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21. 发明专利

JP2012063279A Solder joint part life prediction method, solder joint part life prediction device, and electronic apparatus 有权
标题翻译：焊接接头零件寿命预测方法，焊接接头零件寿命预测装置和电子设备
公开(公告)号：JP2012063279A
公开(公告)日：2012-03-29
申请号：JP2010208553
申请日：2010-09-16
申请人： Toshiba Corp , 株式会社東芝
发明人： OMORI TAKAHIRO , HIROHATA KENJI , KADOTA TOMOKO , HIRAOKA KATSUAKI , MUKAI MINORU
IPC分类号： G01N17/00 , H05K3/34
CPC分类号： B23K31/125 , B23K1/00 , G01N2203/0073 , G01N2203/0212 , G01R31/048 , H01L24/13 , H01L24/14 , H01L24/17 , H01L2224/131 , H01L2224/14517 , H01L2224/16225 , H01L2224/17517 , H01L2924/10253 , H01L2924/1432 , H01L2924/1434 , H01L2924/3011 , H05K1/0271 , H05K3/3436 , H01L2924/014 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a solder joint part life prediction method, life prediction device, and electronic apparatus for highly accurately evaluating the life of each solder joint part in consideration of rigidity deterioration to occur in each joint part by the progress of damage.SOLUTION: A solder joint part life prediction method includes: a step for referring to temperature history information of a measured object having solder joint parts; a step for checking at least one of the physical amounts of the amplitude of a temperature fluctuation, the number of cycles, average temperature, and a period by cycle counting based on the temperature history information; a step for calculating a distortion range, based on at least one of the physical amounts checked by the cycle counting by using a previously generated response surface; and a step for calculating a distortion range increase rate with referring to a previously obtained damage value and a distortion fluctuation history in the distortion range, based on the distortion range.
摘要翻译：要解决的问题：提供一种焊接部件寿命预测方法，寿命预测装置和电子设备，用于通过进行中的每个接合部分考虑到刚度劣化高度精确地评估每个焊点部分的寿命的伤害。焊接部件寿命预测方法包括：用于参考具有焊接部件的测量对象的温度历史信息的步骤; 基于温度历史信息来检查温度波动的幅度的物理量，循环次数，平均温度和周期计数中的至少一个的步骤; 基于通过使用先前产生的响应面的循环计数检查的物理量中的至少一个来计算失真范围的步骤; 以及基于失真范围参考先前获得的损伤值和失真范围中的失真波动历史来计算失真范围增加率的步骤。版权所有（C）2012，JPO＆INPIT

22. 发明专利

JP2010257491A Memory device and method for controlling the same 有权
标题翻译：存储装置及其控制方法
公开(公告)号：JP2010257491A
公开(公告)日：2010-11-11
申请号：JP2010182201
申请日：2010-08-17
申请人： Toshiba Corp , 株式会社東芝
发明人： MUKAI MINORU , HIROHATA KENJI , KADOTA TOMOKO
IPC分类号： G06F12/16
摘要： PROBLEM TO BE SOLVED: To assure reliability of a memory device by surely estimating the damage on a joint part of the memory device mounted on a circuit board. SOLUTION: In a memory device 100, a plurality of semiconductor memory packages 13, where a semiconductor memory 50 is mounted, are mounted on a printed board 15 through a joint part 14. It includes: a sensor part 10 for measuring physical quantity about the state of the memory device 100; a database 20 in which a damage estimating model base for estimating a damage at the joint part 14 based on the physical quantity is accumulated; a damage estimating part 30 for calculating an estimated value of the damage of the joint part 14 based on the physical quantity by utilizing the damage estimating model base 20; and a control part 40 which selectively controls writing, reading, and erasing of electronic data to/from the semiconductor memory 12 mounted on the semiconductor memory package 13, being mounted through the joint part 14, according to the estimated value. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：通过可靠地估计安装在电路板上的存储器件的接合部分的损坏来确保存储器件的可靠性。解决方案：在存储器件100中，安装有半导体存储器50的多个半导体存储器封装13通过接合部分14安装在印刷板15上。它包括：用于测量物理的传感器部分10 关于存储器件100的状态的量; 数据库20，其中累积用于基于物理量估计关节部14的损伤的损伤估计模型基准; 损伤估计部30，用于通过利用损伤估计模型基准20，基于物理量计算关节部14的损伤的估计值; 以及根据估计值，通过接合部14安装通过安装在半导体存储器组件13上的半导体存储器12的电子数据的写入，读取和擦除的控制部分40。版权所有（C）2011，JPO＆INPIT

23. 发明专利

JP2009295644A Cooling system for detecting degree of blockage of cooling fin of cooling module 有权
标题翻译：用于检测冷却模块冷却结块程度的冷却系统
公开(公告)号：JP2009295644A
公开(公告)日：2009-12-17
申请号：JP2008145182
申请日：2008-06-02
申请人： Toshiba Corp , 株式会社東芝
发明人： TAKAMATSU TOMONAO , KITAMURA HIDEO , HIROHATA KENJI , KUNO KATSUMI
IPC分类号： H05K7/20 , H01L23/467
摘要： PROBLEM TO BE SOLVED: To provide a cooling fin blockage detection system for an air-cooled cooling module, which detects the blockage of cooling fins 1 due to dust and dirt, predicts time that the cooling capacity of the cooling module may be reduced and previously issues a warning.
SOLUTION: In the cooling system for detecting the degree of blockage of the cooling fins in the cooling module, temperatures of a plurality of cooling fins 1 in the cooling module 8 are measured and the temperature differences of respective cooling fins 1 are calculated. The degree of blockage of the cooling fins 1 is calculated from relation between the degree of blockage of the cooling fins 1 which is previously set in accordance with an operation mode and the temperature differences of the cooling fins 1 based on the temperature differences. Time that the cooling capacity of the cooling module may be reduced is predicted from the degree of blockage of the cooling fins 1 and the predicted time is notified to a user through a display device.
COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于检测由于灰尘和污物而导致的散热片1堵塞的风冷式冷却模块的冷却翅片堵塞检测系统，预测冷却模块的冷却能力可能为减少并且以前发出警告。解决方案：在用于检测冷却模块中的冷却片的堵塞程度的冷却系统中，测量冷却模块8中的多个冷却片1的温度，并计算各冷却片1的温度差。冷却翅片1的堵塞程度是根据预先根据操作模式设定的冷却翅片1的阻塞程度与冷却翅片1的温度差的温差之间的关系来计算的。可以从冷却片1的堵塞程度来预测冷却模块的冷却能力可能降低的时间，并且通过显示装置向用户通知预测时间。版权所有（C）2010，JPO＆INPIT

24. 发明专利

JP2009289177A Electronic equipment 有权
标题翻译：电子设备
公开(公告)号：JP2009289177A
公开(公告)日：2009-12-10
申请号：JP2008143237
申请日：2008-05-30
申请人： Toshiba Corp , 株式会社東芝
发明人： KITAMURA HIDEO , HIROHATA KENJI , KUNO KATSUMI , TAKAMATSU TOMONAO
IPC分类号： G06F1/20 , H01L23/467 , H05K7/20
CPC分类号： G05D23/19 , G05B23/0235 , G05B2219/24077 , H01L2924/0002 , H05K7/20209 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide an electronic equipment for stably detecting closure due to dusts even when fan performance changes with time. SOLUTION: This electronic equipment is provided with: a heat releasing fin 5 for releasing heat from a heating part; a fan 6 to be rotated by a driving power for sending air to the heat releasing fin 5; a temperature measuring means 10 for measuring the temperature of the heating part; an adjustment means 11 for adjusting the driving power according to driving conditions for the measured temperature; a revolving speed measurement means 13 for measuring the revolving speed of the fan 6; a deviation value calculation means 12 for calculating a deviation value from a normal boundary in a relation between a power index related with the adjusted driving power and the measured revolving speed of the fan 6; a closure detection means 12 for detecting the closure of an air sending path for sending air to the heat releasing fin 5 by taking in open air with the fan 6 from the outside of a casing based on the deviation value; and a deviation value correction means 14 for correcting the deviation value according to the change of the performance of the fan 6 with time in order to compensate the deterioration of the detecting capability of closure by the closure detection means 12 according to the change with time. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：即使当风扇性能随时间变化时，也提供用于稳定地检测由于灰尘引起的闭合的电子设备。解决方案：该电子设备设有：用于从加热部分释放热量的散热片5; 通过用于将空气送到散热片5的驱动力旋转的风扇6; 用于测量加热部件的温度的温度测量装置10; 用于根据测量温度的驱动条件调节驱动功率的调节装置11; 用于测量风扇6的转速的转速测量装置13; 偏差值计算装置12，用于根据与调节驱动力相关的功率指标与风扇6的测量转速之间的关系来计算与正常边界的偏差值; 一个闭合检测装置12，用于检测用于通过基于该偏差值从壳体的外部吸入风扇6的空气而将空气送到散热片5的送风路径的关闭; 以及偏差值校正装置14，用于随时间校正根据风扇6的性能变化的偏差值，以便根据随时间的变化来补偿关闭检测装置12的关闭检测能力的劣化。版权所有（C）2010，JPO＆INPIT

25. 发明专利

JP2009289154A Apparatus and method for determining monitoring requirement, and monitoring and diagnostic apparatus 有权
标题翻译：用于确定监测要求的装置和方法，以及监测和诊断装置
公开(公告)号：JP2009289154A
公开(公告)日：2009-12-10
申请号：JP2008142880
申请日：2008-05-30
申请人： Toshiba Corp , 株式会社東芝
发明人： HIROHATA KENJI
IPC分类号： G06F1/20
摘要： PROBLEM TO BE SOLVED: To properly diagnose whether the subject of monitoring is normal or abnormal. SOLUTION: In one embodiment, an apparatus for determining monitoring requirements includes a means for monitoring the subject of monitoring in accordance with a certain monitoring requirement candidate and obtaining a plurality of monitoring variables, both when the subject of monitoring is in the normal condition and when it is in an abnormal condition; a means for calculating moments about one or more monitoring variables including moments greater than secondary, for the normal condition and for the abnormal condition; a means for calculating approximate models of probability density potential about the plurality of monitoring variables as a normal approximate model and an abnormal approximate model for the normal condition and for the abnormal condition, while using the moments as restraint conditions; a means for calculating an evaluation index for evaluating a difference between the normal approximate model and the abnormal approximate model; and a means for determining one of the monitoring requirement candidates as the monitoring requirement. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：正确诊断监测对象是否正常或异常。解决方案：在一个实施例中，用于确定监视要求的装置包括用于根据某一监视要求候选者监视监视对象并获得多个监视变量的装置，当监视对象处于正常状态时条件和处于异常状态时; 一种用于计算关于一个或多个监测变量的时刻的方法，包括正常状态和异常情况下包括大于次级的力矩; 在使用时刻作为约束条件的情况下，计算关于多个监视变量的概率密度电位的近似模型作为正常近似模型和用于正常条件和异常条件的异常近似模型的装置; 用于计算用于评估正常近似模型和异常近似模型之间的差异的评估指标的方法; 以及用于将监测要求候选者中的一个确定为监测要求的手段。版权所有（C）2010，JPO＆INPIT

26. 发明专利

JP2006099482A Analysis support system and analysis support program 审中-公开
标题翻译：分析支持系统和分析支持计划
公开(公告)号：JP2006099482A
公开(公告)日：2006-04-13
申请号：JP2004285457
申请日：2004-09-29
申请人： Toshiba Corp , 株式会社東芝
发明人： HIROHATA KENJI
IPC分类号： G06N7/08
摘要： PROBLEM TO BE SOLVED: To provide an analysis support system for executing multivariate data analysis while eliminating the redundancy of a model on the basis of nonlinear regression analysis by a neural network. SOLUTION: The analysis support system for analyzing a design space relating to a plurality of design items comprises: a structural equation modeling module 11b for creating a structural equation model for the design space and extracting causation/correlation information included in the structural equation model; a sampling point generation module 11c for generating a sampling point for the design space by utilizing a Monte Carlo approach on the basis of the causation/correlation information; and a nonlinear regression module 11d for preparing a nonlinear regression model from the sampling point by using a neural network model. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于执行多变量数据分析的分析支持系统，同时基于神经网络的非线性回归分析消除模型的冗余。解决方案：用于分析与多个设计项目有关的设计空间的分析支持系统包括：用于为设计空间创建结构方程模型并提取包括在结构方程式中的因果关系/相关信息的结构方程模型模块11b 模型; 采样点生成模块11c，用于基于因果关联信息，通过利用蒙特卡罗方法产生设计空间的采样点; 以及用于通过使用神经网络模型从采样点准备非线性回归模型的非线性回归模块11d。版权所有（C）2006，JPO＆NCIPI

27. 发明专利

JP2014197705A 損傷指標予測システム、損傷予測方法、電子機器および処理プログラム审中-公开
标题翻译：损害指数预测系统，损伤预测方法，电子设备和处理程序
公开(公告)号：JP2014197705A
公开(公告)日：2014-10-16
申请号：JP2014131457
申请日：2014-06-26
申请人：株式会社東芝 , Toshiba Corp
发明人： KADOTA TOMOKO , MUKAI MINORU , HIROHATA KENJI
IPC分类号： H05K3/34 , G01R31/26 , H05K13/08
摘要：【課題】回路基板上の実装部品等の高精度な損傷予測が可能な電子機器の損傷指標予測システムを提供する。【解決手段】電子部品を回路基板と接続する接合部と、電子部品の周辺に配置された検出用接合部とを有する電子機器の接合部の損傷に関する指標を予測する損傷予測システムであって、検出用接合部の損傷に関する指標と接合部の損傷に関する指標との関係から、接合部の損傷に関する指標の予測値を演算する演算部を備える。【選択図】図1
摘要翻译：要解决的问题：提供能够对电路板上的实现部件实现高精度损伤预测的电子设备的损伤指数预测系统。解决方案：预测与损伤预测系统的连接部分的损坏有关的损伤预测系统具有连接电子部件与电路基板的连接部的电气设备和具有设置在电子部件周围的具有检测用连接部的电子设备的连接部的电气设备包括：计算部，其计算与连接相关的指标的预测值根据检测用连接部的索引与连接部的损坏的指标之间的关系。

28. 发明专利

JP2012204705A Semiconductor module 有权
标题翻译：半导体模块
公开(公告)号：JP2012204705A
公开(公告)日：2012-10-22
申请号：JP2011069144
申请日：2011-03-28
申请人： Toshiba Corp , 株式会社東芝
发明人： HIROHATA KENJI , MUKAI MINORU , KADOTA TOMOKO
IPC分类号： H01L25/04 , H01L25/18
CPC分类号： G01R27/16 , H01L23/64 , H01L2924/0002 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor module that monitors a fault symptom.SOLUTION: A semiconductor module 100 comprises: a substrate 1A; a first wiring line 2 that is arranged on the substrate and has characteristic impedance Z0; an electrode pad 3 that is connected to the first wiring line; a joint part 4 that is arranged on the electrode pad and has impedance Z1; an oscillator 5 that is disposed in contact with the first wiring line and can oscillate a voltage pulse wave to the joint part via the first wiring line; and a detector 6 that is disposed in contact with the first wiring line and that can detect an output wave in response to the pulse wave from the joint part. The characteristic impedance Z0 and the impedance Z1 have a predetermined relation.
摘要翻译：要解决的问题：提供监测故障症状的半导体模块。解决方案：半导体模块100包括：基板1A; 布置在基板上并具有特性阻抗Z0的第一布线2; 连接到第一布线的电极焊盘3; 配置在电极焊盘上并具有阻抗Z1的接合部4; 振荡器5，其设置成与所述第一布线接触，并且能够经由所述第一布线将电压脉冲波振荡到所述接合部; 以及检测器6，其被布置成与第一布线相接触，并且可以响应于来自接合部的脉波而检测输出波。特性阻抗Z0和阻抗Z1具有预定的关系。版权所有（C）2013，JPO＆INPIT

29. 发明专利

JP2011109145A Damage index prediction system and damage prediction method 审中-公开
标题翻译：损伤指标预测系统和损伤预测方法
公开(公告)号：JP2011109145A
公开(公告)日：2011-06-02
申请号：JP2011044015
申请日：2011-03-01
申请人： Toshiba Corp , 株式会社東芝
发明人： KADOTA TOMOKO , MUKAI MINORU , HIROHATA KENJI
IPC分类号： H05K13/08 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To provide a damage index prediction system of electronic equipment which enables high-precision damage prediction of mounted components and the like on a circuit board.
SOLUTION: The damage prediction system predicts the index about the damage of a joint of the electronic equipment having a joint which electrically connects electronic components to the circuit board for mounting and a joint for detection which is designed so that its lifetime is lower than that of the joint. The damage prediction system includes a database in which the relationship about the index of the breakage of the joint and the index of the breakage of the joint for detection is accumulated, a breakage detector which detects the breakage of the joint for detection, and a calculator which calculates the predicted value of the index about the damage of the joint from information about the breakage of the joint for detection obtained by the breakage detector and the relationship accumulated in the database.
COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译：要解决的问题：提供能够对电路板上的安装部件等进行高精度损伤预测的电子设备的损伤指数预测系统。解决方案：损伤预测系统预测具有将电子部件电连接到电路板用于安装的接头的电子设备的接头的损坏指标和用于检测的接头，其被设计为使其寿命更低比联合要好。损伤预测系统包括：数据库，其中累积关节的断裂指数和用于检测的关节的断裂指数的关系;检测用于检测的关节的断裂的破损检测器;以及计算器从断裂检测器获得的检测关节断裂信息和数据库中积累的关系中计算关于关节损伤的指标的预测值。版权所有（C）2011，JPO＆INPIT

30. 发明专利

JP2010073795A Damage index prediction system and damage index prediction method 有权
标题翻译：损害指数预测系统和损害指数预测方法
公开(公告)号：JP2010073795A
公开(公告)日：2010-04-02
申请号：JP2008237935
申请日：2008-09-17
申请人： Toshiba Corp , 株式会社東芝
发明人： KADOTA TOMOKO , MUKAI MINORU , HIROHATA KENJI
IPC分类号： H05K13/08 , H05K3/34
CPC分类号： H05K3/3436 , H05K1/0268 , H05K2201/10204 , H05K2201/10522 , H05K2201/10545 , H05K2203/163 , Y02P70/613
摘要： PROBLEM TO BE SOLVED: To provide a damage index prediction system of electronic equipment which enables high-precision damage prediction of mounted components and the like on a circuit board. SOLUTION: The damage prediction system predicts the index about the damage of a joint part of the electronic equipment having a joint part which electrically connects electronic components to the circuit board for mounting and a joint part for detection which is designed so that its lifetime is lower than that of the joint part. The damage prediction system is provided with: database in which the relation about the breakage of the joint part and the joint part for detection is accumulated; a breakage detection part which detects the breakage of the joint part for detection; and a calculation part which calculates the predicted value of the index about the damage of the joint part from information about the breakage of the joint part for detection obtained by the breakage detection part and the relation accumulated in the database. COPYRIGHT: (C)2010,JPO&INPIT
摘要翻译：要解决的问题：提供能够对电路板上的安装部件等进行高精度损伤预测的电子设备的损伤指数预测系统。解决方案：损伤预测系统预测具有将电子部件电连接到安装用电路基板的接合部的电子设备的接合部的损坏指标和用于检测的接合部，寿命低于联合部分。损伤预测系统提供：累积关节部分和关节部分断裂关系的数据库; 断裂检测部，其检测用于检测的接合部的断裂; 以及计算部，其从关于由破损检测部获得的检测用接合部的断裂的信息和在数据库中累积的关系，计算关于接合部的损伤的指标的预测值。版权所有（C）2010，JPO＆INPIT

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