会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 22. 发明专利
    • Carbon nanotube-containing resin composition and method for producing the same
    • 含碳纳米管的树脂组合物及其制造方法
    • JP2013001851A
    • 2013-01-07
    • JP2011135702
    • 2011-06-17
    • Toyota Boshoku Corpトヨタ紡織株式会社Toyota Central R&D Labs Inc株式会社豊田中央研究所
    • KITO MASAYUKIARIO TOSHIYUKIMORISHITA TAKUYAMATSUSHITA MITSUMASAFUKUMORI KENZOKATAGIRI YOSHIHIDE
    • C08L101/02C01B31/02C08K3/04
    • PROBLEM TO BE SOLVED: To provide a carbon nanotube-containing resin composition in which CNT is dispersed in a resin by a simple method, compared with in the past, while reducing the cutting of fibers associated with fibrillation of CNT, and a method for producing the same.SOLUTION: The method includes steps of: dispersing carbon nanotubes within an alcoholic solvent (e.g., methanol) by applying ultrasonic waves to a mixture including CNT, a resin having a functional group or framework exhibiting an intermolecular interaction with CNT (e.g., polyvinyl butyral resin), and the alcoholic solvent, in which relative to 100 pts.mass of the alcoholic solvent, the resin is 1-35 pts.mass, and the carbon nanotubes are 0.005-0.1 pts.mass; and removing the alcoholic solvent from the mixture passed through the above step. The composition obtained by this method includes CNT and the resin, CNT being 0.5-10 pts.mass relative to 100 pts.mass of the resin.
    • 待解决的问题:为了提供一种通过简单的方法将CNT分散在树脂中的含碳纳米管的树脂组合物,与过去相比,在减少与CNT的原纤维相关的纤维的切割的同时, 其制造方法 该方法包括以下步骤:通过向包括CNT的具有官能团或骨架的表面与CNT的分子间相互作用的官能团或骨架的混合物施加超声波将碳纳米管分散在醇溶剂(例如甲醇)中(例如, 聚乙烯醇缩丁醛树脂)和醇溶剂,其中相对于100重量份的醇溶剂,树脂为1-35重量份,碳纳米管为0.005-0.1重量份。 并从通过上述步骤的混合物中除去醇溶剂。 通过该方法获得的组合物包括CNT和树脂,CNT相对于树脂的100质量份为0.5-10质量度。 版权所有(C)2013,JPO&INPIT
    • 24. 发明专利
    • Thermosetting resin composition and method for producing the same
    • 热固性树脂组合物及其制造方法
    • JP2011195614A
    • 2011-10-06
    • JP2010060714
    • 2010-03-17
    • Toyota Central R&D Labs Inc株式会社豊田中央研究所
    • MORISHITA TAKUYAFUKUMORI KENZOMATSUSHITA MITSUMASAKATAGIRI YOSHIHIDE
    • C08L101/00C08J3/20C08K3/00
    • PROBLEM TO BE SOLVED: To provide a thermosetting resin composition provided with both high-level thermal conductivity and insulation.SOLUTION: The thermosetting resin composition includes a conductive nano-filler (A), a thermosetting resin (B), and another resin (C) other than the thermosetting resin (B). The thermosetting resin includes a continuous phase formed from the thermosetting resin (B) and a dispersed phase formed from the other resin (C). The conductive nano-filler (A) exists in the dispersed phase. Assuming that the ratio of the dispersed phase relative to the total thermosetting resin composition is X (unit: vol.%) and the ratio of the conductive nano-filler (A) included in the dispersed phase relative to the total conductive nano-filler (A) is Y (unit: vol.%), Y is 20 vol.% or more and Y/X is 1.1 or more.
    • 要解决的问题:提供一种具有高水平导热性和绝缘性的热固性树脂组合物。热固性树脂组合物包括导电纳米填料(A),热固性树脂(B)和另一种树脂(C )除热固性树脂(B)以外。 热固性树脂包括由热固性树脂(B)形成的连续相和由另一种树脂(C)形成的分散相。 导电纳米填料(A)存在于分散相中。 假设分散相相对于总热固性树脂组合物的比率为X(单位:体积%)和分散相中包含的导电纳米填料(A)相对于总导电纳米填料的比例 A)为Y(单位:体积%),Y为20体积%以上,Y / X为1.1以上。
    • 25. 发明专利
    • Epoxy resin composition
    • 环氧树脂组合物
    • JPS6112719A
    • 1986-01-21
    • JP13387784
    • 1984-06-28
    • Toyota Central Res & Dev Lab Inc
    • SATOU SHIGEYUKIMATSUSHITA MITSUMASA
    • H05K3/28C08G59/00C08G59/18C08G59/68C08L63/00H01L23/29H01L23/31
    • PURPOSE: The titled composition suitable as a resin for sealing semiconductor devices and other electronic circuit parts, having improved water-vapor resistance, corrosion resistance, and adhesiveness, comprising an epoxy resin, a curing agent, a lanolin (derivative), and an addition agent consisting of an organotin compound.
      CONSTITUTION: The aimed composition comprising (A) preferably glydicyl ether type, phenolic novolak type, cresol novolak type, alicyclic and/or halogenated epoxy resin, (B) a curing agent (preferably phenolic novolak resin, etc.), (C) (i) a lanolin derivative such as lanolin and/or lanolin fatty acid (metal salt), etc., and (ii) an addition agent consisting of an organotin compound. Barium fatty lanolin acid salt, magnesium lanolin fatty acid salt, etc. are preferable as the lanolin fatty acid metal salt, and an amount of the component i blended is preferably 0.1W10pts.wt. based on 100pts.wt. component A, and an amount of the component ii blended is preferably 0.01W5pts.wt.
      COPYRIGHT: (C)1986,JPO&Japio
    • 目的:包含环氧树脂,固化剂,羊毛脂(衍生物)和添加剂的适合作为用于密封半导体装置和其它电子电路部件的树脂的标题组合物,其具有改善的耐水蒸汽性,耐腐蚀性和粘合性 药剂由有机锡化合物组成。 构成:包含(A)优选甘氨酰醚型,酚醛清漆型,甲酚酚醛清漆型,脂环族和/或卤化环氧树脂的目标组合物,(B)固化剂(优选酚醛清漆树脂等),(C)( i)羊毛脂衍生物如羊毛脂和/或羊毛脂脂肪酸(金属盐)等,和(ii)由有机锡化合物组成的加成剂。 优选羊毛脂脂肪酸金属盐,脂肪族羊毛脂酸钠盐,羊毛脂脂肪酸镁盐等,优选为0.1〜10重量份。 基于100pts.wt 组分A,并且混合的组分ii的量优选为0.01-5pts.wt。
    • 26. 发明专利
    • Epoxy resin composition
    • 环氧树脂组合物
    • JPS619426A
    • 1986-01-17
    • JP13153784
    • 1984-06-26
    • Toyota Central Res & Dev Lab Inc
    • SATOU SHIGEYUKIMATSUSHITA MITSUMASA
    • H05K3/28C08G59/00C08G59/18C08G59/68C08L63/00H01L23/29H01L23/31
    • PURPOSE: An epoxy resin composition which can form a cured product excellent in moisture resistance, rust inhibition and adhesion and is suitable for sealing electronic parts, prepared by mixing an epoxy resin with a lanolin (derivative) and an organotitanium compound.
      CONSTITUTION: 100pts.wt. epoxy resin (e.g., phenol novolak epoxy resin) is mixed with a curing agent (e.g., phenolic resin precondensate) in an amount to provide a chemical equivalent ratio of about 0.5W1.5 to the epoxy groups in the epoxy resin, about 0.1W10pts.wt. lanolin (derivative) and about 0.01W5pts.wt. organotitanium compound (e.g., tetraisopropyl titanate).
      COPYRIGHT: (C)1986,JPO&Japio
    • 目的:可以形成耐湿性,防锈性和粘合性优异的固化物的环氧树脂组合物,适用于通过将环氧树脂与羊毛脂(衍生物)和有机钛化合物混合而制备的电子部件的密封。 构成:100pts.wt。 将环氧树脂(例如苯酚酚醛清漆环氧树脂)与固化剂(例如酚醛树脂预缩合物)混合,其量使环氧树脂中的环氧基的化学当量比为约0.5-1.5,约0.1-10pt .wt。 羊毛脂(衍生物)和约0.01-5pts.wt。 有机钛化合物(例如钛酸四异丙酯)。
    • 27. 发明专利
    • Epoxy resin composition
    • 环氧树脂组合物
    • JPS6123622A
    • 1986-02-01
    • JP14514184
    • 1984-07-12
    • Toyota Central Res & Dev Lab Inc
    • SATO SHIGEYUKIMATSUSHITA MITSUMASA
    • C08G59/00C08G59/18C08L63/00H01L23/29H01L23/31
    • PURPOSE: The titled composition excellent in moisture resistance, rust inhibition and adhesion and useful as a sealing resin for electrical parts, prepared by mixing an epoxy resin with a curing agent and a specified additive.
      CONSTITUTION: An epoxy resin composition prepared by mixing an epoxy resin (e.g., glycidyl ether or phenol novolak epoxy resin) with an additive comprising a curing agent (e.g., phthalic anhydride), a dithiophosphoric acid (derivative), e.g., diisopropyl dithiophosphate (or its zinc salt) and an organotitanium compound (e.g., tetraisopropyl titanate). The incorporation of said additive makes it possible to prevent moisture or ionic impurities from penetrating into the interface between the resin composition and the substrate, so that this resin composition can show excellent moisture resistance, rust inhibition and adhesion. Therefore, it can be used as a sealing resin for electrical parts or used for paints, adhesives, etc.
      COPYRIGHT: (C)1986,JPO&Japio
    • 目的:通过将环氧树脂与固化剂混合而制成的防水性,防锈性和粘合性优异的作为电气部件的密封树脂的标题组合物和特定添加剂。 构成:通过将环氧树脂(例如缩水甘油醚或苯酚酚醛清漆环氧树脂)与包含固化剂(例如邻苯二甲酸酐),二硫代磷酸(衍生物),例如二异丙基二硫代磷酸酯(或 其锌盐)和有机钛化合物(例如钛酸四异丙酯)。 所述添加剂的结合使得可以防止水分或离子杂质渗透到树脂组合物和基底之间的界面中,使得该树脂组合物可以显示出优异的耐湿性,防锈性和粘附性。 因此,它可以用作电气部件的密封树脂或用于油漆,粘合剂等。
    • 28. 发明专利
    • Epoxy resin composition
    • 环氧树脂组合物
    • JPS619425A
    • 1986-01-17
    • JP13153684
    • 1984-06-26
    • Toyota Central Res & Dev Lab Inc
    • SATOU SHIGEYUKIMATSUSHITA MITSUMASA
    • C08G59/00C08G59/18C08G59/68C08L63/00
    • PURPOSE: An epoxy resin composition which can form a cured product excellent in moisture resistance, rust inhibition and adhesion and is suitable for sealing electronic parts, prepared by mixing an epoxy resin with a lanolin (derivative) and an organoaluminum compound.
      CONSTITUTION: 100pts.wt. epoxy resin (e.g., phenol novolak epoxy resin) is mixed with a curing agent (e.g., phenolic resin precondensate) in an amount to provide a chemical equivalent ratio of about 0.5W1.5 to the epoxy groups in the epoxy resin, about 0.1W10pts.wt. lanolin (derivative) and about 0.01W5pts.wt. organoaluminum compound (e.g., aluminum stearate).
      COPYRIGHT: (C)1986,JPO&Japio
    • 目的:可以形成耐湿性,防锈性和粘合性优异的固化物的环氧树脂组合物,适用于通过将环氧树脂与羊毛脂(衍生物)和有机铝化合物混合而制备的电子部件的密封。 构成:100pts.wt。 将环氧树脂(例如苯酚酚醛清漆环氧树脂)与固化剂(例如酚醛树脂预缩合物)混合,其量使环氧树脂中的环氧基的化学当量比为约0.5-1.5,约0.1-10pt .wt。 羊毛脂(衍生物)和约0.01-5pts.wt。 有机铝化合物(如硬脂酸铝)。
    • 29. 发明专利
    • Epoxy resin composition
    • 环氧树脂组合物
    • JPS6136316A
    • 1986-02-21
    • JP15850084
    • 1984-07-27
    • Toyota Central Res & Dev Lab Inc
    • SATO SHIGEYUKIMATSUSHITA MITSUMASA
    • C08G59/00C08G59/18C08G59/40C08L7/00C08L21/00C08L63/00H01L23/29H01L23/31
    • PURPOSE: To provide the titled composition composed of an epoxy resin, a curing agent and an additive consisting of an oxidized wax (derivative) and an organotin compound, having excellent moisture resistance and rustproofing property, and useful for the sealing of electronic circuit parts, etc.
      CONSTITUTION: The objective composition can be prepared by compounding (A) an epoxy resin with (B) a curing agent and (C) an additive consisting of (i) oxidized wax and/or oxidized wax derivative and (ii) an organotin compound. Preferably, the component A is phenol novolac or cresol novolac resin, the component B is a phenolic resin, the component (i) is paraffin wax, etc., and the component (ii) is an alkyltin compound, and the amounts of the components (i) and (ii) are 0.1W10pts.(wt.) and 0.01W5pts. per 100pts. of the component A.
      COPYRIGHT: (C)1986,JPO&Japio
    • 目的:提供由环氧树脂,固化剂和由氧化蜡(衍生物)和有机锡化合物组成的添加剂的标题组合物,具有优异的耐湿性和防锈性,并且可用于密封电子电路部件, 目的组合物可以通过将(A)环氧树脂与(B)固化剂和(C)由(i)氧化蜡和/或氧化蜡衍生物组成的添加剂和(ii)有机锡 复合。 优选组分A为酚醛清漆或甲酚酚醛清漆树脂,组分B为酚醛树脂,组分(i)为石蜡等,组分(ii)为烷基锡化合物,组分 (i)和(ii)为0.1-10pts(wt。)和0.01-5pts。 每100pts。 的组分A.
    • 30. 发明专利
    • Epoxy resin composition
    • 环氧树脂组合物
    • JPS6134014A
    • 1986-02-18
    • JP15632084
    • 1984-07-26
    • Toyota Central Res & Dev Lab Inc
    • SATO SHIGEYUKIMATSUSHITA MITSUMASA
    • C08G59/00C08G59/18C08G59/40C08L7/00C08L21/00C08L63/00H01L23/29H01L23/31
    • PURPOSE: A resin composition excellent in moisture resistance, rust inhibition and adhesion, prepared by adding a curing agent and a specified additive to an epoxy resin.
      CONSTITUTION: The titled composition prepared by adding an additive comprising a curing agent (e.g., phenolic resin), an oxidized wax (e.g., oxidized paraffin wax) or its derivative (e.g., oxidized wax methyl ester), and an organotitanium compound (e.g., isopropyl tristearyl titanate) to an epoxy resin. In said mixing 0.1W10pts.wt. oxidized wax (derivative) and 0.01W5pts.wt. organotitanium compound are used per 100pts.wt. epoxy resin. When this composition is used as, e.g., a sealing resin for semiconductor devices or other electronic circuit parts, it can form a film excellent in moisture resistance, rust inhibition and adhesion because the above additive intervenes between this composition and the sealed object to prevent external moisture and ionic impurities from penetrating to the surface of the object.
      COPYRIGHT: (C)1986,JPO&Japio
    • 目的:通过向环氧树脂中添加固化剂和特定添加剂而制备的耐湿性,防锈性和粘合性优异的树脂组合物。 构成:通过添加包含固化剂(例如酚醛树脂),氧化蜡(例如氧化石蜡)或其衍生物(例如氧化蜡甲酯)的添加剂和有机钛化合物(例如, 异丙基三硬脂基钛酸酯)与环氧树脂。 在所述混合0.1-10pts.wt。 氧化蜡(衍生物)和0.01-5pts.wt。 有机钛化合物每100pts.wt。 环氧树脂。 当该组合物用作半导体装置或其它电子电路部件的密封树脂时,由于上述添加剂介于该组合物和密封体之间,因此可以形成耐湿性,防锈性和粘附性优异的膜,以防止外部 水分和离子杂质渗透到物体表面。