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    • 21. 发明专利
    • ランプおよび照明器具
    • 灯和灯泡
    • JP2014220184A
    • 2014-11-20
    • JP2013100189
    • 2013-05-10
    • 東芝ライテック株式会社Toshiba Lighting & Technology Corp
    • KANDA AKIHIROROKUSHA YUSUKEOKADA MOTOKAZUYOSHIDA MASAHIKONAKAMURA TOSHIYUKIMURANO TAEKOSHIBANO NOBUO
    • F21V23/00F21S2/00H01H85/02H01H85/11
    • Y02B20/19
    • 【課題】溶断体の溶断時に高温溶融物の飛散が防止されるヒューズ抵抗器具備するランプおよびこのランプを装着する照明器具を提供する。【解決手段】ランプ1は、光源2と、一端側4aに口金20、他端側4bに光源2が設けられた外囲器4と、口金20を介して電力を入力して、光源2を点灯する点灯装置5と、一対の電極50,50、一対の電極50,50に接続されて一対の電極50,50間に設けられた溶断体40、溶断体40を電気絶縁して保護する絶縁体51および一対の電極50,50にそれぞれ接続された一対のリード線39a,39bを有する抵抗器本体47、抵抗器本体47を保護する保護体48、保護体48の両側48a,48bを塞ぐように保護体48内に設けられた電気絶縁性および耐熱性を有する充填体49,49を有し、口金20および点灯装置5に電気接続されたヒューズ抵抗器27と、を具備している。【選択図】図4
    • 要解决的问题:提供一种灯,其包括熔丝电阻器,通过该保险丝电阻器,在融合切割熔接体期间防止高温熔融材料的散射,并提供安装灯的照明器。解决方案:灯 1包括光源2,在一端侧4a具有基座20的封套4和另一端4b上的光源2,用于经由基座20输入电力以在光源2上点亮的照明装置5 以及由具有一对电极50,50的电阻体47构成的熔丝电阻27,与一对电极50,50连接并设置在一对电极50,50之间的熔融体40, 将绝缘体40电绝缘以保护它,以及分别与一对电极50,50连接的一对引线39a,39b,用于保护电阻体47的保护器48和具有电绝缘的填充物49,49,以及 耐热性,并在公元前提供 以便在两侧48a,48b处阻挡保护器48,并且电连接到基座20和照明装置5。
    • 22. 发明专利
    • Electric bulb type lamp and luminaire
    • 电灯泡类型和灯泡
    • JP2014003032A
    • 2014-01-09
    • JP2013178725
    • 2013-08-30
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • SAKAI MAKOTOSEGAWA MASAOSHIBANO NOBUONISHIMURA KIYOSHIOGAWA KOZOKAMATA MASAHIKOTANAKA TOSHIYA
    • F21S2/00F21Y101/02
    • PROBLEM TO BE SOLVED: To provide an electric bulb type lamp which can be improved in heat radiation although using a light emission module in a three-dimensional shape.SOLUTION: A light emission part 23 having an LED chip 35 is arranged on a top surface of a support part 21 in a three-dimensional shape to form a light emission module 13 in a three-dimensional shape. The light emission module 13 in the three-dimensional shape and a glove 14 enclosing light emission module 13 are provided at one end of a base body 12. A light-transmissive filler 15 is charged between the light emission module 13 in the three-dimensional shape and an inner surface of the glove 14 in contact with the light emission part 23 and support part 21. Heat that the LED chip 35 generates while lighting up is thermally conducted to the glove 14 through the filler 15 with efficiency to improve heat radiation from an outer surface of the glove 14.
    • 要解决的问题:提供一种电灯泡型灯,其可以使用三维形状的发光模块来改善散热。解决方案:具有LED芯片35的发光部23布置在顶表面 的三维形状的支撑部21,以形成三维形状的发光模块13。 三维形状的发光模块13和封闭发光模块13的手套14设置在基体12的一端。透光填充物15以三维形式被填充在发光模块13之间 形状和与发光部23和支撑部21接触的手套14的内表面。LED芯片35在点亮时产生的加热通过填料15热传导到手套14,以有效地改善来自 手套14的外表面。
    • 25. 发明专利
    • Lighting system
    • 照明系统
    • JP2009140716A
    • 2009-06-25
    • JP2007315038
    • 2007-12-05
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • NISHIMURA KIYOSHISANPEI TOMOHIROMATSUDA SHUHEIOTAKE HIROKAZUSHIBANO NOBUO
    • F21V29/02F21S2/00H01L23/34
    • F21V29/77F21S8/026F21V29/75F21V29/763F21Y2105/10F21Y2115/10H01L2224/48091H01L2224/73265H01L2924/00014
    • PROBLEM TO BE SOLVED: To provide a lighting system improved in performance of radiating heat generated from an LED sealed by a sealing member and reduced in height of protrusion from an attached part in its installed state. SOLUTION: A downlight (the lighting system) 1 includes a plurality of chip-type LEDs (semiconductor light emitting elements) 25, a device substrate 3, the sealing member 31 and a radiating member 41. The device substrate 3 has an element mounting board 4 on which the LEDs 25 are adhesively mounted. The LEDs 25 are sealed to form the sealing member 31. A heat-transfer part 18 conducting heat from the element mounting board 4 toward a front surface of the device substrate 3 is protruded from the element mounting board 4 toward the front surface. The radiating member 41 is thermally connected to the heat transfer part 18 and is disposed on the front surface side of the device substrate 3. At least part of the radiating member 41 is disposed outside the sealing member 31. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供一种照明系统,其改善了由密封构件密封的LED产生的散热的性能,并且在其安装状态下降低了与附接部件的突出高度。 解决方案:筒灯(照明系统)1包括多个芯片型LED(半导体发光元件)25,器件基板3,密封部件31和散热部件41.器件基板3具有 元件安装板4,其上粘附有LED 25。 LED25被密封以形成密封构件31.从元件安装板4向装置基板3的前表面传导热量的传热部18从元件安装板4向前表面突出。 散热构件41与传热部18热连接,并且设置在器件基板3的前表面侧。散热构件41的至少一部分设置在密封构件31的外侧。 )2009,JPO&INPIT
    • 26. 发明专利
    • Led lighting device and led substrate module
    • LED照明装置和LED基板模块
    • JP2009044012A
    • 2009-02-26
    • JP2007208605
    • 2007-08-09
    • Toshiba Lighting & Technology Corp東芝ライテック株式会社
    • SHIMIZU KEIICHIOTAKE HIROKAZUSHIBANO NOBUOHIRAOKA TOSHIYUKI
    • H01L33/00H05B37/02
    • PROBLEM TO BE SOLVED: To provide an LED lighting device and an LED substrate module which hardly receives an influence of drop of a voltage by an electric wire, and capable of controlling a lighting current that flows through each branch with desired current. SOLUTION: The present invention provides an LED lighting device including: a constant current source 20; a plurality of series circuits constituted of one or a plurality of LEDs 7 connected in series and a current control circuit for controlling a lighting current that flows through the LED 7 while being connected in parallel with the output terminal of the constant current source 20 respectively; a bias circuit 4 provided between an output terminal of the constant current source 20 and the current control circuit; and a pair of control terminals 6a, 6b connected to the bias circuit 4 that allows a reference voltage for driving the plurality of current control circuits to be generated between the terminals. COPYRIGHT: (C)2009,JPO&INPIT
    • 要解决的问题:提供几乎不受电线的电压下降的影响的LED照明装置和LED基板模块,并且能够以期望的电流控制流过每个分支的点亮电流。 解决方案:本发明提供一种LED照明装置,包括:恒流源20; 串联连接的一个或多个LED 7构成的多个串联电路和分别与恒流源20的输出端并联连接的,用于控制流过LED7的点亮电流的电流控制电路; 设置在恒流源20的输出端和电流控制电路之间的偏置电路4; 以及连接到偏置电路4的一对控制端子6a,6b,其允许在端子之间产生用于驱动多个电流控制电路的参考电压。 版权所有(C)2009,JPO&INPIT