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    • 36. 发明专利
    • LOAD CONTROL DEVICE
    • JP2003243975A
    • 2003-08-29
    • JP2002035511
    • 2002-02-13
    • FURUKAWA ELECTRIC CO LTD
    • YAGI MICHIHIROHARA SHOJITAKAHASHI HIROAKITSUTSUMI HIROSHI
    • H03K17/00H03K17/296
    • PROBLEM TO BE SOLVED: To improve the productivity of a product using a load control device for controlling a load by detecting the operation of a small current switch and to reduce costs by stably controlling the load control device by a large current switch for directly controlling the load. SOLUTION: By eliminating the oxide film of a contact by providing a semiconductor switch interposed between a switch connected to one terminal of a power source and a load connected to the other terminal of the power source, a control means for controlling the conduction/cutoff of the semiconductor switch by detecting the operation of the switch and an electrification circuit to be electrified by the control means for a prescribed period for making a prescribed current flow to the contact when the switch is operated, the load control device can be controlled by the large current switch. Thus, in the case of control by the load control device, it is not necessary to selectively use the small current switch and the large current switch so that the productivity of the product using the load control device can be improved and the costs can be reduced. COPYRIGHT: (C)2003,JPO
    • 37. 发明专利
    • SMALL-SIZED ANTENNA
    • JP2003243919A
    • 2003-08-29
    • JP2002338784
    • 2002-11-22
    • FURUKAWA ELECTRIC CO LTD
    • TOMOMATSU ISAOHAMADA HIROKISATO SHINJIUENO TAKAHIRO
    • H01Q1/40H01Q9/42
    • PROBLEM TO BE SOLVED: To provide a small-sized antenna, provided with an antenna element 14 having two meander patterns 14a, 14b whose meander directions are different, and a resin molded material 16 formed in a manner of embedding the antenna element, with a stable characteristic where deformation of the meander patterns hardly takes place at forming of the resin molded material. SOLUTION: A fillet portion 12 is provided in the inside of a corner portion T 1 , which is easily deformed during resin molding, among corner portions of the meander patterns 14a, 14b and chamfering is eliminated to thicken the width of conductor. Since frequency variations become greater if the corner portion T 2 , which is similarly easily deformed, is provided with the fillet portion and the chamfering is eliminated, no fillet portion is provided to the corner portion T 2 but the chamfering only is omitted, and the corner portion T 3 adjacent to the corner portion T 2 is provided with the fillet portion 12 and the chamfering is eliminated. COPYRIGHT: (C)2003,JPO
    • 40. 发明专利
    • OPTICAL WAVEGUIDE MODULE
    • JP2003240987A
    • 2003-08-27
    • JP2002038606
    • 2002-02-15
    • FURUKAWA ELECTRIC CO LTD
    • SAWAMURA TAKESHIWATANABE TOMOHIROOTA TOSHIHIKOSAITO TSUNEAKI
    • G02B6/12G02F1/01
    • PROBLEM TO BE SOLVED: To provide an optical waveguide module in which the temperature of an optical waveguide chip is stably adjusted with small power consumption. SOLUTION: The optical waveguide module is provided with the optical waveguide chip 9 having an optical waveguide circuit for which light transmission characteristics are changed at least by the temperature, such as an array waveguide diffraction grating, a temperature detecting element 30 which detects the temperature of the optical waveguide chip 9, and a temperature adjusting module 8 which adjusts the temperature of the optical waveguide chip 9 on the basis of the detection temperature of the temperature detecting element 30. The temperature adjusting module 8 and the optical waveguide chip 9 are piled up and directly joined. The temperature detecting element 30 is provided on a position to detect the temperature at the position away from the optical waveguide circuit center position C1 of the optical waveguide chip 9, and by the light transmission center wavelength deviation of the optical waveguide chip 9 based on a difference between the detection temperature and the temperature at the center position C1, the light transmission center wavelength deviation of the optical waveguide chip based on the warp of the temperature adjusting module 8 is reduced. COPYRIGHT: (C)2003,JPO