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12. 发明专利

JP4790832B2 Manufacturing method of the resin welding body 有权
公开(公告)号：JP4790832B2
公开(公告)日：2011-10-12
申请号：JP2009163784
申请日：2009-07-10
申请人：三菱電機株式会社
发明人：京史原 , 浩小林 , 公昭樽谷 , 晋助浅田 , 晴三藤本
IPC分类号： B29C65/16 , B29L22/00
CPC分类号： B29C65/1635 , B29C66/1122 , B29C66/1222 , B29C66/1224 , B29C66/24221 , B29C66/5346 , B29C66/55 , B29C66/73921 , B29C66/8322 , B29C66/836
摘要： PROBLEM TO BE SOLVED: To provide a method for manufacturing a resin welded body in which sinking amount of a joined part is highly precisely controlled, even without the need of highly precise control of a joining process or very highly precise dimensional control of a molten surface. SOLUTION: In a method for manufacturing a resin welded body: a first resin component 2 with absorbency to a laser beam 5 and a second resin component 3 with transmissibility to a laser beam are fitted; a laser beam is irradiated to a predetermined position from the second resin component side and simultaneously pressurizing power to mutually press the first and second resin components is impressed; and a circumference-shaped joined part 4 is formed between the first and second resin components by welding the both resin components; wherein, a projection 8 (stopper) is provided in either of the first or second resin component, which is formed inside the circumference-shaped joined part and abutted on the other resin component in the welding; the sinking amount of the joined part is controlled with the projection; and simultaneously the pressurizing power is impressed on a vertical axis of the projection, or a position inside thereof. COPYRIGHT: (C)2010,JPO&INPIT

13. 发明专利

JP2009166115A Semiconductor laser welding equipment 有权
标题翻译：半导体激光焊接设备
公开(公告)号：JP2009166115A
公开(公告)日：2009-07-30
申请号：JP2008010400
申请日：2008-01-21
申请人： Nippon Avionics Co Ltd , 日本アビオニクス株式会社
发明人： SHIGEMATSU TAKAHIDE
IPC分类号： B23K26/20 , B23K26/32 , H01S5/0683
CPC分类号： B29C65/1635 , B29C65/1687 , B29C66/112 , B29C66/114 , B29C66/5346 , B29C66/73921 , B29C66/91216 , B29C66/91221 , B29C66/9161 , B29C66/95 , B29C66/961
摘要： PROBLEM TO BE SOLVED: To provide a user-friendly laser welding equipment which is controlled in laser output on the basis of an external signal.
SOLUTION: The semiconductor laser welding equipment is equipped with an analog signal input section for determining a laser output, and superposes a light transmissive material, and a light absorptive material on one another in tight contact with each other, and irradiates the two materials with a laser beam from the light transmissive material side to weld both the materials. The equipment includes a transmittance measurement means for measuring light transmittance along the weld zone of the light transmissive material, an analog signal conversion means for converting the light transmittance obtained from the transmittance measurement means to the analog signal by prescribed procedures, and a memory means for receiving the analog signal from the analog signal conversion means, and memorizing a laser output profile of the welding step.
COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种基于外部信号在激光输出中控制的用户友好的激光焊接设备。
解决方案：半导体激光焊接设备配备有用于确定激光输出的模拟信号输入部分，并将透光材料和光吸收材料彼此紧密地相互叠置并照射两者具有来自透光材料侧的激光束的材料以焊接这两种材料。该设备包括用于测量沿着透光材料的焊接区的透光率的透射率测量装置，用于通过规定的程序将从透射率测量装置获得的光透射率转换为模拟信号的模拟信号转换装置，以及用于从模拟信号转换装置接收模拟信号，并存储焊接步骤的激光输出曲线。版权所有（C）2009，JPO＆INPIT

14. 发明专利

JP4294046B2 Centrifugal fan and a method of manufacturing the same 有权
公开(公告)号：JP4294046B2
公开(公告)日：2009-07-08
申请号：JP2006295570
申请日：2006-10-31
申请人：日本高分子株式会社
发明人：功小林 , 孝河合
IPC分类号： F04D29/28
CPC分类号： B29C65/08 , B29C65/607 , B29C66/124 , B29C66/30223 , B29C66/5344 , B29C66/5346 , B29C66/543 , B29C66/8322 , B29L2031/08

15. 发明专利

JP2008307839A Laser welding method 审中-公开
标题翻译：激光焊接方法
公开(公告)号：JP2008307839A
公开(公告)日：2008-12-25
申请号：JP2007159818
申请日：2007-06-18
申请人： Ito Yoshihiko , 伊藤仁彦
发明人： KATO MIKIHIKO
IPC分类号： B29C65/16
CPC分类号： B29C66/54 , B29C65/1635 , B29C65/1687 , B29C65/1696 , B29C66/1122 , B29C66/5346 , B29C66/73921 , B29C66/80 , B29C66/81267 , B29C66/81431
摘要： PROBLEM TO BE SOLVED: To sharply reduce the labor of work and to improve work efficiency for developing non-welding portions between mutual resin materials to join together and, at the same time, to promote welding by condensing laser beams to welding portions. SOLUTION: A condensing guide 6, which is made of material permeable with respect to laser beam 1 and has the under surface tapered recesses 5 in the bottom face, is employed. Under the state that the tapered recesses 5 are positioned to the non-welding portions 4, the condensing guide 6 is put on the top surface of a resin material 2 permeable with respect to the laser beam 1. Under the state, the resin material 2 is irradiated with the laser beam from side permeable with respect to the laser beam 1. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：为了大幅度减少作业的劳动，提高相互树脂材料之间的非焊接部分的接合加工的工作效率，同时通过将激光束聚焦到焊接部分来促进焊接。解决方案：使用由相对于激光束1可渗透的材料制成并且在底面具有下表面锥形凹部5的冷凝引导件6。在锥形凹部5位于非焊接部4的状态下，冷凝导向件6被放置在相对于激光束1可透过的树脂材料2的顶面上。在该状态下，树脂材料2 相对于激光束1从可透过的侧面照射激光束。版权所有（C）2009，JPO＆INPIT

16. 发明专利

JP2008544887A Ultrasonic assembly method 审中-公开
公开(公告)号：JP2008544887A
公开(公告)日：2008-12-11
申请号：JP2008519925
申请日：2006-07-03
申请人：ヨーロピアン・エアロノーティック・ディフェンス・アンド・スペース・カンパニー・イーズ・フランス
发明人：エリック・ソカール
IPC分类号： B29C65/08
CPC分类号： B29C66/836 , B29C65/08 , B29C65/16 , B29C65/1635 , B29C65/364 , B29C65/3676 , B29C65/7841 , B29C65/7894 , B29C66/112 , B29C66/131 , B29C66/232 , B29C66/244 , B29C66/30221 , B29C66/30223 , B29C66/41 , B29C66/4722 , B29C66/474 , B29C66/5346 , B29C66/71 , B29C66/721 , B29C66/7212 , B29C66/72141 , B29C66/723 , B29C66/73772 , B29C66/73774 , B29C66/73921 , B29C66/81469 , B29C66/8242 , B29C66/8362 , B29C66/8432 , B29C66/91411 , B29C66/9161 , B29C66/919 , B29C66/91931 , B29C66/9241 , B29C66/9261 , B29C66/934 , B29C66/9513 , B29C66/9516 , B29C66/96 , B29C66/962 , B29K2071/00 , B29K2079/085 , B29K2081/04 , B29K2101/12 , B29K2105/06 , B29K2307/00 , B29K2307/02 , B29K2309/08 , B29K2995/0027 , B29K2995/0039 , B29K2995/004 , B29L2009/00 , B29L2031/003 , B29L2031/3082 , Y10T428/24 , B29K2307/04
摘要：本発明は、熱可塑性材料ベースの少なくとも２つの剛直部材（１，２）を組み立てるためのの組立方法に関するものであって、この方法においては、少なくとも１つのインターフェース領域（４）を有するようにして、２つの部材（１，２）を重ね合わせ、ここで、一方の部材を、エネルギー局所化部材（５）を有したものとし；超音波源（１０）を励起し、ここで、超音波源（１０）を、インターフェース領域において２つの部材（１，２）に対して押圧力（Ｆ）を印加するものとし；超音波源（１０）を、インターフェース領域（４）のところにおいて連続的に移動させ、これにより、超音波源（１０）と対向した箇所（４．１）のところにおいて熱可塑性材料を融合させることによって、連続的な溶接ジョイント（６）を形成する。

17. 发明专利

JP2008518225A Fluid container consists of two plates 有权
公开(公告)号：JP2008518225A
公开(公告)日：2008-05-29
申请号：JP2007538553
申请日：2005-10-13
申请人：コーニンクレッカフィリップスエレクトロニクスエヌヴィ
发明人：ラインホルトウィムバーガー−フリードル , リーケリンクマリヌスベルナルドゥスオルデ , ウィッツクリスティアネデ , イールセルベルナルドゥスヤコブスヨハンネスファン , ヌネンバートファン , イーエイダヴリュヤンセン
IPC分类号： G01N35/08 , B01J19/00 , G01N37/00
CPC分类号： B01L3/502707 , B01L2200/0689 , B01L2200/12 , B01L2300/041 , B01L2300/0806 , B29C65/08 , B29C65/48 , B29C65/4825 , B29C65/4835 , B29C65/484 , B29C65/4845 , B29C65/485 , B29C65/521 , B29C65/526 , B29C65/548 , B29C66/112 , B29C66/114 , B29C66/5346 , B29C66/53461 , B29C66/54 , B29C66/7465 , B29L2031/756 , Y10T29/53
摘要： The invention relates to a miniaturized fluid container with microchannels (11, 12) which are bordered by ridges (13, 14), wherein the crests of the ridges (13, 14) are glued to a cover plate (20). Additional stability may be achieved by distributing glue (33) in cavities between the microchannels (11, 12), the spreading of said glue being driven by capillary forces.

18. 发明专利

JP2007261115A Laser welding apparatus 审中-公开
标题翻译：激光焊接设备
公开(公告)号：JP2007261115A
公开(公告)日：2007-10-11
申请号：JP2006089900
申请日：2006-03-29
申请人： Aisin Seiki Co Ltd , アイシン精機株式会社
发明人： YUSHIMO MASASHI
IPC分类号： B29C65/16 , B23K26/42
CPC分类号： B29C66/863 , B29C65/1635 , B29C65/1654 , B29C65/1687 , B29C66/112 , B29C66/1122 , B29C66/114 , B29C66/2442 , B29C66/41 , B29C66/5346 , B29C66/8242 , B29C66/8322 , B29C66/836
摘要： PROBLEM TO BE SOLVED: To provide a laser welding apparatus 1 capable of minimizing a gap formed between a pervious material 21 and an absorbing material 22.
SOLUTION: The laser welding apparatus 1 comprises an oscillator 3, a laser torch 5 projecting the laser emitted by the oscillator 3 to a workpiece 2, a base member 6 holding the workpiece 2 thereon, a pressure member 7 transferring the workpiece 2 to the base member 6 in the direction of pressing and having a strength for pressing the workpiece 2 while supporting the laser torch 5, the pressure member 7 being provided with a penetrated part 71 opening to the workpiece 2 side for rendering the workpiece 2 laser to irradiation by the laser torch 5.
COPYRIGHT: (C)2008,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够最小化透过材料21和吸收材料22之间形成的间隙的激光焊接装置1.解决方案：激光焊接装置1包括振荡器3，激光焊枪 5将由振荡器3发射的激光投射到工件2上，将工件2保持在其上的基座部件6，压力部件7，沿着压制方向将工件2传送到基部部件6，并具有用于按压工件的强度如图2所示，在支撑激光焊枪5的同时，压力部件7设置有通向工件2侧的穿透部分71，用于使工件2激光器被激光焊枪5照射。（C）2008，JPO＆INPIT

19. 发明专利

JP2007527505A Method for bonding a fine structured substrate 有权
公开(公告)号：JP2007527505A
公开(公告)日：2007-09-27
申请号：JP2006516348
申请日：2004-06-14
申请人：コミッサリヤアレネルジーアトミック , ビオメリューエスアー
发明人：シャルティエ，イザベル , プトー，パトリック , ボリー，セシル
IPC分类号： G01N35/08 , B01L3/00 , B29C65/52 , B81B1/00 , B81C3/00 , C12N15/09 , G01N37/00 , H01M8/02 , H01M8/04
CPC分类号： B01L3/502707 , B01L2200/12 , B01L2300/0816 , B01L2300/0887 , B29C65/4835 , B29C65/484 , B29C65/4845 , B29C65/485 , B29C65/526 , B29C66/026 , B29C66/028 , B29C66/112 , B29C66/1122 , B29C66/114 , B29C66/5346 , B29L2031/756 , B81B2201/058 , B81C3/001
摘要： A micro-structured substrate adhesive application procedure using a polymer or metal mesh screen through which an adhesive is applied by a scraper, is new. - An adhesive application procedure using a mesh screen (10) which is laid over the raised zones (6) of the substrate (2), and through which adhesive (12) is applied with the aid of a tool such as a scraper (16). This enables a film (20) of adhesive droplets to reach the raised zones without coating the cavities (8) between them when the screen is removed. A second substrate can then be applied to the first so that it sticks to the raised zones. The substrates are made of glass, silicon or polymer, and the cavities can be used to contain biological sensors.

20. 发明专利

JP3951332B2 Ultrasonic welding equipment 失效
公开(公告)号：JP3951332B2
公开(公告)日：2007-08-01
申请号：JP1152197
申请日：1997-01-24
申请人：ダイキン工業株式会社
发明人：栄一北野 , 拓川▲崎▼ , 敬久末岡
IPC分类号： B29C65/08 , B29C65/00 , B29C65/02 , B29L31/08
CPC分类号： B29C65/08 , B29C66/137 , B29C66/21 , B29C66/324 , B29C66/5346 , B29C66/61 , B29C66/73921 , B29C66/80 , B29C66/8161 , B29C66/8322

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