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21. 发明专利

JP2013258371A Semiconductor package and manufacturing method of the same 有权
标题翻译：半导体封装及其制造方法
公开(公告)号：JP2013258371A
公开(公告)日：2013-12-26
申请号：JP2012134927
申请日：2012-06-14
申请人： Fuji Mach Mfg Co Ltd , 富士機械製造株式会社
发明人： KAWAJIRI AKIHIRO , FUJITA MASATOSHI , SUZUKI MASATO , TSUKADA KENJI , SUGIYAMA KAZUHIRO , HASHIMOTO YOSHITAKA
IPC分类号： H01L33/62
摘要： PROBLEM TO BE SOLVED: To reduce a defect rate of a light-emitting element package.SOLUTION: A manufacturing method of a mounting member 10 for implementing a vertical electrode light-emitting element 20 comprises: forming a lower electrode 15 on an element implementation part 14 at a bottom face of a cavity 12 and forming an upper electrode 16 on a top face of an outside part of the cavity 12 (a part formed higher than the element implementation part 14); implementing an undersurface of the light-emitting element 20 on the element implementation part 14 to connect an electrode 22 on an undersurface of the light-emitting element 20 with the lower electrode 15 of the element implementation part 14; filling a gap in the cavity 12 between the light-emitting element 20 and the upper electrode 16 of the mounting member 10 with a transparent insulation material 24; forming wiring 25 for connecting an electrode 21 on a top face of the light-emitting element 20 and the upper electrode 16 of the mounting member 10 by thin film or thick film deposition or attachment of a conductive member, across the insulation material 24; and encapsulating the light-emitting element 20 and the wiring 25 by molding an upper part of the mounting member 10 with a transparent insulating encapsulation material 26.
摘要翻译：要解决的问题：降低发光元件封装的缺陷率。解决方案：用于实施垂直电极发光元件20的安装构件10的制造方法包括：在元件实施部件上形成下电极15 14，并且在空腔12的外部的顶面上形成上部电极16（形成为高于元件实施部14的部分）的空腔12的底面; 在元件实施部14上实施发光元件20的下表面，以将发光元件20的下表面上的电极22与元件实施部14的下电极15连接; 用透明绝缘材料24填充安装构件10的发光元件20和上电极16之间的空腔12中的间隙; 形成布线25，用于通过薄膜或厚膜沉积或导电构件的安装，在绝缘材料24上连接发光元件20的顶面上的电极21和安装构件10的上电极16; 并且通过用透明绝缘包封材料26模制安装构件10的上部来封装发光元件20和布线25。

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