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    • 11. 发明专利
    • Film deposition method and film deposition apparatus of amorphous hard carbon film
    • 非晶硬碳膜薄膜沉积方法及薄膜沉积装置
    • JP2014034685A
    • 2014-02-24
    • JP2012174875
    • 2012-08-07
    • Denso Corp株式会社デンソー
    • ITOMURA DAISUKETERA AKINOSUKE
    • C23C16/27
    • C23C16/0272C23C16/26C23C16/515
    • PROBLEM TO BE SOLVED: To provide a film deposition method and film deposition apparatus of a DLC film that can stably form plasma in a state of high electric field intensity to generate high-density plasma.SOLUTION: A plasma treatment apparatus is equipped with a cylindrical electrode to regulate a treatment chamber and a bar-shaped electrode arranged near the center of the treatment chamber, in which the distance between the bar-shaped electrode and the cylindrical electrode is 1-10 mm. In the plasma treatment apparatus, a substrate is subjected to plasma nitriding treatment in the presence of argon gas, hydrogen gas and nitrogen gas for pretreatment, and then consecutively subjected to film deposition of a middle layer after the pretreatment, and further consecutively subjected to film deposition of an amorphous hard carbon film by plasma CVD treatment in the presence of a carbon supply source.
    • 要解决的问题:提供能够在高电场强度的状态下稳定地形成等离子体的DLC膜的成膜方法和成膜装置,以产生高密度等离子体。解决方案:等离子体处理装置配备有圆柱形 用于调节处理室的电极和布置在处理室中心附近的棒状电极,其中棒状电极和圆柱形电极之间的距离为1-10mm。 在等离子体处理装置中,在氩气,氢气和氮气的存在下对基板进行等离子体氮化处理,进行预处理,然后在预处理后连续地进行中间层的膜沉积,并且进一步连续地进行膜 在碳供应源的存在下通过等离子体CVD处理沉积无定形硬碳膜。
    • 19. 发明专利
    • Method for forming semiconductor film, and method for manufacturing photoelectric conversion device
    • 形成半导体膜的方法和制造光电转换装置的方法
    • JP2010262976A
    • 2010-11-18
    • JP2009110662
    • 2009-04-30
    • Sharp Corpシャープ株式会社
    • ISHIKAWA YASUAKIHONDA SHINYATOKAWA MAKOTO
    • H01L31/04
    • H01L31/204C23C16/22C23C16/515H01L31/1812Y02E10/50Y02P70/521
    • PROBLEM TO BE SOLVED: To provide a method for forming a semiconductor film suitable for a practical photoelectric conversion device having superior efficiency of photoelectric conversion, and also suitable for mass production and an increased substrate area, and to provide a method for manufacturing a photoelectric conversion device including the semiconductor film. SOLUTION: In the method for forming a film, a semiconductor film including an amorphous structure is manufactured by means of a plasma CVD method. The semiconductor film is an amorphous film comprising a SiGe compound or a microcrystal film comprising a SiGe compound. In the plasma CVD method, the band gap in the thickness direction of the semiconductor film is controlled by intermittently supplying power by changing an on-time or off-time of the power applied to generate plasma. The on-time and the off-time of the power is within a range in which a Duty ratio, i.e., on-time/(on-time+off-time)×100 (%), is ≥10% and ≤50%. COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种适用于具有优异的光电转换效率的实用的光电转换装置的半导体膜的形成方法,并且也适用于批量生产和增加的基板面积,并提供一种制造方法 包括半导体膜的光电转换装置。 解决方案:在形成膜的方法中,通过等离子体CVD法制造包括非晶结构的半导体膜。 半导体膜是包含SiGe化合物或包含SiGe化合物的微晶膜的非晶膜。 在等离子体CVD法中,半导体膜的厚度方向上的带隙通过间歇地供给功率而被控制,通过改变施加的功率的导通时间或关闭时间来产生等离子体。 功率的导通时间和关断时间在占空比(即准时/(on-time + off-time)×100(%))为≥10%且≤50的范围内 %。 版权所有(C)2011,JPO&INPIT