supplies 111a to 111d are connected to targets 109a to 109d through the intermediary of tuning circuits 110a to 110d, and RF power supplies 113a to 113d are connected to wafer holders 107a to 107d through the intermediary of tuning circuits 112a to 112d.