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    • 12. 发明专利
    • Imprint method and defect inspection method of template
    • 模糊方法和缺陷检测方法
    • JP2012243799A
    • 2012-12-10
    • JP2011109404
    • 2011-05-16
    • Toshiba Corp株式会社東芝
    • INENAMI RYOICHI
    • H01L21/027B29C33/70B29C59/02
    • PROBLEM TO BE SOLVED: To provide an imprint method capable of reliably performing an inspection of an imprinting template in a short time and improving the operation rate and the productivity of an imprint apparatus.SOLUTION: The imprint method determines application conditions of a resist material used in template inspection based on a piece of pattern data for manufacturing the template, and applies a resist material 11 over an inspection substrate 30 under the determined application conditions. After bringing a template 20 into contact with the resist material 11 to allow the resist material 11 to harden for a certain period, the template 20 is peeled off from the resist material 11. Thus, a resist pattern is formed on the inspection substrate 30. The resist pattern formed on the inspection substrate 30 is inspected to determine the acceptability of the template 20. A resist pattern is formed on a substrate to be processed using the template 20 determined as acceptable.
    • 要解决的问题:提供能够在短时间内可靠地执行对压印模板的检查并提高压印装置的操作率和生产率的压印方法。 解决方案:压印方法基于用于制造模板的图案数据确定在模板检查中使用的抗蚀剂材料的应用条件,并且在确定的应用条件下将抗蚀剂材料11涂覆在检查基板30上。 在使模板20与抗蚀剂材料11接触以使抗蚀剂材料11硬化一定时间后,将模板20从抗蚀剂材料11剥离。因此,在检查基板30上形成抗蚀剂图案。 检查形成在检查基板30上的抗蚀剂图案,以确定模板20的可接受性。使用确定为可接受的模板20在待处理的基板上形成抗蚀剂图案。 版权所有(C)2013,JPO&INPIT
    • 14. 发明专利
    • Imprint device
    • 印刷设备
    • JP2012049370A
    • 2012-03-08
    • JP2010190852
    • 2010-08-27
    • Toshiba Corp株式会社東芝
    • INENAMI RYOICHI
    • H01L21/027B29C59/02
    • G03F7/0002B82Y10/00B82Y40/00
    • PROBLEM TO BE SOLVED: To provide an imprint device that transfers a pattern with high accuracy and efficiency.SOLUTION: An imprint device for forming a resist pattern by curing a resist formed on a substrate to be transferred in the state in which a template having a shape of the pattern to be transferred to the substrate to be transferred is in touch with the resist formed on the substrate to be transferred comprises template holding means for holding a plurality of templates at desired intervals to form an array-like shape and position control means for individually controlling the template positions.
    • 要解决的问题:提供以高精度和高效率传送图案的压印装置。 解决方案:一种用于通过固化形成在要转移的基板上的抗蚀剂来形成抗蚀剂图案的印模装置,其中将具有要转印到待转印的基板的图案的形状的模板的模板与待转印的基板接触 形成在待转印的基板上的抗蚀剂包括用于以期望的间隔保持多个模板以形成阵列状的模板保持装置和用于单独控制模板位置的位置控制装置。 版权所有(C)2012,JPO&INPIT
    • 15. 发明专利
    • Imprint method, imprint device, and program
    • IMPRINT方法,IMPRINT DEVICE和PROGRAM
    • JP2011240662A
    • 2011-12-01
    • JP2010116546
    • 2010-05-20
    • Toshiba Corp株式会社東芝
    • KISHIMOTO MASAMICHIINENAMI RYOICHIKYO SUIGENTOKUE HIROSHI
    • B29C59/02B29C33/70H01L21/027
    • PROBLEM TO BE SOLVED: To provide a high productive imprint method for controlling an optimal yield ratio according to a type of defect when a defective template is produced, and to provide an imprint device and a program.SOLUTION: The imprint method performs multiple times: a step of transferring an indented pattern on an imprint material by bringing the indented pattern formed on the template into contact with the imprinted material on a substrate; and a step of imaging the indented pattern formed on the template after the transferring step, or the imprint material. Subsequently, the method determines the type of the defect of the template based on time course of change of multiple images obtained by the imaging steps over multiple times.
    • 要解决的问题:提供一种高生产率的压印方法,用于当产生缺陷模板时根据缺陷的类型来控制最佳屈服比,并提供压印装置和程序。 压印方法执行多次:通过使形成在模板上的缩进图案与基板上的印刷材料接触来将压痕图案转印到压印材料上的步骤; 以及在转印步骤之后,在模板上形成的缩进图案或压印材料成像步骤。 随后,该方法基于通过多次成像步骤获得的多个图像的改变的时间过程来确定模板的缺陷的类型。 版权所有(C)2012,JPO&INPIT
    • 16. 发明专利
    • Pattern forming device and pattern forming method
    • 图案形成装置和图案形成方法
    • JP2010283207A
    • 2010-12-16
    • JP2009136218
    • 2009-06-05
    • Toshiba Corp株式会社東芝
    • INENAMI RYOICHIARAKI SHUNJIKONO TAKUYA
    • H01L21/027B29C59/02
    • G03F7/0002B82Y10/00B82Y40/00G03F9/00
    • PROBLEM TO BE SOLVED: To form a pattern by imprinting without causing a decrease in throughput nor deterioration in alignment precision.
      SOLUTION: A pattern forming device includes a substrate holder 20 holding a substrate 60 to be processed, a template holder 10 holding a template 50 where a predetermined pattern is formed, a position measuring device 21 measuring the position of the substrate 60 to be processed which is held by the substrate holder 20, a position measuring device 12 measuring the position of the template 50 held by the template holder 10, and a controller 40 calculating displacement of the substrate 60 to be processed and the template 50, respectively, obtaining a relative displacement of the template 50 to the substrate 60 to be processed, and correcting a pattern transfer position using the relative displacement.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:通过压印形成图案,而不会导致生产量的降低或对准精度的劣化。 解决方案:图案形成装置包括保持要处理的基板60的基板保持件20,保持形成有预定图案的模板50的模板保持器10,测量基板60的位置的位置测量装置21 由基板保持器20保持的位置测量装置12,测量由模板保持器10保持的模板50的位置的位置测量装置12以及分别计算待处理的基板60和模板50的位移的控制器40, 获得模板50相对于要处理的基板60的相对位移,并且使用相对位移校正图案转印位置。 版权所有(C)2011,JPO&INPIT
    • 17. 发明专利
    • Template, method of manufacturing the same, and method of forming pattern
    • 模板,其制造方法和形成图案的方法
    • JP2010251601A
    • 2010-11-04
    • JP2009100937
    • 2009-04-17
    • Toshiba Corp株式会社東芝
    • YONEDA IKUOKONO TAKUYANAKASUGI TETSUOINENAMI RYOICHI
    • H01L21/027B29C33/38B29C59/02
    • G03F7/0002B82Y10/00B82Y40/00
    • PROBLEM TO BE SOLVED: To provide a template in which the gap region of a substrate to be processed can be covered with an imprint resist uniformly with good reproducibility, a method of manufacturing the same, and to provide a method of forming a pattern.
      SOLUTION: The method of manufacturing the template used in an optical imprint method includes: forming a pattern for imprinting in a pattern forming region 14 on a substrate 10; forming a resist film 11 in the pattern forming region 14; carrying out anisotropic etching using the resist film 11 as a mask to form a first step portion 13b and a first side portion 13a that connects the pattern forming region 14 and the first step portion 13b; forming a resist film 12 in the pattern forming region 14 and an outer peripheral portion 14b surrounding the pattern forming region 14 after removing the resist film 11; and carrying out wet etching using the resist film 12 as a mask to form a second step portion 13d and a curved second side portion 13c that connects the first step portion 13b and the second step portion 13d.
      COPYRIGHT: (C)2011,JPO&INPIT
    • 要解决的问题:提供一种模板,其中待加工的基板的间隙区域可以均匀地以良好的再现性被抗压印抗蚀剂覆盖,其制造方法和提供一种形成 模式。 解决方案:在光学压印方法中使用的模板的制造方法包括:在基板10上的图案形成区域14中形成用于压印的图案; 在图案形成区域14中形成抗蚀剂膜11; 使用抗蚀剂膜11作为掩模进行各向异性蚀刻,以形成连接图案形成区域14和第一台阶部分13b的第一台阶部分13b和第一侧面部分13a; 在除去抗蚀剂膜11之后,在图案形成区域14中形成抗蚀剂膜12和围绕图案形成区域14的外周部分14b; 并使用抗蚀剂膜12作为掩模进行湿式蚀刻,以形成连接第一台阶部分13b和第二台阶部分13d的第二台阶部分13d和弯曲的第二侧部分13c。 版权所有(C)2011,JPO&INPIT
    • 19. 发明专利
    • Method and device for liquid-immersion exposure
    • 用于液体暴露的方法和装置
    • JP2010003985A
    • 2010-01-07
    • JP2008163678
    • 2008-06-23
    • Toshiba Corp株式会社東芝
    • SATO TAKASHIINENAMI RYOICHIAZUMA TSUKASATOKI TATSUHIKO
    • H01L21/027G03F7/20
    • PROBLEM TO BE SOLVED: To provide a method for liquid-immersion exposure capable of diminishing thermal shrinkages of a wafer and a wafer stage, and a device thereof. SOLUTION: The method for liquid-immersion exposure is characterized in that an immersion liquid is filled between an objective material for exposure and a projection optical system placed to face the objective material for exposure to exposure the objective material for exposure, and when the objective material for exposure is exposed, a vapor pressure of the immersion liquid in the vicinity of the position where the immersion liquid is filled, is kept a specified value higher than a vapor pressure of the immersion liquid in an exposure environment. COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:提供一种能够减少晶片和晶片台的热收缩的液浸曝光方法及其装置。 解决方案:浸液曝光方法的特征在于,将浸没液体填充在用于曝光的物料和投影光学系统之间,以放置为面对目标材料曝光曝光的物体曝光,以及何时 暴露目标物质,浸渍液的填充位置附近的浸渍液的蒸汽压在曝光环境中保持比浸渍液的蒸汽压高的规定值。 版权所有(C)2010,JPO&INPIT
    • 20. 发明专利
    • Method for manufacturing semiconductor device
    • 制造半导体器件的方法
    • JP2009295919A
    • 2009-12-17
    • JP2008150627
    • 2008-06-09
    • Toshiba Corp株式会社東芝
    • INENAMI RYOICHIMIKAMI SHINJIINOUE HIROFUMI
    • H01L21/027
    • G03F7/0002B82Y10/00B82Y40/00G03F9/7076
    • PROBLEM TO BE SOLVED: To reduce an influence of a rounding error to be generated in imprint.
      SOLUTION: The method for manufacturing a semiconductor device includes: a design data preparation step of preparing design data for forming a plurality of patterns on a semiconductor substrate; a first pattern formation step of forming a first resist pattern on the semiconductor substrate to form a first pattern on the semiconductor substrate using the first resist pattern; and a second pattern formation step of forming a second resist pattern on the semiconductor substrate using an imprint device after the first pattern formation step to form a second pattern on the semiconductor substrate using the second pattern. In the first pattern formation step, the first pattern which is smaller than a design pattern corresponding to the design data is formed.
      COPYRIGHT: (C)2010,JPO&INPIT
    • 要解决的问题:减少在压印中产生的舍入误差的影响。 解决方案:半导体器件的制造方法包括:设计数据准备步骤,准备在半导体衬底上形成多个图案的设计数据; 第一图案形成步骤,在所述半导体衬底上形成第一抗蚀剂图案,以使用所述第一抗蚀图案在所述半导体衬底上形成第一图案; 以及第二图案形成步骤,在第一图案形成步骤之后,使用压印装置在半导体衬底上形成第二抗蚀剂图案,以使用第二图案在半导体衬底上形成第二图案。 在第一图案形成步骤中,形成小于与设计数据对应的设计图案的第一图案。 版权所有(C)2010,JPO&INPIT