专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

21. 发明专利

JP2013038291A Chip component structure and manufacturing method of the same 有权
标题翻译：芯片组件结构及其制造方法
公开(公告)号：JP2013038291A
公开(公告)日：2013-02-21
申请号：JP2011174500
申请日：2011-08-10
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HATTORI KAZUO , FUJIMOTO TSUTOMU
IPC分类号： H01G2/06
CPC分类号： H01G4/232 , H01G2/065 , H01G4/12 , H01L23/13 , H01L23/49805 , H01L28/40 , H01L2924/0002 , H05K1/181 , H05K3/3442 , H05K2201/049 , H05K2201/09181 , H05K2201/099 , H05K2201/10015 , Y02P70/613 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a chip component structure which enables easy structural design and mounting and has mounting strength and electric characteristics that are equivalent to conventional and general mounting structures, and to provide a manufacturing method of the chip component structure.SOLUTION: A multilayer ceramic capacitor 20 has a structure formed by laminating a predetermined number of tabular internal electrodes 200. An interposer 30 includes a substrate 31 larger than an outer shape of the multilayer ceramic capacitor 20. First surface electrodes 321, 331 for mounting the multilayer ceramic capacitor 20 are formed on a first main surface of a substrate 31, and first rear surface electrodes 322, 332 for connecting with an external circuit board 90 are formed on a second main surface. A recessed part 310 is formed on a side surface of the interposer 30, and a connection conductor 343 is formed on a wall surface of the recessed part 310. Resist films 321A, 331A are formed on the surface of the substrate 31 so as to be arranged along edge parts.
摘要翻译：要解决的问题：提供一种能够容易地进行结构设计和安装的具有等同于常规和一般安装结构的安装强度和电气特性的芯片部件结构，并且提供了芯片部件结构的制造方法。解决方案：多层陶瓷电容器20具有通过层叠预定数量的片状内部电极200而形成的结构。插入件30包括比多层陶瓷电容器20的外形大的基板31.第一表面电极321,331 用于安装多层陶瓷电容器20形成在基板31的第一主表面上，并且用于与外部电路板90连接的第一后表面电极322,332形成在第二主表面上。凹陷部分310形成在插入件30的侧表面上，并且连接导体343形成在凹陷部分310的壁表面上。抗蚀剂膜321A，331A形成在基板31的表面上，以便是沿边缘部分排列。版权所有（C）2013，JPO＆INPIT

22. 发明专利

JP2009194096A Component built-in substrate and component package using the same 审中-公开
标题翻译：组件内置基板和使用其的组件封装
公开(公告)号：JP2009194096A
公开(公告)日：2009-08-27
申请号：JP2008032117
申请日：2008-02-13
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HATTORI KAZUO , FUJIMOTO TSUTOMU , KUROIWA SHINICHIRO , NODA SATORU
IPC分类号： H05K3/46
CPC分类号： H05K1/0231 , H01G4/224 , H01G4/228 , H01G4/232 , H05K1/185 , H05K2201/10636 , Y02P70/611
摘要： PROBLEM TO BE SOLVED: To provide a component built-in substrate capable of enhancing high-frequency responding performance and high-frequency noise absorbing performance, and a component package using the same. SOLUTION: This component built-in substrate is a substrate which has a built-in chip capacitor having a ceramic laminate and a plurality of terminal electrodes and has a first main face 23a and a second main face 23b. A terminal electrode 13a and a terminal electrode 14a are electrically connected with each other through an internal electrode 12a. Furthermore, between terminal electrodes 13a and 13b among first terminal electrodes, a capacity is formed through a dielectric layer 11, and between terminal electrodes 14a and 14b among second terminal electrodes, a capacity is formed through a dielectric layer 11. Then, the laminating direction of the internal electrode 12a, 12b is parallel to the main faces 23a, 23b of the component built-in substrate. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够提高高频响应性能和高频噪声吸收性能的部件内置基板，以及使用其的部件封装。该组件内置基板是具有陶瓷层叠体和多个端子电极的内置片状电容器的基板，具有第一主面23a和第二主面23b。端子电极13a和端子电极14a通过内部电极12a彼此电连接。此外，在第一端子电极之间的端子电极13a和13b之间，通过电介质层11形成电容，并且在第二端子电极中的端子电极14a和14b之间形成通过电介质层11的电容。然后，层叠方向内部电极12a，12b平行于部件内置基板的主面23a，23b。版权所有（C）2009，JPO＆INPIT

23. 发明专利

JP2014057046A Mounting land structure, and mounting structure of laminated capacitor 有权
标题翻译：安装土地结构和层压电容器的安装结构
公开(公告)号：JP2014057046A
公开(公告)日：2014-03-27
申请号：JP2013101185
申请日：2013-05-13
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HATTORI KAZUO , FUJIMOTO TSUTOMU
IPC分类号： H01G2/06 , H05K1/18 , H05K3/34
CPC分类号： H05K1/181 , H01G2/065 , H01G4/12 , H01G4/232 , H01G4/30 , H05K1/111 , H05K3/3442 , H05K2201/09381 , H05K2201/10015 , H05K2201/10636 , H05K2201/2036 , H05K2201/2045 , Y02P70/611 , Y02P70/613
摘要： PROBLEM TO BE SOLVED: To provide a mounting land structure, and a mounting structure of a laminated capacitor, which are capable of reducing vibration noise by suppressing transmission of mechanical distortion generated in a mounted electronic component.SOLUTION: There are land patterns 10, 20 formed to be joined to external electrodes 51, 52 of a laminated ceramic capacitor 5. The land patterns 10, 20 respectively have: first conductive patterns 11, 21 and second conductive patterns 12, 22, which are formed separately in the width direction W; and third conductive patterns 13, 23 that connect the first conductive patterns 11, 21 to the second conductive patterns 12, 22. The first conductive patterns 11, 21 and the second conductive patterns 12, 22 have a portion to be joined to a first ridge line portion of the laminated ceramic capacitor 5 in which the external electrodes 51, 52 are provided. When the laminated ceramic capacitor 5 is mounted, the third conductive patterns 13, 22 are formed in a position that overlaps with the external electrodes 51, 52, as viewed from the height direction H.
摘要翻译：要解决的问题：提供一种通过抑制在安装的电子部件中产生的机械变形的传递而能够降低振动噪声的安装平台结构和层叠电容器的安装结构。解决方案：存在图案10,20 形成为与层叠陶瓷电容器5的外部电极51,52接合。焊盘图案10,20分别具有：在宽度方向W上分别形成的第一导电图案11,21和第二导电图案12,22; 以及将第一导电图案11,21连接到第二导电图案12,22的第三导电图案13,23。第一导电图案11,21和第二导电图案12,22具有要连接到第一导电图案12,22的部分设置有外部电极51,52的层叠陶瓷电容器5的线部分。当安装层叠陶瓷电容器5时，第三导电图案13,22形成为从高度方向H观察到的与外部电极51,52重叠的位置。

24. 发明专利

JP2014036170A Land structure of mounting board and vibration sound reduction method of mounting board 有权
标题翻译：安装板的土地结构和安装板的振动减振方法
公开(公告)号：JP2014036170A
公开(公告)日：2014-02-24
申请号：JP2012177639
申请日：2012-08-10
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HATTORI KAZUO , FUJIMOTO TSUTOMU
IPC分类号： H01G2/06 , H01G4/12 , H01G13/00
摘要： PROBLEM TO BE SOLVED: To obtain the land structure of a mounting board in which generation of vibration sound can be suppressed without using a separate component for mounting on the mounting board.SOLUTION: A mounting board 10 comprises: an insulating board 11; and land electrodes 12 and 13. The land electrodes 12 and 13 are disposed at substantially middle positions between both ends in the longitudinal direction, in a region where the element 21 of a multilayer capacitor 20 is disposed. Furthermore, the length LD of the land electrodes 12 and 13 in the longitudinal direction is about 0.2-0.5 times, preferably about 0.4 times, of the length LC in the longitudinal direction of a region where the element 21 is disposed. The multilayer capacitor 20 having a substantially rectangular parallelepiped shape, and having external electrodes 22 and 23 formed on the side face of the element 21 in the longitudinal direction is mounted on the mounting board 10 having such a shape.
摘要翻译：要解决的问题：为了获得可以抑制振动声的产生而不使用用于安装在安装板上的单独部件的安装板的平台结构。解决方案：安装板10包括：绝缘板11; 和焊盘电极12和13.在布置有层叠电容器20的元件21的区域中，焊盘电极12和13设置在纵向两端之间的大致中间位置。此外，焊盘电极12和13的长度方向的长度LD在元件21的区域的长度方向上的长度LC的大约为0.2-0.5倍，优选约0.4倍。具有大致长方体形状的层叠电容器20，具有形成在元件21的长边方向的侧面的外部电极22,23安装在具有这种形状的安装基板10上。

25. 发明专利

JP2013258240A Chip component structure 有权
标题翻译：芯片组件结构
公开(公告)号：JP2013258240A
公开(公告)日：2013-12-26
申请号：JP2012132793
申请日：2012-06-12
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HATTORI KAZUO , FUJIMOTO TSUTOMU
IPC分类号： H01G2/06 , H01G4/232 , H01G4/30
CPC分类号： H05K1/181 , H01G4/232 , H01G4/30 , H01G4/35 , H05K1/0216 , H05K1/141 , H05K3/1258 , H05K3/341 , H05K3/3442 , H05K2201/049 , H05K2201/09036 , H05K2201/09072 , H05K2201/09181 , H05K2201/10015 , H05K2201/10378 , H05K2201/10636 , H05K2201/10962 , H05K2201/10984 , H05K2201/2045 , Y02P70/611 , Y02P70/613
摘要： PROBLEM TO BE SOLVED: To inhibit the occurence of audible sounds in a circuit board which is caused by a multilayer capacitor and inhibit the equivalent series inductance.SOLUTION: A chip component structure 1 includes an interposer 3 on which a multilayer capacitor 2 is mounted. The interposer 3 includes: component connection electrodes 32A, 32B; external connection electrodes 33A, 33B; side surface electrodes 34A, 34B, and borehole electrodes 35A, 35B. The component connection electrodes 32A, 32B are electrically connected with the external connection electrodes 33A, 33B by the side surface electrodes 34A, 34B and the borehole electrodes 35A, 35B. An external electrode of the capacitor 2 is joined to the component connection electrodes 32A, 32B.
摘要翻译：要解决的问题：抑制由层叠电容器引起的电路板中的声音的发生，并抑制等效的串联电感。解决方案：芯片部件结构1包括安装有多层电容器2的插入件3。插入器3包括：部件连接电极32A，32B; 外部连接电极33A，33B; 侧面电极34A，34B和钻孔电极35A，35B。部件连接电极32A，32B通过侧面电极34A，34B和钻孔电极35A，35B与外部连接电极33A，33B电连接。电容器2的外部电极接合到部件连接电极32A，32B。

26. 发明专利

JP2012212943A Chip component structure 有权
标题翻译：芯片组件结构
公开(公告)号：JP2012212943A
公开(公告)日：2012-11-01
申请号：JP2012173742
申请日：2012-08-06
申请人： Murata Mfg Co Ltd , 株式会社村田製作所
发明人： HATTORI KAZUO , FUJIMOTO TSUTOMU
IPC分类号： H01G2/06 , H05K3/34
摘要： PROBLEM TO BE SOLVED: To realize a chip component structure which enables simple structure and easy mounting, has adequate mounting strength and electric characteristics, and suppresses the occurence of vibration sound.SOLUTION: A lamination ceramic capacitor 20 has a structure formed by laminating a predetermined number of plate like internal electrodes 200. An interposer 30 comprises an insulation substrate 31 wider than the outer shape of the lamination ceramic capacitor 20. Electrodes for first mounting 321 and 331 are formed on a first main surface of the insulation substrate 31 for mounting the lamination ceramic capacitor 20, and electrodes for first external connection 322 and 332 are formed on a second main surface for connecting with an external circuit board 90. The lamination ceramic capacitor 20 is mounted on the interposer 30 so that main surfaces of the internal electrodes 200 are arranged parallel to a main surface of the interposer 30, i.e., the first main surface and the second main surface of the insulation substrate 31.
摘要翻译：要解决的问题：为了实现结构简单，安装方便的芯片部件结构，具有足够的安装强度和电气特性，并且抑制振动声的发生。解决方案：层压陶瓷电容器20具有通过层叠预定数量的板状内部电极200而形成的结构。插入件30包括比层叠陶瓷电容器20的外部形状宽的绝缘基板31.电极用于第一安装 321和331形成在用于安装层压陶瓷电容器20的绝缘基板31的第一主表面上，并且用于第一外部连接322和332的电极形成在用于与外部电路板90连接的第二主表面上。层叠陶瓷电容器20安装在插入器30上，使得内部电极200的主表面平行于中介层30的主表面，即绝缘基板31的第一主表面和第二主表面布置。版权所有（C）2013，JPO＆INPIT

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式