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21. 发明专利

JPH06299061A THERMOPLASTIC RESIN COMPOSITION 失效
公开(公告)号：JPH06299061A
公开(公告)日：1994-10-25
申请号：JP11239693
申请日：1993-04-16
申请人： CITIZEN WATCH CO LTD
发明人： TERAJIMA KAZUHIKO
IPC分类号： C08K5/00 , C08K5/15 , C08K5/1515 , C08K5/36 , C08K5/42 , C08L69/00
摘要： PURPOSE:To obtain a thermoplastic resin composition having excellent antistatic properties and does not cause corrosion, etc., of a metallic part at the area of contact even when used in combination with that part by mixing a specified amount of an anionic surfactant with a specified amount of an epoxy compound and an aromatic polycarbonate resin. CONSTITUTION:The composition comprises 0.01-20.0wt.%, based on the whole composition, anionic surfactant (e.g. sodium lauryl sulfate), 0.01-20.0wt.%, based on the whole composition, epoxy compound (e.g. bisphenol A epoxy resin) and an aromatic polycarbonate resin (e.g. bisphenol A polycarbonate resin).

22. 发明专利

JP2003100792A METHOD FOR FORMING PROTRUSION ELECTRODE 审中-公开
公开(公告)号：JP2003100792A
公开(公告)日：2003-04-04
申请号：JP2001295249
申请日：2001-09-27
申请人： CITIZEN WATCH CO LTD
发明人： TERAJIMA KAZUHIKO
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To solve the problem that variations in height of protrusion electrodes occurs, by displacement of a screen mask or by attachment of a brazing material to the mask, when forming protrusion electrodes having electrode intervals of a semiconductor substrate or a circuit substrate which are made fine by screen printing. SOLUTION: Thick film photosensitive resin to cover pad electrodes is coated on the surface of the substrate so that a film thickness is nearly uniform. Then, by a photo lithography method, a thick film photosensitive resin pattern is formed which makes exposing holes to surfaces of the pad electrodes have the same volumes, and also makes areas of the pad electrodes exposed in the exposing holes equal. Further, the exposed holes are fully filled with a paste form brazing material up to their edges by the screen printing method. Next, the brazing material is melted, so that at least top edges of the material become round to form protrusion electrodes, and the thick film photosensitive resin pattern is removed.

23. 发明专利

JP2002151533A SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD 失效
公开(公告)号：JP2002151533A
公开(公告)日：2002-05-24
申请号：JP2000340048
申请日：2000-11-08
申请人： CITIZEN WATCH CO LTD
发明人： TERAJIMA KAZUHIKO
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To solve a problem that since a prior art bump electrode is made of a rigid mass of metal, electrical connection is difficult between a low profile bump electrode and a counter electrode to cause decrease of mounting yield or significant damage to reliability. SOLUTION: In the inventive semiconductor device, the main component of a bump electrode, i.e., a bump part, is composed of a resin composition. Even if a level difference is present between respective bump electrodes at the time of mounting on an opposite substrate, a higher bump electrode collapses to allow sufficient electrical connection between a lower bump electrode and the opposite substrate. Since they can be compressed with a low pressure, yield is prevented from decreasing due to the damage to the substrate or a semiconductor integrated circuit and reliability is not damaged significantly.

24. 发明专利

JP2002043346A METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 失效
公开(公告)号：JP2002043346A
公开(公告)日：2002-02-08
申请号：JP2000220118
申请日：2000-07-21
申请人： CITIZEN WATCH CO LTD
发明人： TERAJIMA KAZUHIKO
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To solve problems that damage is caused due to arc discharge when a common electrode film for forming a protruding electrode by electroplating is formed by sputtering, and that, since the number of wafers to be treated in the sputtering process is limited to one, a long time is required for the protruding electrode forming process which degrades production efficiency significantly. SOLUTION: In the method of manufacturing a semiconductor device, the entire front surface of a wafer is subjected to activation and then a common electrode film is formed by electroless plating. Accordingly, there is no problem of arc discharge caused when the common electrode film is formed by sputtering. Thus, active elements on an IC chip are not damaged, and hence there is no serious difficulty that active elements on an IC chip do not function or the like.

25. 发明专利

JP2001308126A METHOD FOR MANUFACTURING SOLDER TERMINALS 失效
公开(公告)号：JP2001308126A
公开(公告)日：2001-11-02
申请号：JP2000121970
申请日：2000-04-24
申请人： CITIZEN WATCH CO LTD
发明人： TERAJIMA KAZUHIKO
IPC分类号： H05K3/34 , H01L21/60 , H01L23/12
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing solder terminals which can form the solder terminals with leadless solder also on an element or a wiring board having steps at a high connection reliability, without short-circuiting fine electrodes. SOLUTION: The method comprises a step of applying flux on the entire surface or a part of a substrate including pad electrodes, step of depositing solder grains onto the flux, step of melting the solder grains to form solder terminals on the pad electrodes, and step of removing the flux and solder remaining other parts than the pad electrodes.

26. 发明专利

JPH11121516A CONDUCTIVE ADHESIVE COMPOSITION 失效
公开(公告)号：JPH11121516A
公开(公告)日：1999-04-30
申请号：JP28674597
申请日：1997-10-20
申请人： CITIZEN WATCH CO LTD
发明人： TERAJIMA KAZUHIKO
IPC分类号： H01L21/60 , H05K3/32
摘要： PROBLEM TO BE SOLVED: To provide a conductive adhesive composition, through which there are no short-circuits between adjacent electrodes and thus stable electrical connections between projecting electrodes and electrodes on a substrate can be obtained, and through which a semiconductor integrated circuit chip having electrodes arranged at fine intervals can be mounted. SOLUTION: This conductive adhesive composition is used to electrically connect projecting electrodes 3 provided on the active element surface of a semiconductor integrated circuit chip 1 to electrodes 4 provided on a board, on which the chip 1 is mounted. The tap density of a blended conductive powder for imparting conductivity to adhesive resin ranges from 3.8 g/cc to 6.0 g/cc, and moreover the surface tension of liquid into which the conductive powder is immersed ranges 28 dyne/cm or higher to 60 dyne/cm or lower.

27. 发明专利

JPH07173325A ANTISTATIC RESIN COMPOSITION 失效
公开(公告)号：JPH07173325A
公开(公告)日：1995-07-11
申请号：JP31839093
申请日：1993-12-17
申请人： CITIZEN WATCH CO LTD
发明人： TERAJIMA KAZUHIKO
IPC分类号： C08K3/04 , C08K3/02 , C08K9/02 , C08L101/00
摘要： PURPOSE:To obtain a composition having its surface resistant rate controlled within a specific range with a high accuracy, and excellent antistatic and insulat ing properties, by combining a carbon type electric conductive filler and a specific non carbon type electric conductive filler with an organic high polymer material. CONSTITUTION:This composition is prepared by combining an electric conductive filler composed of at least one kind of carbon type electric conductive filler (preferably a porous carbon black having a large surface area) and at least one kind of non carbon type electric conductive filler having a volume resistance rate of 0.5-10 OMEGAcm (e.g. tin oxide, antimony oxide, etc.), with an organic high polymer material such as PS, PE, polyethylene terephthalate, etc.

28. 发明专利

JP2003263619A STORAGE MEDIUM HAVING DISPLAY FUNCTION 审中-公开
公开(公告)号：JP2003263619A
公开(公告)日：2003-09-19
申请号：JP2002064601
申请日：2002-03-11
申请人： CITIZEN WATCH CO LTD
发明人： TAJIMA EIICHI , TERAJIMA KAZUHIKO
IPC分类号： B42D15/10 , G02F1/13 , G02F1/1334 , G06K19/07 , G06K19/077 , G09F9/00 , G09F9/35
摘要： PROBLEM TO BE SOLVED: To provide a thin and light storage medium with excellent impact- resistivity where a conventional storage medium is equipped with a liquid crystal display part having an additional function. SOLUTION: This storage medium is configured to have a liquid crystal display part where a polymer network type liquid crystal panel whose at least one side is made of plastic is disposed and an IC mounted part where an IC chip including a driver IC for driving the liquid crystal panel and a data readable/writable IC memory is mounted on the back face of the liquid crystal display part. COPYRIGHT: (C)2003,JPO

29. 发明专利

JPH10256304A MANUFACTURE OF SEMICONDUCTOR DEVICE 失效
公开(公告)号：JPH10256304A
公开(公告)日：1998-09-25
申请号：JP5286597
申请日：1997-03-07
申请人： CITIZEN WATCH CO LTD
发明人： TERAJIMA KAZUHIKO
IPC分类号： H01L21/60
摘要： PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device wherein large-sized semiconductor integrated circuit chips can be mounted without breakage of a conductive bonding agent layer and without separation of the layer from a substrate electrode in the course of curing a conductive bonding agent. SOLUTION: After a conductive bonding agent 5 having rubbery elasticity is cured, if a shearing stress is imposed thereon caused by the difference of the thermal expansion coefficient between a semiconductor integrated circuit chip 1 and an insulating substrate 2 as they are cooling, no separation or breakage of the bonding agent layer is induced because the conductive bonding agent 5 relaxes the shearing stress. Further, since the conductive bonding agent 5 does not prevent a longitudinal stress caused by adoption of a sealing resin having a great degree of shrinkage on curing, projecting electrodes 3 and substrate electrodes 4 are mechanically contacted through conductive particles in the conductive bonding agent 5 to ensure excellent electrical connection.

30. 发明专利

JPH06293863A METHOD FOR TREATING SURFANCE OF INORFANIC FILLER, INORGANIC FILLER AND COMPOSITE MATERIAL 失效
公开(公告)号：JPH06293863A
公开(公告)日：1994-10-21
申请号：JP10622393
申请日：1993-04-08
申请人： CITIZEN WATCH CO LTD
发明人： TERAJIMA KAZUHIKO
IPC分类号： C09C3/08
摘要： PURPOSE:To carry out the surface treatment in which interacting properties of an inorganic filler useful as a plastic additive with a plastic and preservation stability are improved by treating the inorganic filler with an isocyanate, then adding a blocking agent thereto and blocking the unreacted isocyanate groups. CONSTITUTION:The surface treatment of an inorganic filler is carried out by mixing (A) the inorganic filler having hydroxyl groups with (B) a diisocyanate compound, reacting the hydroxyl groups in the component (A) with the isocyanate groups in the component (B) and adding (C) a blocking agent to the resultant reactional mixture. Furthermore, the component (B) employed for the surface treatment is preferably used in an amount of 0.01-20wt.% based on the component (A) and the component (C) is preferably a phenolic compound, an alcoholic compound, an active methylene compound or a mercaptan-based compound.

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