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21. 发明专利

JPH02110951A MANUFACTURE OF SEMICONDUCTOR DEVICE AND ITS DEVICE 失效
公开(公告)号：JPH02110951A
公开(公告)日：1990-04-24
申请号：JP26436888
申请日：1988-10-19
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： OKAMOTO IZUMI , SUZUKI TOMOHIKO , MIHATA MASAYOSHI , MATSUMOTO HIDEO , HATADA KENZO
IPC分类号： H01L21/60
摘要： PURPOSE:To make it possible to prevent the peeling of the bump electrodes of an LSI chip or the like from conductor wirings and to make it possible to make reliably the electrical connection between an insulative substrate and a semiconductor element even in case the substrate and the element incline from each other by a method wherein the element is fixed on the substrate in a state that the element is parallel to the substrate or in a state that a deformation in a recessed direction is generated. CONSTITUTION:In case a fixing of a semiconductor element 5 to an insulative substrate 3 and the electrical connection between the element 5 and the substrate 3 are performed by hardening an insulative resin 1 in a state that the resin 1 is interposed between the substrate 3 having conductor wirings 2 and the element 5 having bump electrodes 6, the wirings 2 and the electrodes 6 are made to coincide with each other and moreover, the element 5 is pressed on the substrate 3, the element 5 is fixed on the substrate 3 in a state that the element 5 is parallel to the substrate 3 or in a state that a deformation in a recessed direction is generated. For example, a pressing tool 7, which has a pressing surface of a size identical with that of an LSI chip 5 or a size larger than that of the chip 5 and a thickness thicker than that of the chip 5, is fixed to a supporting stand 10 through an elastic body 9, the chip 5 is pressed in a state that an elastic body 8 is interposed between the tool 7 and the chip 5 and a bonding resin 1 is cured in that state.

22. 发明专利

JP2002151548A METHOD FOR BONDING ELECTRODE OF BOARD AND SUBSTRATE 失效
公开(公告)号：JP2002151548A
公开(公告)日：2002-05-24
申请号：JP2000343479
申请日：2000-11-10
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： AKIGUCHI NAOSHI , TSUKAHARA NORITO , SUZUKI TOMOHIKO , YAMAMOTO TAKAYUKI
IPC分类号： G09F9/00 , H01J11/46 , H01J11/48 , H01L21/60 , H04N5/66 , H05K1/14
摘要： PROBLEM TO BE SOLVED: To provide a method for bonding the electrode of a board, and a board, which can deal with a state being applied with high voltage and high current while realizing highly reliable bonding quality without increasing the man-hours. SOLUTION: An adhesive sheet 4 dispersed with conductive particles 5 is hot pressed to a bonding electrode part 2a for first board on a first board 1 and a bonding electrode part 7a for second board of an electrode 7 on a second board 8 and they are conducted through the conductive particles 5. Furthermore, the adhesive sheet 4 is hot pressed to the end face 3a of an insulating film for a first board electrode and the end face 6a of an insulating film for a second board electrode.

23. 发明专利

JPH1197576A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH1197576A
公开(公告)日：1999-04-09
申请号：JP25633297
申请日：1997-09-22
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SUZUKI TOMOHIKO , IDA HIDEJI , KUROKAWA HIDEO
IPC分类号： H01L21/60 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To enhance heat dissipation properties while suppressing concurrent switching noise by forming solder balls on an insulating film through through holes and connecting a conductor wiring connected with the power supply terminal and the ground terminal of a semiconductor element electrically with a metal plate through a conductive material. SOLUTION: A conductive layer, i.e., a copper foil, is bonded to an insulating film 2 and subjected to exposure and etching thus forming a conductor wiring 3. The conductor wiring 3 is connected with solder balls 9 through through holes 6 made through the conductor wiring 3. The conductor wiring 3 connected with the power supply terminal and the ground terminal of a semiconductor element 1 is then connected electrically with a metal plate 5 by applying a conductive material 7 of conductive resin produced by added a conductive filter, e.g. copper or silver particles, into an insulating resin. According to the structure, the metal plate 5 can serve as a heat dissipating unit and concurrent switching noise can be suppressed.

24. 发明专利

JPH04171947A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04171947A
公开(公告)日：1992-06-19
申请号：JP30195890
申请日：1990-11-06
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： MASUYAMA MASAYUKI , MIHATA MASAYOSHI , SUZUKI TOMOHIKO
IPC分类号： H01L21/60
摘要： PURPOSE:To prevent a film carrier from being warped at the time of thermocompression bonding by providing resist layers of the same material as that of the base films of the film carrier so that the resist layers can coat conductive leads on the base films. CONSTITUTION:After the inner lead bonding sections 12a and 12b of conductive leads extended from the base films 11a and 11b of a film carrier made of an insulating resin are connected to a semiconductor element 13 by thermocompression bonding, the base films 11a and 11b and the outer lead bonding sections 14a and 14b of the conductive leads are disconnected from each other. In addition, resist layers 15a and 15b made of the same material as that of the films 11a and 11b are formed in advance on the films 11a and 11b of the film carrier to coat the layers 15a and 15b. Therefore, the deviation of displacement between the conductive leads and films 11a and 11b caused by differences in coefficient of thermal expansion and coefficient of thermal contraction between the conductive leads and base films 11a and 11b at the time of thermocompression bonding can be suppressed.

25. 发明专利

JPH034546A SEMICONDUCTOR MOUNTING DEVICE 失效
公开(公告)号：JPH034546A
公开(公告)日：1991-01-10
申请号：JP14047689
申请日：1989-06-01
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SUZUKI TOMOHIKO , OKAMOTO IZUMI , MIHATA MASAYOSHI , HATADA KENZO
IPC分类号： B41J2/335 , H01L21/60
摘要： PURPOSE:To press uniformly a semiconductor element and to enhance the reliability of the connection between electrodes and a wiring by a method wherein a pressurizing body is pressed by pressing bodies through O-rings. CONSTITUTION:An insulative resin 15 is applied on a part, on which a semiconductor element 13 is fixed, of a wiring board 11. Then, bump-shaped electrodes 14 of the element 13 are made to coincide with a wiring 12 on the board 11 and the element 13 is pressed to the board 11 by a pressurizing body 16. O-rings 18 are respectively made to interpose between the body 16 and pressing bodies 17, the inclination of the element 13 is absorbed by the elasticity of the O-rings 18 and the element 13 is pressed by the body 16 in a state that the element 13 is parallel to the board 11. By this pressing, the resin 15 on the wiring 12 is pushed out on the periphery of the element 13, the electrodes 14 are abutted on the wiring 12 and in this state, ultraviolet light 19 is irradiated through the body 16, the resin 15 on the peripheral edge parts of the element 13 is hardened and the element 13 is temporarily fixed on the board 11. Then, by heating the element 13 while being pressed, the electrical connection between the electrodes 14 and the wiring 12 and the mechanical maintenance of the element 13 are completed.

26. 发明专利

JPH02110950A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH02110950A
公开(公告)日：1990-04-24
申请号：JP26437088
申请日：1988-10-19
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SUZUKI TOMOHIKO , OKAMOTO IZUMI , MIHATA MASAYOSHI , HATADA KENZO
IPC分类号： H01L21/60
摘要： PURPOSE:To prevent a bonding resin from remaining between bump electrodes and conductor wirings by a method wherein the electrodes are not provided with a recessed part in their points and their points are formed into a flat or projected configuration. CONSTITUTION:In a semiconductor device wherein a semiconductor element 4 is Fixed on an insulative substrate 1 to connect electrically conductor wirings 2 and bump electrodes 5 to each other by hardening an insulative resin 3 in a state that the resin 3 is interposed between the substrate 1 having the wirings 2 and the element 4 having the electrodes 5, the wirings 2 and the electrodes 5 are made to coincide with each other and the element 4 is pressed on the substrate 1, the above electrodes 5 are not provided with a recessed part in their points and their points are formed into a flat or projected configuration. For example, the above wirings 2 consist of a Cr-Au film, an Al film, an ITO film, a thick Au paste film and the like and the electrodes 5 consist of an Au film, a Cu film, an Al film, a solder film and the like and their points are formed into a flat or projected configuration.

27. 发明专利

JPH01199440A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH01199440A
公开(公告)日：1989-08-10
申请号：JP2421988
申请日：1988-02-04
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SUZUKI TOMOHIKO , OKAMOTO IZUMI , NAKAMOTO SHINSUKE , MIHATA MASAYOSHI , HATADA KENZO
IPC分类号： H01L21/60 , H01L23/28
摘要： PURPOSE:To simplify a technique and to make it possible to press a plurality of pieces of all semiconductor elements simultaneously and uniformly by a method wherein, when a resin for fixing the semiconductor elements is thermally cured, a vacuum packaging device is used. CONSTITUTION:Curing of a resin 15 is conducted in a state that a semiconductor element 13 is fixed on a wiring board 11 provided with conductor wirings 12 with the resin 15 and moreover, electrodes 14 of the element 13 are pressure- welded on the wirings 12 of the board 11 and the above element 13 is pressed to the board 11 using the atmospheric pressure obtainable by a vacuum packaging 17. For example, a prescribed part of the board 11 is coated with the insulative resin 15, the electrodes 14 of the element 13 are made to coincide with the wirings 12 and the element 13 is pressed to the board 11 by a pressing tool 16. At this time, ultraviolet light 18 is irradiated from the top to cure and fix temporarily the resin 15 on the peripheral edge part of the element 13. In such a way, the board 11, on which a plurality of pieces of the elements 13 are temporarily fixed, is put in a vacuum bag 17, is vacuum-packaged to apply a pressure using the atmospheric pressure and is heated keeping the state intact to cure the whole resin 15.

28. 发明专利

JPH10321771A SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH10321771A
公开(公告)日：1998-12-04
申请号：JP12533497
申请日：1997-05-15
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： TAKATANI SHINJI , SUZUKI TOMOHIKO , IDA HIDEJI , KUROKAWA HIDEO
IPC分类号： H01L23/12 , H01L23/32 , H05K1/11 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To relieve mechanical stresses and facilitate mounting of solder balls by installing a semiconductor element connected with a conductor wiring, conductive material with which aperture holes are filled to be smaller than the thickness of an insulating film, and the solder balls connecting the conductive material and a mother board. SOLUTION: Aperture holes are formed in an insulating film 2, and a conductor wiring 3 is formed on the insulating film 2. The conductor wiring 3 and an electrode of a semiconductor element 1 are electrically and mechanically connected, and sealing is performed with a sealing resin 4 for protecting the connecting part of the conductor wiring 2 and the electrode. The aperture hole of the insulating film 2 is filled with a conductive material 5 to be smaller then the thickness of the insulating film 2. Solder balls 6 are mounted on the conductive material 5, and a semiconductor device and a mother board 7 are connected by reflow after the solder balls 6 have been aligned with a pattern of the mother board 7. As a result, the gap between the insulating film 2 and the mother board 7 can be held wide, and mechanical stresses or the like can be relaxed.

29. 发明专利

JPH0558660B2 失效
公开(公告)号：JPH0558660B2
公开(公告)日：1993-08-27
申请号：JP14047689
申请日：1989-06-01
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SUZUKI TOMOHIKO , OKAMOTO IZUMI , MIHATA MASAYOSHI , HATADA KENZO
IPC分类号： B41J2/335 , H01L21/60

30. 发明专利

JPH0519306B2 失效
公开(公告)号：JPH0519306B2
公开(公告)日：1993-03-16
申请号：JP2421988
申请日：1988-02-04
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SUZUKI TOMOHIKO , OKAMOTO IZUMI , NAKAMOTO SHINSUKE , MIHATA MASAYOSHI , HATADA KENZO
IPC分类号： H01L21/60 , H01L23/28

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