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11. 发明专利

JP2009124714A Electromagnetically coupled interconnect system architecture 审中-公开
标题翻译：电磁耦合互联系统架构
公开(公告)号：JP2009124714A
公开(公告)日：2009-06-04
申请号：JP2008321499
申请日：2008-12-17
申请人： Formfactor Inc , フォームファクター, インコーポレイテッド
发明人： MILLER CHARLES A
IPC分类号： H04B5/02 , H01L25/04 , H01L25/18 , H04B5/00
CPC分类号： H04B5/0012 , H01L23/48 , H01L2924/0002 , H01L2924/3011 , H04B5/0075 , H04B5/02 , H05K1/141 , H05K1/181 , H05K3/366 , H05K2201/10098 , Y02P70/611 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide contactless and proximity connections small in signal distortion and attenuation between elements in an electronics system. SOLUTION: The electronics system includes a transmission line, and a plurality of electronic components each having an electromagnetic coupler. Data to be communicated between the elements in the electronics system are modulated into a carrier signal and transmitted contactlessly by electromagnetic coupling. The electromagnetic coupling may be present directly between the elements in the system or through an intermediary transmission medium. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供电子系统中元件之间的信号失真和衰减小的非接触式和接近连接。解决方案：电子系统包括传输线和多个电子部件，每个电子部件均具有电磁耦合器。要在电子系统中的元件之间通信的数据被调制成载波信号并通过电磁耦合非接触地传送。电磁耦合可以直接存在于系统中的元件之间或通过中间传输介质。版权所有（C）2009，JPO＆INPIT

12. 发明专利

JP2009123859A Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：JP2009123859A
公开(公告)日：2009-06-04
申请号：JP2007295203
申请日：2007-11-14
申请人： Onkyo Corp , オンキヨー株式会社
发明人： MINAGAWA ATSUSHI , SEKIYA MAMORU , UMETSU NORIO
IPC分类号： H01L23/36 , H05K7/20
CPC分类号： H01L23/4006 , H01L25/112 , H01L2023/4056 , H01L2924/0002 , H05K1/0203 , H05K1/14 , H05K3/301 , H05K3/366 , H05K2201/10166 , H05K2201/10409 , H05K2201/1056 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor device capable of being assembled by a method without increasing the numbers of parts and processes in the assembling for fixing a child substrate to a parent substrate.
SOLUTION: In this semiconductor device, a first heat generating element 3 to which a first radiating means 5 is attached is mounted on a parent substrate 1; a second heat generating element 4 to which a second radiating means 6 is attached is mounted on a child substrate 2; and the first radiating means 5 and the second radiating means 6 are fixed so that the parent substrate 1 and the child substrate 2 enter into a predetermined positional relation.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供能够通过方法进行组装的半导体器件，而不增加用于将子衬底固定到母基板的组装中的部件和工艺的数量。解决方案：在该半导体器件中，附着有第一辐射装置5的第一发热元件3安装在母基片1上; 安装有第二辐射装置6的第二发热元件4安装在儿童基底2上; 并且固定第一辐射装置5和第二辐射装置6，使得母基板1和子基板2进入预定的位置关系。版权所有（C）2009，JPO＆INPIT

13. 发明专利

JP2009058768A Display, and light emitting device 审中-公开
标题翻译：显示和发光装置
公开(公告)号：JP2009058768A
公开(公告)日：2009-03-19
申请号：JP2007226093
申请日：2007-08-31
申请人： Showa Denko Kk , 昭和電工株式会社
发明人： SHINOZAKI KENJI , GOMI HIDEJI , YOKOMIZO MASATAKA
IPC分类号： G02F1/13357 , F21V8/00 , F21Y101/02 , H01L33/58 , H01L33/60 , H01L33/62
CPC分类号： G02B6/0068 , G02B6/003 , G02B6/0083 , G02F1/133615 , H01L2224/48091 , H05K1/141 , H05K3/3442 , H05K3/366 , H05K2201/10106 , H01L2924/00014
摘要： PROBLEM TO BE SOLVED: To restrain luminous energy from getting uneven, when attaching a side face of plate-like substrate attached with a light emitting element, to a wiring board, so as to constitute a light source.
SOLUTION: This light emitting device 11a is provided with a light emitting part 31 constituted by arraying a plurality of light emitting modules 40 (40a-40i), and the one wiring board 32 for attaching the respective light emitting modules 40. Each of the light emitting modules 40 is provided with a mounting substrate, and three LEDs attached onto a surface of the mounting substrate. Each mounting substrate is erectedly attached to the wiring board 32.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了抑制光能不均匀，将安装有发光元件的板状基板的侧面安装到布线板上以构成光源。解决方案：该发光装置11a设置有通过排列多个发光模块40（40a-40i）而构成的发光部31，以及用于安装各个发光模块40的一个配线板32。的发光模块40设置有安装基板，并且三个LED附接到安装基板的表面上。每个安装基板竖立地连接到布线板32.版权所有（C）2009，JPO＆INPIT

14. 发明专利

JP4112498B2 Signal relay device 有权
公开(公告)号：JP4112498B2
公开(公告)日：2008-07-02
申请号：JP2003568732
申请日：2003-02-12
申请人：三菱電機株式会社
发明人：信二田邉
IPC分类号： H01P1/04 , H01P5/02 , H01P5/08 , H05K1/02 , H05K1/11 , H05K1/14 , H05K3/30 , H05K3/34 , H05K3/36 , H05K3/42
CPC分类号： H05K1/0251 , H01P5/02 , H05K1/0219 , H05K1/0222 , H05K1/115 , H05K1/14 , H05K3/308 , H05K3/3447 , H05K3/366 , H05K3/429 , H05K2201/09609 , H05K2201/09627 , H05K2201/10189

15. 发明专利

JP3848480B2 Mounting structure of a flexible printed circuit board and the recording and reproducing apparatus using the same 有权
公开(公告)号：JP3848480B2
公开(公告)日：2006-11-22
申请号：JP2974399
申请日：1999-02-08
申请人：アルプス電気株式会社
发明人：隆中井 , 耕治水田
IPC分类号： G11B33/12 , H05K1/14 , G11B5/48 , G11B5/60 , H05K1/11 , H05K3/36
CPC分类号： G11B5/486 , G11B5/4846 , H05K1/118 , H05K3/363 , H05K3/366 , H05K2201/048 , H05K2201/055

16. 发明专利

JP2006303255A Mounting structure of high-frequency apparatus 有权
标题翻译：高频装置安装结构
公开(公告)号：JP2006303255A
公开(公告)日：2006-11-02
申请号：JP2005124281
申请日：2005-04-21
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： INOUE DAISUKE , CHIBA SHIGETOMO , IIMURE SEI
IPC分类号： H05K9/00
CPC分类号： H05K1/0243 , H05K1/141 , H05K3/3447 , H05K3/366 , H05K3/368 , H05K2201/10371 , H05K2201/2036
摘要： PROBLEM TO BE SOLVED: To provide a high-frequency apparatus mounting structure which is excellent in performance and capable of preventing interfering radio waves from penetrating into a terminal.
SOLUTION: In the high-frequency apparatus mounting structure, an enclosed part K bearing against a mother board 7 and surrounded with an annular projection 2b which is provided on a cover 2, or an enclosed part K annularly surrounded with the extension 1f of a frame 1, and a projection 2b bearing against the mother board 7 and provided on the cover 2, is provided to the periphery of a terminal 6 connected to the mother board 7, and the terminal 6 is electrically shielded by the enclosed part K, so that interfering radio waves are prevented from penetrating into the terminal 6 by the enclosed part K when a high-frequency apparatus is mounted on the mother board 7, and the mounting structure is conducive to an improvement in the performance of the high-frequency apparatus.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种性能优异并且能够防止干扰无线电波渗入终端的高频装置安装结构。解决方案：在高频装置安装结构中，封闭的部件K与母板7相对并且被设置在盖子2上的环形突起2b或被延伸部1f环绕地包围的封闭部分K包围框架1和与主板7相对并设置在盖子2上的突起2b设置在连接到母板7的端子6的周围，并且端子6被封闭部分K电屏蔽，使得当在母板7上安装高频装置时，防止干扰无线电波通过封闭部分K渗透到端子6中，并且安装结构有利于高频率性能的提高仪器。版权所有（C）2007，JPO＆INPIT

17. 发明专利

JP3829381B2 camera 失效
公开(公告)号：JP3829381B2
公开(公告)日：2006-10-04
申请号：JP33944596
申请日：1996-12-19
申请人：株式会社ニコン
发明人：芳樹市川 , 勤若林
IPC分类号： G03B17/02 , H05K1/14 , H05K3/36
CPC分类号： H05K1/14 , H05K3/366

18. 发明专利

JP2005512481A Ballast control card 审中-公开
公开(公告)号：JP2005512481A
公开(公告)日：2005-04-28
申请号：JP2003550006
申请日：2002-12-03
申请人：インターナショナルレクティフィアーコーポレイション
发明人：ダナ・ウィルヘルム , デレク・ブラウン , トーマス・ジェイ・リバリック
IPC分类号： F21V23/00 , H05B41/02 , H05B41/24 , H05B41/282 , H05K1/14 , H05K3/36 , H02M7/48
CPC分类号： H05B41/02 , H05B41/2828 , H05K1/141 , H05K3/366 , H05K2201/10113
摘要：垂直にマザーボード（４０）上に搭載される貫通スロット（４２）のウエーブはんだ付け可能なドーターカード（２）上に与えられるバラスト制御部である。このバラストは、蛍光ランプ（４）を駆動し、カバー（６）が回路ボード（８）上に搭載される内蔵バラスト制御回路部品の上に与えられる。

19. 发明专利

JP3636564B2 Circuit board device and a method of manufacturing the same 失效
公开(公告)号：JP3636564B2
公开(公告)日：2005-04-06
申请号：JP5883297
申请日：1997-03-13
申请人：株式会社アイ・ライティング・システム
发明人：真上野
IPC分类号： H05K7/20 , H05K1/02 , H05K3/36
CPC分类号： H05K1/0201 , H05K3/366

20. 发明专利

JP3597202B2 Case for the circuit board 失效
公开(公告)号：JP3597202B2
公开(公告)日：2004-12-02
申请号：JP54407598
申请日：1998-04-09
申请人：テキサスインストルメンツインコーポレーテッド
发明人：アツシユダウン，グリン，ラツセル , バリー，ジヨン，ブレツト
IPC分类号： H05K7/18 , H05K3/30 , H05K3/36 , H05K7/14
CPC分类号： H05K7/1461 , H05K3/301 , H05K3/366

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