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21. 发明专利

JP2001107193A IRON-NICKEL SERIES ALLOY MEMBER AND SEALED GLASS PARTS 失效
公开(公告)号：JP2001107193A
公开(公告)日：2001-04-17
申请号：JP28454699
申请日：1999-10-05
申请人： TOSHIBA CORP
发明人： NAKAJIMA HITOSHI , TAKADO TEIJI
IPC分类号： H01S5/022 , C22C38/00 , C22C38/08 , C22C38/50
摘要： PROBLEM TO BE SOLVED: To solve the problems that the conventional alloys used for the sealing of glass are inferior in the joinability with glass and in the reliability of sealing, and also the conventional alloys have not been able to suppress the reflection of light, lasers, or the like, and light elements produced by using the same have often been influenced by the reflection of light, lasers, or the like. SOLUTION: In this iron-nickel series alloy member for joining with glass in which the thermal expansion coefficient at 30 deg.C and in an optional temperature region from >30 to 400 deg.C is 60×10-7/ deg.C to 75×10-7/ deg.C, the difference between the thermal expansion coefficient of the iron-nickel series alloy member at 30 deg.C and in an optional temperature region from 200 to 350 deg.C and the thermal expansion coefficient of the above glass lies in the range of ±10% by the ratio with the thermal expansion coefficient of the glass as a standard, the arithmetical average roughness Ra prescribed by JIS B0601-1994 of the above iron-nickel series alloy member is >0.20 to 2.00 μm, the average spacing Sm of ruggedness prescribed by JIS B0601-1994 is 5 to 200 μm, and also, Sm/Ra is >=35.

22. 发明专利

JPH05308178A 失效
公开(公告)号：JPH05308178A
公开(公告)日：1993-11-19
申请号：JP21325192
申请日：1992-07-20
申请人： DENKI KAGAKU KOGYO KK , TOSHIBA CORP
发明人： YONEMURA NAOKI , WATANABE CHIHARU , FUKUDA MAKOTO , NAKAJIMA HITOSHI
IPC分类号： H05K1/09 , H05K3/00
摘要： PURPOSE:To obtain clad foils wherein the film thickness of each foil is uniform and the film thickness of each foil is thick by using a rolled aluminum-copper clad foil in which an alloy layer composed of aluminum and copper is not formed. CONSTITUTION:When an alloy layer composed of aluminum and copper is interposed at the interface of aluminum and copper, a rolled aluminum-copper clad foil 5 lowers an etching property when a circuit wiring pattern is formed. As a result, the foil is not provided with the alloy layer composed of aluminum and copper. Thereby, the clad layer 5 whose etching property can be made good, in which a formed circuit edge part can be finished uniformly and in which the film thickness of an aluminum foil 3 and a copper foil 4 is uniform and thick can be obtained at low costs.

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