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21. 发明专利

JPH07221140A BONDING BONDED STRUCTURE 失效
公开(公告)号：JPH07221140A
公开(公告)日：1995-08-18
申请号：JP2497594
申请日：1994-01-28
申请人： HITACHI LTD
发明人： KATO MITSUO , KAJIWARA RYOICHI , TAKAHASHI KAZUYA , TAKAHASHI TOSHIYUKI , MARUTA MINORU , WATABE KENJIRO , YOSHIMATSU TOSHIKANE
IPC分类号： H01L21/607 , H01L21/60
摘要： PURPOSE:To provide a wedge bonding bonded structure, wherein the generation of a bond defect, such as a peeling of an interface or a neck breaking of a wire, is prevented and the strength of the neck of a bonded part is improved. CONSTITUTION:A bonded structure of a bonded part connected with a lead wire or a wire by a wedge bonding method, wherein a plurality of regions 3a and 3b, which have different wire deformation rates, are provided in the longitudinal direction of the wire 1 on the bonded part and the region 3b having the wire deformation rate smaller than that of the region 3a having the largest wire deformation rate in the bonded part is arranged in at least either of regions closest to the side of the wire on the bonded part. Or a projected part region having the smallest wire deformation rate in the bonded part may be provided in the region having the largest wire deformation rate in the bonded part or between the region having the largest wire deformation rate in the bonded part and a region having a small wire deformation rate in the bonded part.

22. 发明专利

JPH0739037A METHOD AND APPARATUS FOR REMOVAL OF COATING OF INSULATED AND COATED METAL WIRE 失效
公开(公告)号：JPH0739037A
公开(公告)日：1995-02-07
申请号：JP18274893
申请日：1993-07-23
申请人： HITACHI LTD
发明人： KATO MITSUO , KAJIWARA RYOICHI , TAKAHASHI KAZUYA , TAKAHASHI TOSHIYUKI , MARUTA MINORU , WATABE KENJIRO , YOSHIMATSU TOSHIKANE
IPC分类号： B23H1/04 , B23K9/013 , B23K9/09 , H02G1/12
摘要： PURPOSE:To detect the generation of the removal defect of a coating by judging whether the removal of the coating is good or not on the basis of the measured result of the number of applications of a pulse voltage in a metal-exposed-part formation process and a coating peeling process. CONSTITUTION:A pulse voltage is applied across discharging electrodes 1, 2 by an arc- discharge power supply 4, an arc discharge is generated, and the measurement of the number of applications of the pulse voltage is started by a pulse-voltage-number-of-applications measuring device 5. Then, a current which flows in the peeling of a coating is detected by a current measuring device 6, and the arc discharge and the measurement are stopped at a point of time at which a metal exposed part is formed on an insulated and coated metal wire 3. When the number of applications of the pulse voltage is within a range of the set number of applications, a control device 7 judges that the metal wire is a good produce, and it displays this result on a display device 8. Then, both electrodes 1, 2 are moved by an electrode movement device 10, and a pulse voltage is applied across the electrode 1 and the medal wire 3. When the number of applications of the pulse voltage until an arc discharge is short- circuited and erased is within a range of the set number of applications, the medal wire is judged to be a good product, and a next working process is started.

23. 发明专利

JPH0714937A MANUFACTURE OF RESIN PACKAGE TYPE SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH0714937A
公开(公告)日：1995-01-17
申请号：JP15482493
申请日：1993-06-25
申请人： HITACHI LTD
发明人： NAKAJO TAKUYA , HIGUCHI AKIRA , ARAI KATSUO , SATO YUJI , OGASAWARA JUNYA , TAKAHASHI KAZUYA , FUNATSU KATSUHIKO
IPC分类号： H01L21/60 , H01L23/02 , H01L23/04 , H01L23/08
摘要： PURPOSE:To provide a technology for using a semiconductor device of a resin package as a high frequency semiconductor device. CONSTITUTION:A sheet-like resin 1 is impregnated with a glass fiber, and on one surface of the resin 1, a conductive film is coated, thus a lead 2 is formed, and then the resin 1 is bent so that, through a bump 4, inside terminals of leads 2 and bonding pads on a semiconductor pellet 3 are bonded together, and outside terminals of leads 2 are implemented on terminals on a wiring substrate.

24. 发明专利

JPH0635788A READ MODIFY WRITE PROCESSING METHOD AND ARITHMETIC PROCESSOR 失效
公开(公告)号：JPH0635788A
公开(公告)日：1994-02-10
申请号：JP18523792
申请日：1992-07-13
申请人： HITACHI LTD
发明人： TAKAHASHI KAZUYA , TAKENAGA HIROSHI , KOBAYASHI YOSHIKI
IPC分类号： G06T1/20 , G06F12/00 , G06T1/60 , G06F15/64 , G06F15/66
摘要： PURPOSE:To make it possible to rapidly perform an initialization regardless of the number of words of a memory by deciding whether an access is performed for each word of a RAM at first or not and making an initial value or data be selected based on the output. CONSTITUTION:An initial access decision means 4 corresponds to each word of a RAM having an arithmetic part 6 and decides the two states of an unaccess and an existing access. It becomes the unaccess state by a control signal 13 operated by a processor 2 and become to be in the existing access state because data is written in a corresponded word. The output of an initial access decision means 4 is inputted as a selection signal 15 in a data selecting means 5. The data selecting means 5 is controlled by the selection signal 15, selects an initial value 14 when the word for which an access is performed has never been written and data 16 when the word has been already written, as data 17 to be calculated, and outputs them to the arithmetic part 6. Thus, the initialization by a write operation for every word becomes unnecessary.

25. 发明专利

JPH05206224A ULTRASONIC JOINING EQUIPMENT AND QUALITY MONITORING METHOD 失效
公开(公告)号：JPH05206224A
公开(公告)日：1993-08-13
申请号：JP1074092
申请日：1992-01-24
申请人： HITACHI LTD
发明人： KAJIWARA RYOICHI , KATO MITSUO , TAKAHASHI KAZUYA , MARUTA MINORU , SEDOU TOKIYUKI , TSUBOSAKI KUNIHIRO
IPC分类号： H01L21/607 , B23K20/10 , H01L21/60
摘要： PURPOSE:To realize superior ultrasonic junction having constant junction quality wherein, when interposing objects like coating material and an oxide film which hinder the junction exist, or when material to be joined is insufficiently fixed, the junction progress state is monitored, and the junction condition is controlled in the optimum state. CONSTITUTION:The title equipment is provided with the following; a junction system constituted of an ultrasonic wave control equipment and a junction head, a vibration monitoring system constituted of a laser oscillator 8, a laser optical system and a vibrometer 7, and mechanism which feeds back monitored results to the junction condition. Thereby ultrasonic wave vibration change at the tool tip, or relative vibration change between a tool and a work and between one work and the other work can be accurately measured, so that the junction state can be accurately judged, and superior junction can always obtained by applying feedback to the junction condition.

26. 发明专利

JPH04359529A RESIN-SEALED SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH04359529A
公开(公告)日：1992-12-11
申请号：JP13487791
申请日：1991-06-06
申请人： HITACHI LTD , HITACHI TOBU SEMICONDUCTOR LTD
发明人： HATORI KAZUO , ARAKI ISAO , SHIMIZU KAZUO , OKADA SUMIO , DANNO TADATOSHI , TAKAHASHI KAZUYA
IPC分类号： H01L21/60 , H01L23/29 , H01L23/31 , H01L29/06
摘要： PURPOSE:To achieve the small size and the light weight of a resin-sealed semiconductor device. CONSTITUTION:In a resin-sealed semiconductor device 1, respective external terminals 2J for a semiconductor pellet 2 and respective inner leads 3B are connected electrically via an anisotropically conductive film 3 and through its conductive substance. In the resin-sealed semiconductor device 1, recessed parts 2B are constituted in the rear of the semiconductor pellet 2, and one part of a resin-sealed body 5 is buried to the inside of the recessed parts 2B.

27. 发明专利

JPS6353755A MAGNETIC DISK REPRODUCING DEVICE 失效
公开(公告)号：JPS6353755A
公开(公告)日：1988-03-08
申请号：JP19710786
申请日：1986-08-25
申请人： HITACHI LTD
发明人： TAKAHASHI KAZUYA
IPC分类号： G11B19/02
摘要： PURPOSE:To realize a timer forwarding system with good operability, by performing the temporary stop, and the releasing of timer forwarding alternately, by operating an ordinary reproduction command switch repeatedly, during the reproduction of the timer forwarding. CONSTITUTION:At time of an ordinary reproduction (a timer forwarding reproduction selecting switch 14 is opened), a signal from a reproduction switch 13 is added on a control circuit 9 through an AND circuit 16, then a mode goes to an ordinary reproduction mode, but at the time of selecting the timer forwarding (the switch 14 is closed), the signal from the reproduction switch 13 is added on the control circuit 9 through a flip-flop F/F15, and an AND circuit 18. And since the F/F15 is inverted at everytime of operation, the signal added on the control circuit 9 is inverted, thereby, the timer forwarding,and the temporary stop, are repeated alternately. In this way, the function of the timer forwarding is more highly improved, and operability can be improved because it is possible to perform the temporary stop, or the releasing of the timer forwarding freely in forwarding.

28. 发明专利

JPS62140448A INTEGRATED CIRCUIT DEVICE 失效
公开(公告)号：JPS62140448A
公开(公告)日：1987-06-24
申请号：JP28096085
申请日：1985-12-16
申请人： HITACHI LTD
发明人： FUNAMOTO TAKAO , KAJIWARA RYOICHI , KATO MITSUO , MATSUZAKA KYO , SHIDA TOMOHIKO , WACHI HIROSHI , TAKAHASHI KAZUYA , WATABE MASATOSHI , YAMADA MINORU , NAKANISHI KEIICHIRO , SUGAWARA TOSHIO
IPC分类号： H01L23/36 , H01L23/538 , H05K1/02 , H05K1/03
摘要： PURPOSE:To improve the heat dissipation properties of a power substrate, and to enable mounting with high density of an integrated circuit device by forming the power substrate in structure, in which conductor layers for feed and electric insulating layers are superposed alternately and unified, and providing at least one of the conductor layers for feed and the electric insulating layers with a heat dissipating means. CONSTITUTION:A power substrate 5 is constituted by alternately laminating and unifying electric insulating layers 6 and conductor layers 7 for feed. Power is supplied to integrated circuit chips 1 through input/output terminal pins 4 for a wiring substrate 2 from the conductor layers 7 for feed for the power substrate 5. The power substrate 5 has internal heat-dissipation structure. When powder or short fibrous fillers 10 are introduced into the electric insulating layers 6 as a heat dissipating means, an organic resin such as epoxy resin and ceramic powder such as alumina are mixed and molded to a board, and the grain size of powder is brought to the thickness or less of the electric insulating layers. The diameters of fiber are also brought to the thickness or less of the electric insulating layers naturally. The electric insulating layers 6 may be approximately 100-300mum thick, and the conductor layers 7 for feed may be approximately 200-400mum thick.

29. 发明专利

JPS6229151A COOLING MODULE FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS6229151A
公开(公告)日：1987-02-07
申请号：JP16758485
申请日：1985-07-31
申请人： HITACHI LTD
发明人： KAJIWARA RYOICHI , FUNAMOTO TAKAO , KATO MITSUO , SHIDA TOMOHIKO , MATSUZAKA KYO , OKAMURA HISANOBU , WACHI HIROSHI , TAKAHASHI KAZUYA
IPC分类号： H01L23/473 , H01L23/433
摘要： PURPOSE:To obtain a junction structure wherein heat stress at junction is decreased and heat conduction efficiency is increased for the realization of a product with excellent cooling efficiency and long-term reliability by a method wherein a plate of composite material composed of carbon fiber and Cu or carbon fiber and Al is inserted between a metal-made heat exchanger and SiC ceramic structure. CONSTITUTION:Semiconductor chips 26 installed on a multi-layer wiring board 30 are respectively cooled by cooling water. A cooling module is constituted of a housing 22, ducts 32 and 33, respectively for supply and discharge of cooling water, accommodated in the housing 22, cooling blocks 34 whereto the semiconductor chips 26 are directly soldered, and flexible bellows 21 hermetically linking the housing 22 and cooling blocks 34. A cooling block 34 includes a metal block 16 incorporating numerous pores for the cooling water to flow through. On the side of the metal block 16b facing a semiconductor chip 26, a dielectric, heat-conducting SiC ceramic structure 18 is installed, with the intermediary of a composite material 17 of carbon fiber and copper or of carbon fiber and aluminum. This design improves the heat exchanging efficiency between a cooling block heat exchanger and cooling water. A highly reliable direct junction is realized because of the stress moderator capable of excellent heat conduction inserted between the dielectric SiC ceramic structure and the metal-made heat exchanger.

30. 发明专利

JPS61230345A COOLING MODULE FOR SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPS61230345A
公开(公告)日：1986-10-14
申请号：JP7178785
申请日：1985-04-04
申请人： HITACHI LTD
发明人： KAJIWARA RYOICHI , FUNAMOTO TAKAO , KATO MITSUO , SHIDA TOMOHIKO , MATSUZAKA KYO , OKAMURA HISANOBU , WACHI HIROSHI , TAKAHASHI KAZUYA
IPC分类号： H01L23/473 , H01L23/433
摘要： PURPOSE:To improve cooling efficiency by forming a cooling block by SiC ceramics and a metallic layer joined with the SiC ceramics on the semiconductor chip side and constituting a path for water-cooling the metallic layer by the aggregate of fine holes. CONSTITUTION:A cooling block 5 is not constituted by a material only of SiC ceramics 2 in consideration of the facility of machining in which a water-cooling path is formed to the cooling block 5, and a heat exchanger 1 consisting of a substance such as Cu is combined. The water-cooling path is shaped as the aggregate of fine holes in order to improve heat exchanger effectiveness in the heat exchanger 1 and a contact area with water is increased. Accordingly, cooling efficiency can be enhanced largely.

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