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    • 23. 发明专利
    • SEPERCONDUCTIVE COIL
    • JPS62295404A
    • 1987-12-22
    • JP14312387
    • 1987-06-10
    • HITACHI LTD
    • OGATA HISANAONEMOTO TAKEOSASAKI SHIGEYUKISHIRAKU YOSHINORI
    • H01F6/06
    • PURPOSE:To enhance the density of a current in a superconductive coil by stacking a plurality of plates in which superconductive films are formed in a coil shape on an electrically insulating substrate in many stages, and electrically connecting among plates. CONSTITUTION:An electrically insulating substrate la is made of a polyimide resin film or ceramics, such as alumina or silicon carbide. Since the ceramic substrate has a large thermal conductivity even at low temperature, the substrate has a role as a heat sink plate. The substrate 1 is formed in thickness of 0.05-1mm, a spiral superconductive film 2 is deposited of plated on one side surface to form the film on the whole surface, and an unnecessary part is removed by etching. Grooves 3 of 0.02-0.5mm thick is formed in a latticelike state on the rear surface of the substrate 1 as a passage of liquid helium or evaporated helium gas of refrigerant. Similar substrates 1b-1n are stacked and clamped with bolts 5 and nuts 6. After the substrates are alternately connected therebetween by inner and outer peripheral side terminals 7a, 8a, the entirety is then heattreated as required. Thus, a superconductive coil having small size and high current density can be obtained.