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    • 22. 发明专利
    • Heat discharge or chill discharge structure
    • 热排放或冷却排放结构
    • JPS59161697A
    • 1984-09-12
    • JP3557083
    • 1983-03-03
    • Nitto Electric Ind Co Ltd
    • KONISHI TOSHIHARUSHIMIZU YUKIOOKADA HIDEYUKI
    • F28F13/18
    • F28F13/18
    • PURPOSE:To discharge heat or chill efficiently by a method wherein a part of a heat conductive thin base plate is brought into direct contact with the surface of a heat generating body or a chill generating body so that the heat of a heat discharge or a chill discharge member is transmitted to the base plate in an efficient manner. CONSTITUTION:The heat discharge or the chill discharge body is formed of the heat conductive thin base plate, a bond layer 2 and a heat conductive section 3. In many cases, the heat conductive section 3 is formed before the heat discharge or the chill discharge member is applied to the heat generating or the chill generating body 4 but it may be formed after the application of the heat discharge or the chill discharge member. This heat discharge or the chill discharge structure is formed such that a part of the heat conductive thin base plate is made to be in level with the surface of the bond layer or to project slightly from the latter by bending, shaping or pressing so as to come into direct contact with the heat generating or the chill generating body so that the heat of the body 4 is transmitted to the base plate efficiently to thereby obtain a favorable heat discharge or a chill discharge effect.
    • 目的:通过将导热性薄基板的一部分与发热体或冷却发生体的表面直接接触的方法来有效地放热或冷却,使得放热或冷却的热量 排出构件以有效的方式传递到基板。 构成:散热或冷却放电体由导热薄基板,接合层2和导热部3形成。在许多情况下,导热部3在放热或冷却放电之前形成 构件被施加到发热体或冷却发生体4,但是可以在施加放热或冷却放电构件之后形成。 这种放热或冷却放电结构形成为使得导热性薄基板的一部分与接合层的表面平齐或通过弯曲,成形或压制稍微从其突出,以便 与发热体或冷却发生体直接接触,使得主体4的热量有效地传递到基板,从而获得良好的放热或冷却放电效果。